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TS4855IJT

STMicroelectronics

TS4855IJT by STMicroelectronics

TS4855IJT by STMicroelectronics is a volume control circuit designed for audio applications, operating b/w 3-5V. It features an industrial temperature range of -40 °C to 85 °C and comes in a very thin rectangular grid array package with 18 terminals. Ideal for compact designs, it ensures efficient audio management in various devices.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,362 parts In-Stock

1+ parts

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4,362

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Vyrian

USA . 1,732 parts In-Stock

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1,732

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Anansix

USA . 992 parts In-Stock

1+ parts

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992

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 45 parts In-Stock

1+ parts

$2.826

100+ parts

-

1k+ parts

$2.544

10k+ parts

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45

$2.826

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$2.544

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MKK Technologies

India . 2,177 parts In-Stock

1+ parts

$5.315

100+ parts

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2,177

$5.315

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DigiPath Technology Company

USA . 2,177 parts In-Stock

1+ parts

$5.315

100+ parts

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2,177

$5.315

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A-Z Elektronik GmbH

Germany . 5,574 parts In-Stock

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5,574

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Parana Technologies

USA . 2,098 parts In-Stock

1+ parts

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100+ parts

$3.379

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2,098

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$3.379

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Kepictronics

USA . 1,548 parts In-Stock

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1,548

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Corphita

USA . 212 parts In-Stock

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212

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Overview

Elevate your audio experience with the TS4855IJT from STMicroelectronics, a leader in innovative electronic solutions. This high-quality volume control IC is designed for versatility and reliability, excelling in everything from consumer electronics to industrial applications. With its compact footprint and robust operating temperature range, the TS4855IJT ensures seamless performance in any environment, delivering unmatched value that enhances sound quality while simplifying your design process. Make the smart choice for your next project!

Feature Benefit Bullets

Surface Mount: YES

This surface mount capability allows for easier integration into compact and modern PCB designs, making it suitable for various applications.

Package Shape: RECTANGULAR

The rectangular package shape optimizes space on the circuit board, beneficial for efficient layout and design.

General IC Type: VOLUME CONTROL CIRCUIT

Designed specifically for audio applications, this IC ensures precise volume control, enhancing user experience in audio devices.

Power Supplies (V): 3/5

With a power supply range of 3 to 5V, it offers flexibility for use in a variety of electronic devices and systems.

No. of Terminals: 18

The 18 terminals provide ample connectivity options for integrating with other components, making it versatile for different audio applications.

Package Style (Meter): GRID ARRAY, VERY THIN PROFILE, INTERSTITIAL PITCH

The thin profile and grid array design facilitate high-density circuit layouts, optimizing space and improving overall product performance.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, this IC is reliable for use in demanding and high-temperature environments.

Minimum Operating Temperature: -40 °C

The ability to operate in extreme cold conditions makes it suitable for industrial and outdoor applications where temperature varies significantly.

Terminal Finish: TIN LEAD

The tin-lead terminal finish ensures reliable soldering and good electrical connection during assembly.

Terminal Position: BOTTOM

Bottom terminal positioning is advantageous for reducing footprint and facilitating easier mounting on PCBs.

Maximum Seated Height: 0.63 mm

A low seated height supports a compact design, which is critical in miniature electronic products.

Width: 2.17 mm

This narrow width allows for more flexible placement on crowded circuit boards, optimizing space usage.

Minimum Supply Voltage (Vsup): 3 V

The minimum supply voltage of 3V allows for power-efficient operation in battery-powered devices.

Length: 2.44 mm

The compact length enhances compatibility with compact circuitry, making it advantageous for space-constrained designs.

Temperature Grade: INDUSTRIAL

An industrial temperature grade indicates robustness and reliability, making it suitable for various applications, including commercial and industrial equipment.

Terminal Form: BALL

Ball terminals facilitate better thermal management, mechanical stability, and electrical performance.

Maximum Supply Current: 12 mA

Low maximum supply current ensures minimal power consumption, contributing to the energy efficiency of the device.

Terminal Pitch: 0.866 mm

The 0.866 mm pitch allows for easier placement and routing on PCBs, enhancing design convenience.

Maximum Supply Voltage (Vsup): 5 V

The flexibility to operate at a maximum voltage of 5V makes it versatile enough for various audio applications.

Technical Specifications

Audio Control ICs TS4855IJT attributes and parameters. Explore more Audio Control ICs devices from STMicroelectronics

Specs

General IC Type:

JESD-30 Code:

R-XBGA-B18

JESD-609 Code:

e0

Length:

2.44 mm

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

18

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

BGA18,4X5,20/17

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, INTERSTITIAL PITCH

Power Supplies (V):

3/5

Qualification:

Not Qualified

Maximum Seated Height:

.63 mm

Sub-Category:

Audio/Video Amplifiers

Maximum Supply Current:

12 mA

Maximum Supply Voltage (Vsup):

5 V

Minimum Supply Voltage (Vsup):

3 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

.866 mm

Terminal Position:

BOTTOM

Width:

2.17 mm

Trade Compliance

TS4855IJT General Purpose ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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