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TDA7318D013TR

STMicroelectronics

TDA7318D013TR by STMicroelectronics

TDA7318D013TR by STMicroelectronics is a dual-channel tone control IC designed for audio applications. It features 103 dB channel separation, 0.09% harmonic distortion, and operates b/w -40 °C to 85°C. Ideal for industrial audio systems, it ensures high-quality sound performance.

Median Price

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Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Cyclops Electronics Ltd

UK . 6,995 parts In-Stock

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6,995

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Vyrian

USA . 5,180 parts In-Stock

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5,180

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Anansix

USA . 2,538 parts In-Stock

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2,538

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ACDS - Activité Composants Distribution Service

France . 2,000 parts In-Stock

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2,000

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ABC Electronics Ltd.

UK . 1,150 parts In-Stock

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1,150

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Bristol Electronics

USA . 515 parts In-Stock

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515

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Digiode

USA . 458 parts In-Stock

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458

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ComSIT Distribution GmbH

Germany . 23 parts In-Stock

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Distributors (Availability)

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IDEA Electronic Components Group

UK . 39 parts In-Stock

1+ parts

$3.608

100+ parts

-

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$3.247

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39

$3.608

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$3.247

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Microchip USA

USA . 110 parts In-Stock

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$5.001

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110

$5.001

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MKK Technologies

India . 288 parts In-Stock

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$6.785

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288

$6.785

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DigiPath Technology Company

USA . 288 parts In-Stock

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$6.785

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288

$6.785

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AZTECH Wire

Italy . 446 parts In-Stock

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$18.660

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446

$18.660

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A-Z Elektronik GmbH

Germany . 6,866 parts In-Stock

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6,866

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Corphita

USA . 2,720 parts In-Stock

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2,720

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Parana Technologies

USA . 2,065 parts In-Stock

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$4.314

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2,065

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$4.314

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Assy Fe

Spain . 2,000 parts In-Stock

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Overview

Unleash unparalleled audio quality with the TDA7318D013TR from STMicroelectronics, a leading name in innovation. This advanced audio control IC delivers exceptional tone control and minimal distortion, perfect for high-fidelity applications in consumer electronics and automotive systems. With robust performance even in extreme temperatures, it ensures reliability and longevity, making it an ideal choice for engineers seeking superior sound experiences and unmatched value. Transform your audio designs today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of durable plastic/epoxy enhances the longevity and reliability of the IC, making it suitable for various applications.

Surface Mount: YES

Surface mount technology allows for compact designs and easier integration into modern electronic circuits.

Package Shape: RECTANGULAR

The rectangular package shape optimizes space on the PCB, enabling efficient layout and component placement.

General IC Type: TONE CONTROL CIRCUIT

As a tone control circuit, it allows for customizable sound adjustments, enhancing audio quality for end users.

Channel Separation: 103 dB

Excellent channel separation provides high-quality audio performance, reducing crosstalk and improving sound clarity.

Harmonic Distortion: 0.09%

Low harmonic distortion ensures that the audio output remains true to the source, preserving sound fidelity.

No. of Terminals: 28

A high number of terminals allows for versatile connectivity options, accommodating various design requirements.

Package Style (Meter): SMALL OUTLINE

Small outline packages are space-efficient and suitable for compact electronic devices, making this IC ideal for modern applications.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, the IC can be used in demanding environments without failure.

No. of Bands: 2

Dual-band functionality provides flexibility in audio processing, allowing for richer and more controlled sound tuning.

Minimum Operating Temperature: -40 °C

The ability to operate at low temperatures makes this IC suitable for extreme conditions, expanding its application range.

Terminal Finish: NICKEL PALLADIUM GOLD

Premium terminal finishes improve solderability and enhance the durability of connections, which is crucial for high-performance applications.

Terminal Position: DUAL

Dual terminal position enhances layout flexibility, making it easier to integrate into various PCB designs.

Maximum Seated Height: 2.65 mm

Low profile design results in space-saving benefits on the PCB, ideal for compact electronic products.

Width: 7.5 mm

Compact width allows for efficient use of space within devices while maintaining high performance.

Minimum Supply Voltage (Vsup): 6 V

A minimum supply voltage of 6 V ensures compatibility with various power supply designs, enhancing versatility.

Length: 17.9 mm

A reasonable length caters to compact designs while ensuring robust performance in audio applications.

Temperature Grade: INDUSTRIAL

Industrial temperature grade indicates reliability in various environmental conditions, making it suitable for professional and industrial audio applications.

No. of Channels: 2

Dual-channel capability allows for stereo audio processing, enhancing the listening experience for users.

Technology: BICMOS

BICMOS technology combines the advantages of bipolar and CMOS transistors, offering improved performance and power efficiency.

Terminal Form: GULL WING

Gull wing terminals are easy to solder, facilitating reliable mounting on PCBs, which is important for mass production.

Maximum Supply Current: 11 mA

Low maximum supply current ensures energy efficiency, making this product suitable for battery-operated devices.

Terminal Pitch: 1.27 mm

A standard terminal pitch facilitates easy integration into typical PCB designs, promoting design efficiency across applications.

Maximum Supply Voltage (Vsup): 10 V

Supports a wide range of supply voltages, enhancing compatibility with different power supply systems.

Technical Specifications

Audio Control ICs TDA7318D013TR attributes and parameters. Explore more Audio Control ICs devices from STMicroelectronics

Specs

Channel Separation:

103 dB

General IC Type:

Harmonic Distortion:

.09 %

JESD-30 Code:

R-PDSO-G28

JESD-609 Code:

e4

Length:

17.9 mm

No. of Bands:

2

No. of Channels:

2

No. of Functions:

1

No. of Terminals:

28

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Qualification:

Not Qualified

Maximum Seated Height:

2.65 mm

Maximum Supply Current:

11 mA

Maximum Supply Voltage (Vsup):

10 V

Minimum Supply Voltage (Vsup):

6 V

Surface Mount:

YES

Technology:

BICMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width:

7.5 mm

Trade Compliance

TDA7318D013TR General Purpose ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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