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LM4832N

Texas Instruments

LM4832N by Texas Instruments

Texas Instruments' LM4832N is a 28-terminal audio control IC with 90 dB channel separation and 10% harmonic distortion. Ideal for tone control circuits, it operates b/w -40 to 85°C, with a supply voltage range of 4.5-5.5V. Its compact rectangular package makes it suitable for industrial applications requiring precise audio adjustments.

Median Price

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Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

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Vyrian

USA . 6,616 parts In-Stock

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Digiode

USA . 4,766 parts In-Stock

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Anansix

USA . 1,459 parts In-Stock

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A&K Electronics

USA . 155 parts In-Stock

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Rotakorn

Sweden . 155 parts In-Stock

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Bristol Electronics

USA . 155 parts In-Stock

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Fibra_Brandt Electronic GMBH

Germany . 4 parts In-Stock

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Parana Technologies

USA . 1,004 parts In-Stock

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$0.392

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$1.583

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1,004

$0.392

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$1.583

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ChromeModa Solutions

Germany . 5,452 parts In-Stock

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$0.441

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$0.362

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$0.441

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IDEA Electronic Components Group

UK . 2,168 parts In-Stock

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$0.441

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$0.397

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One Stop Electronics

USA . 1,133 parts In-Stock

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$8.800

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AZTECH Wire

Italy . 895 parts In-Stock

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$18.721

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Ampacity Inc.

Singapore . 155 parts In-Stock

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$19.800

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Authorized Procurement Solutions

USA . 9,000 parts In-Stock

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Corphita

USA . 5,170 parts In-Stock

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Kepictronics

USA . 4,875 parts In-Stock

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Alle Elektronik GmbH

Germany . 3,952 parts In-Stock

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DigiPath Technology Company

USA . 1,064 parts In-Stock

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$0.398

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$0.398

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Infinite Electronics LLP (Excess)

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783

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Overview

Enhance your audio experience with the LM4832N by Texas Instruments, a high-quality audio control IC that offers superior performance and reliability. Designed for tone control circuits, this product boasts a 90 dB channel separation and low 10% harmonic distortion, ensuring crystal clear sound. With a compact rectangular package style and dual terminals, the LM4832N is versatile and easy to integrate into various applications. Whether you're looking to upgrade your home entertainment system or enhance your car audio setup, this innovative IC will deliver exceptional quality and value to meet your audio needs. Trust in Texas Instruments for cutting-edge technology and top-notch products that exceed expectations.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and helps protect the internal components of the IC, ensuring longevity and reliability.

Channel Separation: 90 dB

High channel separation ensures that each channel of audio remains distinct and clear, leading to a superior audio experience with minimal interference.

Harmonic Distortion: 10 %

Low harmonic distortion means that the audio output is faithful to the original signal, providing high-quality sound reproduction.

Maximum Operating Temperature: 85 °C

The wide operating temperature range allows for reliable performance in various environmental conditions, making it suitable for industrial applications.

Minimum Operating Temperature: -40 °C

The ability to operate at low temperatures makes this IC suitable for use in cold environments or applications that require extended temperature ranges.

Maximum Supply Voltage (Vsup): 5.5 V

The high maximum supply voltage ensures compatibility with a wide range of power sources, offering flexibility in system design.

Technical Specifications

Audio Control ICs LM4832N attributes and parameters. Explore more Audio Control ICs devices from Texas Instruments

Specs

Additional Features:

MICROPHONE PREAMPLIFIER STAGE IS ALSO AVAILABLE

Channel Separation:

90 dB

General IC Type:

Harmonic Distortion:

10 %

JESD-30 Code:

R-PDIP-T28

JESD-609 Code:

e0

Length:

35.725 mm

Moisture Sensitivity Level (MSL):

1

No. of Bands:

2

No. of Channels:

2

No. of Functions:

1

No. of Terminals:

28

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP28,.6

Package Shape:

Package Style (Meter):

IN-LINE

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Maximum Seated Height:

5.334 mm

Sub-Category:

Audio/Video Amplifiers

Maximum Supply Current:

21 mA

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Tin/Lead (Sn85Pb15)

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

40

Width:

15.24 mm

Trade Compliance

LM4832N General Purpose ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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