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TPA0222PWPRG4

Texas Instruments

TPA0222PWPRG4 by Texas Instruments

TPA0222PWPRG4 by Texas Instruments is an Audio Control IC with 2 channels, operating at -40 to 85°C. It features a Volume Control Circuit, CMOS technology, and requires a supply voltage of 4.5-5.5V. Ideal for industrial applications requiring precise audio volume control in compact designs.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 1,908 parts In-Stock

1+ parts

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1,908

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Digiode

USA . 1,718 parts In-Stock

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1,718

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 935 parts In-Stock

1+ parts

$1.344

100+ parts

$124.802

1k+ parts

$1.210

10k+ parts

-

935

$1.344

$124.802

$1.210

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DigiPath Technology Company

USA . 2,261 parts In-Stock

1+ parts

$1.480

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2,261

$1.480

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ChromeModa Solutions

Germany . 4,783 parts In-Stock

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$1.510

100+ parts

$1.238

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4,783

$1.510

$1.238

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IDEA Electronic Components Group

UK . 1,703 parts In-Stock

1+ parts

$1.510

100+ parts

-

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$1.359

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1,703

$1.510

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$1.359

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Advanced Electronics

New Zealand . 107 parts In-Stock

1+ parts

$4.372

100+ parts

$4.328

1k+ parts

$4.154

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107

$4.372

$4.328

$4.154

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AZTECH Wire

Italy . 694 parts In-Stock

1+ parts

$12.459

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694

$12.459

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One Stop Electronics

USA . 1,070 parts In-Stock

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$21.800

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1,070

$21.800

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Microchip USA

USA . 5,526 parts In-Stock

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5,526

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Corphita

USA . 3,567 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

USA . 2,927 parts In-Stock

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2,927

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Overview

Enhance your audio control experience with the TPA0222PWPRG4 by Texas Instruments. Crafted with precision and quality, this volume control circuit offers unmatched performance in a compact package. Ideal for a variety of applications in the audio industry, this IC boasts a wide operating temperature range and dual terminal position for versatile use. With Texas Instruments' reputation for excellence, you can trust that this product delivers reliable results every time. Elevate your sound system and enjoy the benefits of superior control and efficiency with the TPA0222PWPRG4.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material makes the package lightweight and durable, ensuring reliable performance of the audio control IC.

Surface Mount: YES

Surface mount capability makes it easy to integrate this audio control IC into various electronic devices, saving space and simplifying assembly.

General IC Type: VOLUME CONTROL CIRCUIT

Being a volume control circuit IC, it allows for precise and easy adjustment of audio output levels, enhancing user experience.

Power Supplies (V): 5

Operating at 5V, this audio control IC can be easily powered by common power sources, making it compatible with a wide range of devices.

Maximum Operating Temperature: 85 °C

With a maximum operating temperature of 85°C, this IC can withstand higher temperatures, ensuring reliable performance even in demanding conditions.

Minimum Operating Temperature: -40 °C

The wide temperature range from -40°C to 85°C allows this audio control IC to function effectively in various environments, making it versatile and suitable for different applications.

Terminal Finish: NICKEL PALLADIUM GOLD

The terminal finish of Nickel Palladium Gold ensures good conductivity and corrosion resistance, leading to reliable connections and long-term performance.

No. of Channels: 2

With 2 channels, this audio control IC can handle stereo audio signals effectively, providing a seamless audio experience with dual-channel output.

Technical Specifications

Audio Control ICs TPA0222PWPRG4 attributes and parameters. Explore more Audio Control ICs devices from Texas Instruments

Specs

General IC Type:

JESD-30 Code:

R-PDSO-G24

JESD-609 Code:

e4

Length:

7.8 mm

Moisture Sensitivity Level (MSL):

2

No. of Channels:

2

No. of Functions:

1

No. of Terminals:

24

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP24,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Sub-Category:

Audio/Video Amplifiers

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

4.4 mm

Trade Compliance

TPA0222PWPRG4 General Purpose ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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