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LM4875MM

Texas Instruments

LM4875MM by Texas Instruments

LM4875MM by Texas Instruments is an audio control IC with a volume control circuit. It operates on power supplies of 3-5V and has a max supply current of 7mA. This small outline, thin profile IC is ideal for industrial applications requiring precise volume control in compact spaces.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,450 parts In-Stock

1+ parts

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7,450

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Anansix

USA . 1,823 parts In-Stock

1+ parts

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1,823

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Digiode

USA . 1,091 parts In-Stock

1+ parts

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1,091

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 1,696 parts In-Stock

1+ parts

$1.473

100+ parts

-

1k+ parts

$2.153

10k+ parts

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1,696

$1.473

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$2.153

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DigiPath Technology Company

USA . 1,007 parts In-Stock

1+ parts

$1.622

100+ parts

$1.492

1k+ parts

-

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1,007

$1.622

$1.492

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ChromeModa Solutions

Germany . 6,356 parts In-Stock

1+ parts

$1.655

100+ parts

$1.357

1k+ parts

-

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6,356

$1.655

$1.357

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IDEA Electronic Components Group

UK . 229 parts In-Stock

1+ parts

$1.655

100+ parts

-

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$1.490

10k+ parts

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229

$1.655

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$1.490

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AZTECH Wire

Italy . 596 parts In-Stock

1+ parts

$10.748

100+ parts

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596

$10.748

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One Stop Electronics

USA . 354 parts In-Stock

1+ parts

$19.800

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354

$19.800

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Lixinc

USA . 10,289 parts In-Stock

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10,289

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Alle Elektronik GmbH

Germany . 3,931 parts In-Stock

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3,931

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Corphita

USA . 3,541 parts In-Stock

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3,541

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Kepictronics

USA . 50 parts In-Stock

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50

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Overview

Elevate your audio experience with the LM4875MM by Texas Instruments, a premium quality audio control IC designed to deliver unparalleled sound performance. Crafted with precision and expertise, this innovative product offers a wide range of applications in various industries. With its cutting-edge technology and reliable manufacturer backing, this volume control circuit guarantees optimal functionality and efficiency. Enhance your projects with the compact package style and superior power supplies, providing you with the ultimate audio solution. Trust Texas Instruments for industry-leading products that exceed expectations.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic material is lightweight and durable, making the product easy to handle and resistant to damage.

Surface Mount: YES

Surface mount technology allows for easy and compact installation on circuit boards, saving space and simplifying assembly.

General IC Type: VOLUME CONTROL CIRCUIT

Specifically designed for volume control, ensuring optimal performance and accuracy in adjusting audio levels.

Power Supplies (V): 3/5

Supports a range of power supply voltages, making it versatile and compatible with different systems.

No. of Terminals: 8

Having multiple terminals allows for more connectivity options and flexibility in circuit design.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, the product can withstand demanding environmental conditions.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature ensures reliable performance even in cold environments.

Terminal Finish: TIN LEAD

Tin lead finish provides good solderability and conductivity, ensuring secure and reliable connections.

Terminal Position: DUAL

Dual terminal position allows for increased connection options and versatility in circuit layout.

Width: 3 mm

Compact width makes the product suitable for space-constrained applications and easy integration into electronic devices.

Technical Specifications

Audio Control ICs LM4875MM attributes and parameters. Explore more Audio Control ICs devices from Texas Instruments

Specs

General IC Type:

JESD-30 Code:

S-PDSO-G8

JESD-609 Code:

e0

Length:

3 mm

Moisture Sensitivity Level (MSL):

1

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP8,.19

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

3/5

Qualification:

Not Qualified

Maximum Seated Height:

1.09 mm

Sub-Category:

Audio/Video Amplifiers

Maximum Supply Current:

7 mA

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

2.7 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Width:

3 mm

Trade Compliance

LM4875MM General Purpose ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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