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TDA7443D

STMicroelectronics

TDA7443D by STMicroelectronics

TDA7443D by STMicroelectronics is a versatile audio control IC featuring 90 dB channel separation and only 0.01% harmonic distortion. It operates within a supply voltage range of 5-10 V, making it ideal for high-quality audio applications. Its compact design ensures easy integration in various electronic devices.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,072 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

-

4,072

-

-

-

-

Anansix

USA . 2,888 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,888

-

-

-

-

Vyrian

USA . 2,510 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,510

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 1,718 parts In-Stock

1+ parts

$0.602

100+ parts

-

1k+ parts

$0.542

10k+ parts

-

1,718

$0.602

-

$0.542

-

MKK Technologies

India . 103 parts In-Stock

1+ parts

$1.131

100+ parts

-

1k+ parts

-

10k+ parts

-

103

$1.131

-

-

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DigiPath Technology Company

USA . 103 parts In-Stock

1+ parts

$1.131

100+ parts

-

1k+ parts

-

10k+ parts

-

103

$1.131

-

-

-

Corphita

USA . 2,310 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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2,310

-

-

-

-

Parana Technologies

USA . 803 parts In-Stock

1+ parts

-

100+ parts

$0.719

1k+ parts

-

10k+ parts

-

803

-

$0.719

-

-

Overview

Elevate your audio experience with the TDA7443D from STMicroelectronics, a trusted leader in innovative semiconductor solutions. This advanced audio control IC ensures pristine sound quality with remarkable channel separation and minimal distortion, making it ideal for premium applications in automotive, home audio systems, and portable devices. With its compact design and robust performance, the TDA7443D delivers unmatched value, enhancing every listening moment while simplifying integration into your projects.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy ensures durability and reliability, making the product ideal for various environmental conditions.

Surface Mount: YES

Surface mount technology allows for compact PCB designs, enabling efficient use of space and improved performance.

Package Shape: RECTANGULAR

A rectangular shape fits well in a variety of design layouts, providing versatility in circuit design.

General IC Type: TONE CONTROL CIRCUIT

Designed specifically for tone control, this IC enhances audio quality, making it suitable for audio applications.

Channel Separation: 90 dB

A high channel separation reduces crosstalk, ensuring clear and distinct audio channels for an enhanced listening experience.

Harmonic Distortion: 0.01 %

Low harmonic distortion guarantees high fidelity sound reproduction, making it an excellent choice for high-quality audio systems.

Power Supplies (V): 9

Compatible with standard 9V power supplies, this IC provides ease of integration into various audio systems.

No. of Terminals: 28

With 28 terminals, this IC offers versatility in connectivity options, facilitating diverse circuit designs.

Package Style (Meter): SMALL OUTLINE

The small outline package minimizes space requirements, making it suitable for compact electronic designs.

Maximum Operating Temperature: 85 °C

With a maximum operating temperature of 85 °C, this IC is suitable for use in warm environments and ensures reliable performance.

No. of Bands: 2

Having 2 bands allows for flexible tone adjustment, enhancing the audio customization capabilities for users.

Minimum Operating Temperature: -10 °C

The ability to operate at low temperatures increases the IC's range for applications in various climates.

Terminal Finish: NICKEL PALLADIUM GOLD

This finish provides excellent conductivity and corrosion resistance, ensuring reliable long-term performance.

Terminal Position: DUAL

Dual terminal positioning simplifies PCB layout and design, improving ease of integration into audio circuits.

Maximum Seated Height: 2.65 mm

A low seated height fits well in space-constrained designs, enhancing the versatility of the PCB layout.

Width: 7.5 mm

A compact width allows for multilayer PCB designs, optimizing layout efficiency in audio devices.

Minimum Supply Voltage (Vsup): 5 V

Operates at a minimum voltage of 5V, ensuring compatibility with a wide range of power sources.

Length: 17.9 mm

The carefully designed length enhances compatibility with standard PCB dimensions, aiding integration.

No. of Channels: 2

With 2 channels, it supports stereo audio applications, making it perfect for contemporary audio devices.

Technology: BICMOS

The BICMOS technology ensures low power consumption and high-speed performance, promoting energy efficiency.

Terminal Form: GULL WING

Gull wing terminals facilitate easier soldering and increased mechanical strength on the PCB.

Terminal Pitch: 1.27 mm

A 1.27 mm terminal pitch ensures compatibility with common PCB manufacturing processes, enhancing design flexibility.

Maximum Supply Voltage (Vsup): 10 V

Capable of operating up to 10V allows for flexibility in design and integration with various audio systems.

Technical Specifications

Audio Control ICs TDA7443D attributes and parameters. Explore more Audio Control ICs devices from STMicroelectronics

Specs

Channel Separation:

90 dB

General IC Type:

Harmonic Distortion:

.01 %

JESD-30 Code:

R-PDSO-G28

JESD-609 Code:

e4

Length:

17.9 mm

No. of Bands:

2

No. of Channels:

2

No. of Functions:

1

No. of Terminals:

28

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-10 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP28,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Power Supplies (V):

9

Qualification:

Not Qualified

Maximum Seated Height:

2.65 mm

Sub-Category:

Audio Control ICs

Maximum Supply Voltage (Vsup):

10 V

Minimum Supply Voltage (Vsup):

5 V

Surface Mount:

YES

Technology:

BICMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width:

7.5 mm

Trade Compliance

TDA7443D General Purpose ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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