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TDA7313NDTR

STMicroelectronics

TDA7313NDTR by STMicroelectronics

TDA7313NDTR by STMicroelectronics is a dual-channel tone control IC designed for audio applications. It features 103 dB channel separation, 0.09% harmonic distortion, and operates b/w -40 °C to 85°C. Ideal for enhancing sound quality in consumer electronics.

Median Price

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Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 4,476 parts In-Stock

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4,476

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Digiode

USA . 1,817 parts In-Stock

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1,817

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Bristol Electronics

USA . 1,623 parts In-Stock

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1,623

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Inventory MP

USA . 1,000 parts In-Stock

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1,000

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Anansix

USA . 906 parts In-Stock

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906

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Distributors (Availability)

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IDEA Electronic Components Group

UK . 2,010 parts In-Stock

1+ parts

$3.249

100+ parts

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$2.924

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2,010

$3.249

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$2.924

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MKK Technologies

India . 1,798 parts In-Stock

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$6.110

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1,798

$6.110

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DigiPath Technology Company

USA . 1,798 parts In-Stock

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$6.110

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1,798

$6.110

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A-Z Elektronik GmbH

Germany . 4,740 parts In-Stock

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4,740

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Corphita

USA . 2,795 parts In-Stock

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2,795

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Parana Technologies

USA . 1,378 parts In-Stock

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$3.885

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1,378

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$3.885

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Kepictronics

USA . 1,000 parts In-Stock

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1,000

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Overview

Elevate your audio experience with the TDA7313NDTR from STMicroelectronics, a leader in innovative technology. This high-performance audio control IC offers unparalleled sound quality and precise tone adjustment, making it ideal for both consumer and professional audio applications. Benefit from its exceptional channel separation and low distortion, ensuring crystal-clear playback. Trust in ST’s commitment to quality and reliability to transform your audio projects seamlessly!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy construction provides durability, suitable for a range of environmental conditions.

Surface Mount: YES

Surface mount capability allows for compact designs and efficient assembly in modern electronics.

Package Shape: RECTANGULAR

The rectangular shape optimizes space utilization on PCBs, which is essential for compact audio devices.

General IC Type: TONE CONTROL CIRCUIT

As a tone control circuit, it enables precise audio adjustments, ensuring high-quality sound performance.

Channel Separation: 103 dB

With excellent channel separation, this IC minimizes cross-talk, delivering clear and distinct audio channels.

Harmonic Distortion: 0.09%

Low harmonic distortion ensures that audio output maintains its integrity, producing cleaner sound quality.

No. of Terminals: 28

A higher number of terminals provides greater connectivity options, making it versatile for various audio applications.

Package Style (Meter): SMALL OUTLINE

The small outline package style conserves PCB space, making it ideal for compact electronic devices.

Maximum Operating Temperature: 85 °C

With a maximum operating temperature of 85 °C, this IC is suitable for high-temperature environments without compromising performance.

No. of Bands: 2

Having two bands allows for flexible and effective tone control, enhancing overall audio quality.

Minimum Operating Temperature: -40 °C

The wide operating temperature range of -40 °C makes this IC suitable for industrial applications and harsh environments.

Terminal Position: DUAL

Dual terminal positioning facilitates easier integration into various PCB layouts.

Maximum Seated Height: 2.65 mm

A low seated height enables compatibility with low-profile designs, maintaining a sleek appearance in audio equipment.

Width: 7.5 mm

Compact width allows for greater design flexibility in tight spaces on PCBs.

Minimum Supply Voltage (Vsup): 6 V

Low minimum supply voltage requirement increases compatibility with different power supply configurations.

Length: 17.9 mm

The manageable length makes it easy to fit into various circuit configurations, supporting diverse design practices.

Temperature Grade: INDUSTRIAL

Industrial temperature grading ensures reliability and durability in demanding applications.

No. of Channels: 2

With two channels, this product is ideal for stereo applications, enhancing the listening experience.

Technology: BICMOS

BICMOS technology combines the benefits of both bipolar and CMOS, providing high-speed performance and low power consumption.

Terminal Form: GULL WING

Gull wing terminal form provides strong mechanical stability and ease of soldering on PCBs.

Terminal Pitch: 1.27 mm

A 1.27 mm terminal pitch is compatible with standard PCB layouts, facilitating easy integration.

Maximum Supply Voltage (Vsup): 10 V

The maximum supply voltage allows for versatility in power supply designs, accommodating a range of applications.

Technical Specifications

Audio Control ICs TDA7313NDTR attributes and parameters. Explore more Audio Control ICs devices from STMicroelectronics

Specs

Channel Separation:

103 dB

General IC Type:

Harmonic Distortion:

.09 %

JESD-30 Code:

R-PDSO-G28

Length:

17.9 mm

No. of Bands:

2

No. of Channels:

2

No. of Functions:

1

No. of Terminals:

28

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Qualification:

Not Qualified

Maximum Seated Height:

2.65 mm

Maximum Supply Voltage (Vsup):

10 V

Minimum Supply Voltage (Vsup):

6 V

Surface Mount:

YES

Technology:

BICMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width:

7.5 mm

Trade Compliance

TDA7313NDTR General Purpose ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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