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LM4865MDC

Texas Instruments

LM4865MDC by Texas Instruments

Texas Instruments' LM4865MDC is an audio control IC with a volume control circuit. It operates in industrial temperature range (-40 to 85°C) and supports supply voltage from 2.7V to 5.5V. Ideal for applications requiring surface mount package style, such as portable audio devices.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,463 parts In-Stock

1+ parts

-

100+ parts

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4,463

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Digiode

USA . 4,209 parts In-Stock

1+ parts

-

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-

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4,209

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Anansix

USA . 952 parts In-Stock

1+ parts

-

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952

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 409 parts In-Stock

1+ parts

$0.626

100+ parts

-

1k+ parts

$1.695

10k+ parts

-

409

$0.626

-

$1.695

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ChromeModa Solutions

Germany . 6,838 parts In-Stock

1+ parts

$0.703

100+ parts

$0.576

1k+ parts

-

10k+ parts

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6,838

$0.703

$0.576

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IDEA Electronic Components Group

UK . 630 parts In-Stock

1+ parts

$0.703

100+ parts

-

1k+ parts

$0.633

10k+ parts

-

630

$0.703

-

$0.633

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AZTECH Wire

Italy . 829 parts In-Stock

1+ parts

$14.281

100+ parts

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829

$14.281

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One Stop Electronics

USA . 1,568 parts In-Stock

1+ parts

$16.800

100+ parts

-

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1,568

$16.800

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Corphita

USA . 4,925 parts In-Stock

1+ parts

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4,925

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DigiPath Technology Company

USA . 1,271 parts In-Stock

1+ parts

-

100+ parts

$0.634

1k+ parts

-

10k+ parts

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1,271

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$0.634

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Overview

Upgrade your audio experience with the LM4865MDC by Texas Instruments. This volume control circuit offers unmatched quality and reliability, thanks to its industrial-grade construction and superior design. Perfect for a wide range of applications, from portable devices to home electronics, this surface-mount IC provides customers with unparalleled value, exceptional performance, and ease of use. Trust Texas Instruments to deliver cutting-edge technology that enhances your audio projects effortlessly.

Feature Benefit Bullets

Surface Mount: YES

Surface mount capability allows for easy and efficient integration into circuit boards, saving space and reducing assembly costs.

General IC Type: VOLUME CONTROL CIRCUIT

Specifically designed for volume control applications, ensuring optimal performance and accuracy in audio control.

Package Style (Meter): UNCASED CHIP

Uncased chip design provides flexibility in mounting options and allows for customizable packaging solutions.

Maximum Operating Temperature: 85 °C

High maximum operating temperature ensures reliability and durability in various environmental conditions.

Minimum Operating Temperature: -40 °C

Wide range of minimum operating temperature allows for use in extreme cold environments without compromising performance.

Terminal Position: UPPER

Upper terminal position facilitates easy connection and reduces the risk of short circuits or electrical interference.

Minimum Supply Voltage (Vsup): 2.7 V

Low minimum supply voltage requirement enables operation in low-power applications, increasing energy efficiency.

Temperature Grade: INDUSTRIAL

Industrial temperature grade ensures stability and performance in harsh industrial environments with fluctuating temperatures.

Terminal Form: NO LEAD

No lead terminal form simplifies assembly process and reduces the risk of lead contamination, making it environmentally friendly.

Maximum Supply Voltage (Vsup): 5.5 V

High maximum supply voltage capability provides flexibility in power source options and ensures compatibility with a wide range of systems.

Technical Specifications

Audio Control ICs LM4865MDC attributes and parameters. Explore more Audio Control ICs devices from Texas Instruments

Specs

General IC Type:

JESD-30 Code:

X-XUUC-N

No. of Channels:

1

No. of Functions:

1

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

DIE

Package Shape:

Package Style (Meter):

UNCASED CHIP

Qualification:

Not Qualified

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

2.7 V

Surface Mount:

YES

Temperature Grade:

Terminal Form:

Terminal Position:

UPPER

Trade Compliance

LM4865MDC General Purpose ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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