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TPA3002D2PHPG4

Texas Instruments

TPA3002D2PHPG4 by Texas Instruments

TPA3002D2PHPG4 by Texas Instruments is an Audio Control IC with 77 dB Channel Separation, 10% Harmonic Distortion, and 9W Nominal Output Power. It is used in industrial applications for volume control circuits requiring a supply voltage range of 8.5V to 14V and operating temperatures from -40°C to 85°C.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,731 parts In-Stock

1+ parts

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6,731

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Digiode

USA . 2,737 parts In-Stock

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2,737

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 1,974 parts In-Stock

1+ parts

$3.297

100+ parts

$306.218

1k+ parts

$2.968

10k+ parts

-

1,974

$3.297

$306.218

$2.968

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DigiPath Technology Company

USA . 1,312 parts In-Stock

1+ parts

$3.631

100+ parts

$3.340

1k+ parts

-

10k+ parts

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1,312

$3.631

$3.340

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ChromeModa Solutions

Germany . 3,911 parts In-Stock

1+ parts

$3.705

100+ parts

$3.038

1k+ parts

-

10k+ parts

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3,911

$3.705

$3.038

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IDEA Electronic Components Group

UK . 933 parts In-Stock

1+ parts

$3.705

100+ parts

-

1k+ parts

$3.334

10k+ parts

-

933

$3.705

-

$3.334

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AZTECH Wire

Italy . 568 parts In-Stock

1+ parts

$9.258

100+ parts

-

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568

$9.258

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One Stop Electronics

USA . 596 parts In-Stock

1+ parts

$10.800

100+ parts

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596

$10.800

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Microchip USA

USA . 989 parts In-Stock

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989

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Corphita

USA . 603 parts In-Stock

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603

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Overview

Experience high-quality audio control like never before with the TPA3002D2PHPG4 by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments delivers top-notch products that exceed expectations. The TPA3002D2PHPG4 falls under the category of Audio Control ICs and offers exceptional channel separation and low harmonic distortion. With a nominal output power of 9W, this volume control circuit provides clear and powerful sound for your audio applications. Trust Texas Instruments to bring you cutting-edge technology that enhances your listening experience. Elevate your audio projects with the TPA3002D2PHPG4 today.

Feature Benefit Bullets

Channel Separation: 77 dB

High channel separation ensures clear and distinct audio signals for each channel, providing a high-quality audio experience.

Harmonic Distortion: 10 %

Low harmonic distortion results in clean and faithful reproduction of audio signals, preserving the original sound quality.

Nominal Output Power: 9 W

With a nominal output power of 9W, this product can drive speakers effectively, producing loud and clear sound.

Temperature Grade: INDUSTRIAL

Designed to operate in industrial temperature ranges, making it suitable for a wide range of applications and environments.

Technology: CMOS

Utilizing CMOS technology provides low power consumption and high noise immunity, ensuring reliable performance and efficiency.

Technical Specifications

Audio Control ICs TPA3002D2PHPG4 attributes and parameters. Explore more Audio Control ICs devices from Texas Instruments

Specs

Channel Separation:

77 dB

General IC Type:

Harmonic Distortion:

10 %

JESD-30 Code:

S-PQFP-G48

JESD-609 Code:

e4

Length:

7 mm

Moisture Sensitivity Level (MSL):

4

Nominal Noise Figure:

96 dB

No. of Bands:

1

No. of Channels:

2

No. of Functions:

1

No. of Terminals:

48

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Nominal Output Power:

9 W

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TQFP48,.35SQ

Package Shape:

Package Style (Meter):

FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

12

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Sub-Category:

Audio/Video Amplifiers

Maximum Supply Current:

28.5 mA

Maximum Supply Voltage (Vsup):

14 V

Minimum Supply Voltage (Vsup):

8.5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

7 mm

Trade Compliance

TPA3002D2PHPG4 General Purpose ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.33.00.01

SB

8542.33.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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