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TPA2008D2PWP

Texas Instruments

TPA2008D2PWP by Texas Instruments

TPA2008D2PWP by Texas Instruments is a 3W volume control circuit IC with 2 channels. It operates b/w -40 to 85°C, with harmonic distortion of 5%. Suitable for audio applications, it has a supply voltage range of 2.5-5.5V and low noise figure of 96dB.

Median Price

$2.005

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 16,059 parts In-Stock

1+ parts

$2.005

100+ parts

$1.656

1k+ parts

$0.895

10k+ parts

-

16,059

$2.005

$1.656

$0.895

-

Mouser Electronics

USA . 101 parts In-Stock

1+ parts

$2.380

100+ parts

$1.510

1k+ parts

$1.480

10k+ parts

$1.300

101

$2.380

$1.510

$1.480

$1.300

DigiKey

USA . 80 parts In-Stock

1+ parts

$2.380

100+ parts

$1.502

1k+ parts

-

10k+ parts

-

80

$2.380

$1.502

-

-

Chip1Stop

Japan . 180 parts In-Stock

1+ parts

-

100+ parts

$1.045

1k+ parts

-

10k+ parts

-

180

-

$1.045

-

-

Rochester

USA . 156 parts In-Stock

1+ parts

-

100+ parts

$1.520

1k+ parts

$1.260

10k+ parts

$1.120

156

-

$1.520

$1.260

$1.120

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,233 parts In-Stock

1+ parts

$1.178

100+ parts

-

1k+ parts

-

10k+ parts

-

4,233

$1.178

-

-

-

Vyrian

USA . 6,161 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

6,161

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 308 parts In-Stock

1+ parts

$0.613

100+ parts

$56.946

1k+ parts

$0.552

10k+ parts

-

308

$0.613

$56.946

$0.552

-

DigiPath Technology Company

USA . 849 parts In-Stock

1+ parts

$0.675

100+ parts

-

1k+ parts

-

10k+ parts

-

849

$0.675

-

-

-

ChromeModa Solutions

Germany . 4,658 parts In-Stock

1+ parts

$0.689

100+ parts

$0.565

1k+ parts

-

10k+ parts

-

4,658

$0.689

$0.565

-

-

IDEA Electronic Components Group

UK . 1,985 parts In-Stock

1+ parts

$0.689

100+ parts

-

1k+ parts

$0.620

10k+ parts

-

1,985

$0.689

-

$0.620

-

Corphita

USA . 82 parts In-Stock

1+ parts

$1.116

100+ parts

-

1k+ parts

-

10k+ parts

-

82

$1.116

-

-

-

Microchip USA

USA . 2,778 parts In-Stock

1+ parts

$17.360

100+ parts

$17.250

1k+ parts

$17.190

10k+ parts

$17.140

2,778

$17.360

$17.250

$17.190

$17.140

Lixinc

USA . 11,634 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

11,634

-

-

-

-

A-Z Elektronik GmbH

Germany . 5,672 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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5,672

-

-

-

-

Kepictronics

USA . 1,280 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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1,280

-

-

-

-

Overview

Elevate your audio experience with the TPA2008D2PWP by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments delivers top-notch quality and reliability. The TPA2008D2PWP falls under the category of Audio Control ICs, offering unparalleled performance and functionality. Whether you're designing portable speakers, headphones, or other audio devices, this volume control circuit provides 3W of power and minimal harmonic distortion. Trust in Texas Instruments to bring you cutting-edge technology that enhances your audio projects. Upgrade your sound system today with the TPA2008D2PWP.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material is lightweight and durable, making the product suitable for portable and rugged applications.

Surface Mount: YES

Surface mount design allows for easy and efficient PCB assembly, saving time and cost in production.

General IC Type: VOLUME CONTROL CIRCUIT

Specifically designed for volume control circuits, ensuring accurate and reliable audio level adjustments.

Nominal Output Power: 3 W

Capable of delivering a strong output power of 3W, suitable for driving speakers and amplifiers in audio systems.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, enhancing the performance and efficiency of the IC.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature of 85°C, the IC can withstand demanding environmental conditions.

Minimum Operating Temperature: -40 °C

Suitable for use in extreme cold conditions down to -40°C, ensuring reliability in various environments.

Technical Specifications

Audio Control ICs TPA2008D2PWP attributes and parameters. Explore more Audio Control ICs devices from Texas Instruments

Specs

General IC Type:

Harmonic Distortion:

5 %

JESD-30 Code:

R-PDSO-G24

JESD-609 Code:

e4

Length:

7.8 mm

Moisture Sensitivity Level (MSL):

2

Nominal Noise Figure:

96 dB

No. of Channels:

2

No. of Functions:

1

No. of Terminals:

24

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Nominal Output Power:

3 W

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP24,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Sub-Category:

Audio/Video Amplifiers

Maximum Supply Current:

15 mA

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

2.5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

4.4 mm

Trade Compliance

TPA2008D2PWP General Purpose ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.33.00.01

SB

8542.33.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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