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E-TDA7348D

STMicroelectronics

E-TDA7348D by STMicroelectronics

E-TDA7348D by STMicroelectronics is a dual-channel tone control circuit with 100 dB channel separation and only 0.01% harmonic distortion. It operates b/w -40 °C to 85°C, making it ideal for industrial audio applications. This compact IC features a small outline package and supports supply voltages from 6V to 10.2V.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Anansix

USA . 1,761 parts In-Stock

1+ parts

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1,761

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Vyrian

USA . 1,613 parts In-Stock

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1,613

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Digiode

USA . 146 parts In-Stock

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146

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 2,155 parts In-Stock

1+ parts

$0.228

100+ parts

-

1k+ parts

$0.205

10k+ parts

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2,155

$0.228

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$0.205

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MKK Technologies

India . 136 parts In-Stock

1+ parts

$0.429

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136

$0.429

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DigiPath Technology Company

USA . 136 parts In-Stock

1+ parts

$0.429

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136

$0.429

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Native Components

USA . 794 parts In-Stock

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$5.840

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794

$5.840

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Corphita

USA . 3,174 parts In-Stock

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3,174

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Parana Technologies

USA . 2,149 parts In-Stock

1+ parts

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$0.273

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2,149

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$0.273

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Northwest PG Solutions

USA . 2,021 parts In-Stock

1+ parts

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$5.723

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2,021

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$5.723

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Overview

Elevate your audio experience with the E-TDA7348D from STMicroelectronics—a leader in innovation and quality. This advanced tone control circuit ensures pristine sound fidelity, boasting exceptional channel separation and minimal distortion. Perfect for consumer electronics and industrial applications alike, its compact design allows seamless integration, while ST's renowned reliability guarantees longevity. Unlock a world of superior sound today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package body material ensures durability and resistance to environmental stress, making the product suitable for various applications.

Surface Mount: YES

Surface mount capability enables easier and more efficient PCB assembly, reducing manufacturing costs and saving space on circuit boards.

Package Shape: RECTANGULAR

The rectangular package shape provides a compact footprint, allowing for efficient use of space in various electronic designs.

General IC Type: TONE CONTROL CIRCUIT

As a tone control circuit, this IC allows precise manipulation of audio frequencies, enhancing the sound quality of audio applications.

Channel Separation: 100 dB

High channel separation minimizes crosstalk, ensuring clean and distinct audio channels for premium sound fidelity.

Harmonic Distortion: 0.01 %

Low harmonic distortion signifies higher audio quality, making this IC a great choice for high-fidelity audio systems.

Power Supplies (V): 9

Operating at a standard power supply voltage makes integration into existing designs straightforward without the need for special adapters.

No. of Terminals: 28

A higher number of terminals enhances connectivity options, allowing for complex configurations and additional functionalities.

Package Style (Meter): SMALL OUTLINE

The small outline package style supports efficient use of space on PCBs, making it ideal for compact electronic devices.

Maximum Operating Temperature: 85 °C

Withstand high operating temperatures, this product is suitable for environments that experience significant heat, increasing reliability.

No. of Bands: 2

The ability to control two bands provides flexibility for audio tuning, making it adaptable for various audio applications.

Minimum Operating Temperature: -40 °C

A wide temperature range allows operation in extreme conditions, making this IC ideal for industrial and automotive applications.

Terminal Position: DUAL

Dual-terminal positioning enhances layout options on PCBs, facilitating better designs and overall integration.

Maximum Seated Height: 2.65 mm

A low seated height ensures compatibility with other components, ideal for slim device designs or high-density layouts.

Width: 7.5 mm

A compact width fits well in tight spaces, helping to streamline electronic designs without compromising performance.

Minimum Supply Voltage (Vsup): 6 V

A lower minimum supply voltage allows for greater flexibility in power supply design, accommodating a wider range of systems.

Length: 17.9 mm

A moderate length complements the compact design, making it suitable for various product layouts.

Temperature Grade: INDUSTRIAL

Designed for industrial applications, this IC is robust and reliable under challenging conditions, ensuring longevity.

No. of Channels: 2

Two-channel operation allows for stereo sound control, ideal for enhancing audio experiences in consumer electronics.

Technology: BICMOS

BICMOS technology combines the advantages of bipolar and CMOS, leading to lower power consumption and improved performance.

Terminal Form: GULL WING

Gull wing terminals provide enhanced soldering options, making the mounting process more reliable and effective.

Maximum Supply Current: 15 mA

A low maximum supply current leads to energy-efficient operation, ideal for battery-powered devices.

Terminal Pitch: 1.27 mm

A standard terminal pitch ensures compatibility with a variety of PCB layouts and designs, facilitating hassle-free integration.

Maximum Supply Voltage (Vsup): 10.2 V

A higher maximum supply voltage allows for versatile use in different systems, accommodating a range of operating conditions.

Technical Specifications

Audio Control ICs E-TDA7348D attributes and parameters. Explore more Audio Control ICs devices from STMicroelectronics

Specs

Channel Separation:

100 dB

General IC Type:

Harmonic Distortion:

.01 %

JESD-30 Code:

R-PDSO-G28

Length:

17.9 mm

No. of Bands:

2

No. of Channels:

2

No. of Functions:

1

No. of Terminals:

28

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP28,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

9

Qualification:

Not Qualified

Maximum Seated Height:

2.65 mm

Sub-Category:

Audio Control ICs

Maximum Supply Current:

15 mA

Maximum Supply Voltage (Vsup):

10.2 V

Minimum Supply Voltage (Vsup):

6 V

Surface Mount:

YES

Technology:

BICMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

7.5 mm

Trade Compliance

E-TDA7348D General Purpose ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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