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TDA7342

STMicroelectronics

TDA7342 by STMicroelectronics

TDA7342 by STMicroelectronics is a BICMOS audio control IC with 100 dB channel separation and 0.01% harmonic distortion. It features tone control circuitry, operates on 9V power supply, and has 32 terminals in a square package. Ideal for industrial applications requiring precise audio adjustments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Anansix

USA . 2,242 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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2,242

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Vyrian

USA . 2,114 parts In-Stock

1+ parts

-

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1k+ parts

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2,114

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Digiode

USA . 1,562 parts In-Stock

1+ parts

-

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1,562

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 2,265 parts In-Stock

1+ parts

$0.981

100+ parts

-

1k+ parts

$0.883

10k+ parts

-

2,265

$0.981

-

$0.883

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MKK Technologies

India . 1,657 parts In-Stock

1+ parts

$1.844

100+ parts

-

1k+ parts

-

10k+ parts

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1,657

$1.844

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DigiPath Technology Company

USA . 1,657 parts In-Stock

1+ parts

$1.844

100+ parts

-

1k+ parts

-

10k+ parts

-

1,657

$1.844

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-

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A-Z Elektronik GmbH

Germany . 7,115 parts In-Stock

1+ parts

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7,115

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Corphita

USA . 1,755 parts In-Stock

1+ parts

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1,755

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Parana Technologies

USA . 1,283 parts In-Stock

1+ parts

-

100+ parts

$1.173

1k+ parts

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1,283

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$1.173

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Assy Fe

Spain . 1,000 parts In-Stock

1+ parts

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1,000

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Overview

Elevate your audio experience with the TDA7342 by STMicroelectronics, a top-of-the-line Audio Control IC that guarantees unparalleled sound quality and precision. Crafted by a trusted manufacturer known for innovative technology, this tone control circuit offers crystal-clear channel separation and minimal harmonic distortion. Perfect for a wide range of applications, from home entertainment systems to automotive audio, this compact and efficient IC delivers exceptional performance with a low profile package design. Upgrade your audio setup today with the TDA7342 and enjoy the ultimate listening experience like never before.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material used for the package body provides durability and protection for the internal components, making the product long-lasting.

Surface Mount: YES

Being surface mountable makes installation easier and more flexible, especially in compact electronic devices.

Package Shape: SQUARE

The square package shape allows for efficient use of space and easy integration into circuit designs.

Channel Separation: 100 dB

High channel separation ensures clear and distinct audio output, enhancing the overall sound quality.

Harmonic Distortion: 0.01%

Low harmonic distortion results in cleaner, more accurate sound reproduction without unwanted noise or interference.

Power Supplies (V): 9

Operating at a voltage of 9V provides sufficient power for optimal performance without exceeding the maximum supply voltage.

No. of Terminals: 32

Having 32 terminals allows for connectivity with multiple external components, increasing the versatility of the product.

Package Style (Meter): FLATPACK, LOW PROFILE

The flatpack, low profile package style offers a compact and space-saving design, ideal for use in slim electronic devices.

Maximum Operating Temperature: 85 °C

With a maximum operating temperature of 85 °C, the product can withstand high temperatures and operate reliably in various environments.

No. of Bands: 2

Having 2 bands allows for customizable tone control settings, giving users the flexibility to adjust the audio output to their preference.

Minimum Operating Temperature: -40 °C

The product can function reliably in extreme cold environments, ensuring consistent performance in a wide range of conditions.

Terminal Finish: NICKEL PALLADIUM GOLD

The nickel palladium gold finish on the terminals provides corrosion resistance and reliable electrical connections for long-term use.

No. of Channels: 2

Operating with 2 channels allows for stereo sound output, delivering a more immersive audio experience.

Technology: BICMOS

Utilizing BICMOS technology combines the benefits of both bipolar and CMOS technologies, offering high-speed operation and low power consumption.

Technical Specifications

Audio Control ICs TDA7342 attributes and parameters. Explore more Audio Control ICs devices from STMicroelectronics

Specs

Channel Separation:

100 dB

General IC Type:

Harmonic Distortion:

.01 %

JESD-30 Code:

S-PQFP-G32

JESD-609 Code:

e4

Length:

7 mm

No. of Bands:

2

No. of Channels:

2

No. of Functions:

1

No. of Terminals:

32

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP32,.35SQ,32

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE

Power Supplies (V):

9

Qualification:

Not Qualified

Maximum Seated Height:

1.6 mm

Sub-Category:

Audio Control ICs

Maximum Supply Current:

15 mA

Maximum Supply Voltage (Vsup):

10.2 V

Minimum Supply Voltage (Vsup):

6 V

Surface Mount:

YES

Technology:

BICMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

QUAD

Width:

7 mm

Trade Compliance

TDA7342 General Purpose ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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