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TPA3003D2PFBG4

Texas Instruments

TPA3003D2PFBG4 by Texas Instruments

TPA3003D2PFBG4 by Texas Instruments is an Audio Control IC with 2 channels, offering 77 dB channel separation and 10% harmonic distortion. Ideal for volume control circuits in industrial applications, it operates b/w -40 to 85°C with a supply voltage range of 8.5V to 14V.

Median Price

-

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,490 parts In-Stock

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7,490

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Digiode

USA . 1,248 parts In-Stock

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Connector Distribution Corp

USA . 250 parts In-Stock

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250

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Right Parts Inc.

USA . 250 parts In-Stock

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250

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Euro-Tech

UK . 201 parts In-Stock

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201

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Distributors (Availability)

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Parana Technologies

USA . 1,804 parts In-Stock

1+ parts

$0.326

100+ parts

-

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$1.557

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1,804

$0.326

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$1.557

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ChromeModa Solutions

Germany . 4,888 parts In-Stock

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$0.366

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$0.300

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4,888

$0.366

$0.300

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IDEA Electronic Components Group

UK . 555 parts In-Stock

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$0.366

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$0.329

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555

$0.366

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$0.329

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AZTECH Wire

Italy . 486 parts In-Stock

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$11.372

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486

$11.372

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One Stop Electronics

USA . 1,322 parts In-Stock

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$11.800

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$11.800

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A-Z Elektronik GmbH

Germany . 5,283 parts In-Stock

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Corphita

USA . 4,994 parts In-Stock

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4,994

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DigiPath Technology Company

USA . 1,034 parts In-Stock

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$0.330

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1,034

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$0.330

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Kepictronics

USA . 70 parts In-Stock

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70

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Overview

Upgrade your audio experience with the TPA3003D2PFBG4 by Texas Instruments. As a leading manufacturer in the industry, this Audio Control IC offers unparalleled quality and reliability. Perfect for applications in audio systems, this volume control circuit provides clear sound with minimal distortion. With a wide operating temperature range and low power consumption, this product delivers exceptional value for customers seeking high-performance audio solutions. Trust Texas Instruments to enhance your audio experience with the TPA3003D2PFBG4.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material used in the package body provides durability and protection for the internal components of the audio control IC.

Surface Mount: YES

The surface mount feature allows for easy and efficient integration of the audio control IC onto circuit boards, saving space and enabling mass production.

Channel Separation: 77 dB

High channel separation of 77 dB ensures clear and distinct audio signals for each channel, resulting in high-quality sound output.

Power Supplies (V): 12

Operating at 12V makes this audio control IC compatible with a wide range of audio systems and power sources.

Maximum Operating Temperature: 85 °C

With a maximum operating temperature of 85°C, this audio control IC can withstand high temperature environments, making it suitable for industrial applications.

No. of Channels: 2

Having 2 channels allows for stereo audio control, providing separate volume adjustments for left and right audio channels.

Technical Specifications

Audio Control ICs TPA3003D2PFBG4 attributes and parameters. Explore more Audio Control ICs devices from Texas Instruments

Specs

Channel Separation:

77 dB

General IC Type:

Harmonic Distortion:

10 %

JESD-30 Code:

S-PQFP-G48

JESD-609 Code:

e4

Length:

7 mm

Moisture Sensitivity Level (MSL):

2

No. of Bands:

1

No. of Channels:

2

No. of Functions:

1

No. of Terminals:

48

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TQFP48,.35SQ

Package Shape:

Package Style (Meter):

FLATPACK, THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

12

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Sub-Category:

Audio/Video Amplifiers

Maximum Supply Current:

28.5 mA

Maximum Supply Voltage (Vsup):

14 V

Minimum Supply Voltage (Vsup):

8.5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

7 mm

Trade Compliance

TPA3003D2PFBG4 General Purpose ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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