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TS4851IJT

STMicroelectronics

TS4851IJT by STMicroelectronics

TS4851IJT by STMicroelectronics is a compact audio control IC designed for volume control applications. It operates within a supply voltage range of 3-5.5V, features low harmonic distortion at 1%, and supports industrial temperature grades from -40 °C to 85 °C. Its thin profile and surface mount design make it ideal for space-constrained devices.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,869 parts In-Stock

1+ parts

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1k+ parts

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2,869

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Vyrian

USA . 1,985 parts In-Stock

1+ parts

-

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1,985

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Anansix

USA . 132 parts In-Stock

1+ parts

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132

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 241 parts In-Stock

1+ parts

$3.365

100+ parts

-

1k+ parts

$3.029

10k+ parts

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241

$3.365

-

$3.029

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MKK Technologies

India . 439 parts In-Stock

1+ parts

$6.328

100+ parts

-

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439

$6.328

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DigiPath Technology Company

USA . 439 parts In-Stock

1+ parts

$6.328

100+ parts

-

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439

$6.328

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Kepictronics

USA . 4,773 parts In-Stock

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4,773

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Corphita

USA . 2,124 parts In-Stock

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2,124

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Parana Technologies

USA . 1,487 parts In-Stock

1+ parts

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100+ parts

$4.024

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1,487

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$4.024

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Overview

Elevate your audio projects with the TS4851IJT from STMicroelectronics—a leading name in innovation and quality. This high-performance volume control IC seamlessly blends reliability with advanced features, ideal for a range of applications from consumer electronics to industrial systems. Enjoy crystal-clear sound with minimal distortion while benefiting from its compact design and robust thermal performance. Make the smart choice and enhance your designs today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy ensures durability and protects the internal components from environmental factors, making this product reliable for long-term use.

Surface Mount: YES

Surface mount technology allows for smaller board space usage, facilitating the design of compact electronic devices.

Package Shape: RECTANGULAR

A rectangular shape optimizes the footprint on PCBs, allowing for efficient placement relative to other components.

General IC Type: VOLUME CONTROL CIRCUIT

Designed specifically for volume control, it provides high-performance audio management, enhancing user experience in various audio applications.

Harmonic Distortion: 1 %

A low harmonic distortion rate ensures high audio fidelity, making it ideal for applications where sound quality is paramount.

Power Supplies (V): 3.3/5

Versatile voltage compatibility enables it to work with various system power supplies, making integration into existing designs easier.

No. of Terminals: 18

The number of terminals allows for flexible connections and advanced functionalities, catering to sophisticated audio requirements.

Package Style (Meter): GRID ARRAY, VERY THIN PROFILE, FINE PITCH

This package style supports high-density applications, saving space in compact designs while ensuring solid electrical performance.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, it is suitable for use in various environments, enhancing robustness and longevity.

Minimum Operating Temperature: -40 °C

The capability to function in low temperatures makes this IC suitable for industrial and outdoor applications.

Terminal Finish: TIN LEAD

Tin-lead finish ensures good solderability and reliability, making the assembly process easier and more efficient.

Terminal Position: BOTTOM

Bottom-terminal positioning aids in surface mounting capabilities, essential for modern PCB designs.

Maximum Seated Height: 0.63 mm

A low seated height allows for a thinner design profile, making it suitable for ultra-slim devices.

Width: 2.17 mm

Narrow width is advantageous for compact installations, allowing for efficient use of space on a circuit board.

Minimum Supply Voltage (Vsup): 3 V

Ability to operate at a low voltage enhances power efficiency, making it eco-friendly and suitable for battery-operated devices.

Length: 2.44 mm

Compact length contributes to space-saving designs, facilitating integration into various electronic applications.

Temperature Grade: INDUSTRIAL

With an industrial temperature grade, this IC is engineered for greater reliability and performance in harsh conditions.

No. of Channels: 2

Support for two channels allows for stereo audio control, enhancing the versatility in audio applications.

Terminal Form: BALL

Ball terminal form aids in proper soldering to PCBs, ensuring solid electrical connections and enhancing reliability.

Maximum Supply Current: 10 mA

A low supply current is beneficial for power consumption, making it ideal for low-power audio applications.

Terminal Pitch: 0.5 mm

Fine pitch allows for high-density layouts on PCBs, catering to complex designs and smaller device formats.

Maximum Supply Voltage (Vsup): 5.5 V

Support for a higher maximum supply voltage provides flexibility in system design, accommodating various audio system requirements.

Technical Specifications

Audio Control ICs TS4851IJT attributes and parameters. Explore more Audio Control ICs devices from STMicroelectronics

Specs

General IC Type:

Harmonic Distortion:

1 %

JESD-30 Code:

R-PBGA-B18

JESD-609 Code:

e0

Length:

2.44 mm

No. of Channels:

2

No. of Functions:

1

No. of Terminals:

18

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

FLIP CHIP

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Power Supplies (V):

3.3/5

Qualification:

Not Qualified

Maximum Seated Height:

.63 mm

Sub-Category:

Audio/Video Amplifiers

Maximum Supply Current:

10 mA

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

3 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

BOTTOM

Width:

2.17 mm

Trade Compliance

TS4851IJT General Purpose ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

Category top products 20

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