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TPA3003D2PFBRG4

Texas Instruments

TPA3003D2PFBRG4 by Texas Instruments

TPA3003D2PFBRG4 by Texas Instruments is an Audio Control IC with 2 channels, offering 77 dB channel separation and 10% harmonic distortion. Ideal for volume control circuits in industrial applications, it operates b/w -40 to 85°C with a supply voltage range of 8.5-14V.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,398 parts In-Stock

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3,398

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Vyrian

USA . 3,267 parts In-Stock

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3,267

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Connector Distribution Corp

USA . 250 parts In-Stock

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250

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Right Parts Inc.

USA . 250 parts In-Stock

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250

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 116 parts In-Stock

1+ parts

$2.449

100+ parts

$227.453

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$2.204

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116

$2.449

$227.453

$2.204

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DigiPath Technology Company

USA . 2,317 parts In-Stock

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$2.697

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$2.697

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IDEA Electronic Components Group

UK . 1,360 parts In-Stock

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$2.752

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$2.477

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1,360

$2.752

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$2.477

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ChromeModa Solutions

Germany . 1,102 parts In-Stock

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$2.752

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$2.257

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1,102

$2.752

$2.257

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One Stop Electronics

USA . 1,092 parts In-Stock

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$3.800

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$3.800

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AZTECH Wire

Italy . 257 parts In-Stock

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$8.341

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257

$8.341

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Ampacity Inc.

Singapore . 399 parts In-Stock

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$11.800

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399

$11.800

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Component Stockers USA

USA . 208 parts In-Stock

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$99.990

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208

$99.990

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Corphita

USA . 4,697 parts In-Stock

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4,697

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Microchip USA

USA . 1,763 parts In-Stock

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Overview

Elevate your audio experience with the TPA3003D2PFBRG4 by Texas Instruments. Crafted with precision and expertise, Texas Instruments is a trusted name in the industry known for delivering high-quality products. The TPA3003D2PFBRG4 falls under the category of Audio Control ICs, offering superior sound quality and performance. With its innovative design and advanced technology, this product provides crystal clear sound, seamless volume control, and exceptional channel separation. Whether you're designing audio systems for automotive, consumer electronics, or industrial applications, the TPA3003D2PFBRG4 delivers unmatched value and reliability. Upgrade your audio solutions today with Texas Instruments.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the internal components, making the product long-lasting.

Surface Mount: YES

Allows for easy installation on circuit boards, saving time and effort during assembly.

Channel Separation: 77 dB

High channel separation ensures clear and distinct sound quality from each channel, enhancing the overall audio experience.

Harmonic Distortion: 10 %

Low harmonic distortion helps in delivering clean and accurate sound reproduction without unwanted noise or interference.

Power Supplies (V): 12

Operates efficiently on a standard 12V power supply, making it compatible with a wide range of audio equipment.

Package Style (Meter): FLATPACK, THIN PROFILE, FINE PITCH

Compact and slim design allows for easy integration into compact electronic devices with limited space.

Maximum Operating Temperature: 85 °C

Can withstand high operating temperatures, ensuring reliable performance even in demanding environments.

Minimum Operating Temperature: -40 °C

Capable of operating in extreme cold temperatures, making it suitable for a variety of applications.

No. of Terminals: 48

Offers a sufficient number of terminals for connectivity and interface options, providing versatility in the design and usage of the product.

Technology: CMOS

Utilizes CMOS technology for low power consumption and efficient operation, improving overall energy efficiency of the product.

Technical Specifications

Audio Control ICs TPA3003D2PFBRG4 attributes and parameters. Explore more Audio Control ICs devices from Texas Instruments

Specs

Channel Separation:

77 dB

General IC Type:

Harmonic Distortion:

10 %

JESD-30 Code:

S-PQFP-G48

JESD-609 Code:

e4

Length:

7 mm

Moisture Sensitivity Level (MSL):

2

No. of Bands:

1

No. of Channels:

2

No. of Functions:

1

No. of Terminals:

48

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TQFP48,.35SQ

Package Shape:

Package Style (Meter):

FLATPACK, THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

12

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Sub-Category:

Audio/Video Amplifiers

Maximum Supply Current:

28.5 mA

Maximum Supply Voltage (Vsup):

14 V

Minimum Supply Voltage (Vsup):

8.5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

7 mm

Trade Compliance

TPA3003D2PFBRG4 General Purpose ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.33.00.01

SB

8542.33.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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