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TDA7430

STMicroelectronics

TDA7430 by STMicroelectronics

TDA7430 by STMicroelectronics is a BICMOS audio control IC with 3 tone bands, 90 dB channel separation, and 0.01% harmonic distortion. Ideal for tone control circuits in commercial applications requiring low profile flatpack packaging and quad terminal position.

Median Price

$2.401

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Arrow

USA . 910 parts In-Stock

1+ parts

$2.042

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-

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910

$2.042

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Chip1Stop

Japan . 910 parts In-Stock

1+ parts

$2.760

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-

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910

$2.760

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Verical

USA . 910 parts In-Stock

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910

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Distributors (In-Stock)

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Digiode

USA . 526 parts In-Stock

1+ parts

$1.940

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-

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526

$1.940

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Bristol Electronics

USA . 901 parts In-Stock

1+ parts

$5.244

100+ parts

$2.465

1k+ parts

$2.255

10k+ parts

-

901

$5.244

$2.465

$2.255

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Vyrian

USA . 8,786 parts In-Stock

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8,786

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Anansix

USA . 1,341 parts In-Stock

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1,341

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Dan-Mar Components

USA . 901 parts In-Stock

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901

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Distributors (Availability)

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Corphita

USA . 2,812 parts In-Stock

1+ parts

$1.838

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2,812

$1.838

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IDEA Electronic Components Group

UK . 226 parts In-Stock

1+ parts

$2.099

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-

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$1.889

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226

$2.099

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$1.889

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MKK Technologies

India . 484 parts In-Stock

1+ parts

$3.948

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484

$3.948

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DigiPath Technology Company

USA . 484 parts In-Stock

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$3.948

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484

$3.948

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Microchip USA

USA . 429 parts In-Stock

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$8.745

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429

$8.745

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AZTECH Wire

Italy . 67 parts In-Stock

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$15.300

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67

$15.300

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Kepictronics

USA . 7,680 parts In-Stock

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7,680

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A-Z Elektronik GmbH

Germany . 5,576 parts In-Stock

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5,576

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RC Electronics

USA . 3,150 parts In-Stock

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3,150

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Parana Technologies

USA . 660 parts In-Stock

1+ parts

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$2.510

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660

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$2.510

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Overview

Unlock the full potential of your audio systems with the TDA7430 by STMicroelectronics. Designed with precision and quality in mind, this Tone Control Circuit boasts a channel separation of 90 dB and minimal harmonic distortion at just 0.01%. Perfect for enhancing sound clarity and adjusting tone effortlessly, this Audio Control IC is a game-changer for audio enthusiasts. With a sleek square package shape and surface mount design, the TDA7430 offers convenience and versatility for a wide range of applications. Elevate your listening experience with the superior performance and reliability of STMicroelectronics' TDA7430.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material ensures durability and protection for the internal components of the IC, making it suitable for long-term use.

Surface Mount: YES

Allows for easy installation on circuit boards, saving time and effort during assembly.

General IC Type: TONE CONTROL CIRCUIT

Specifically designed for tone control, ensuring high-quality sound output for audio applications.

Channel Separation: 90 dB

Provides excellent separation between audio channels, resulting in clear and distinct sound reproduction.

Harmonic Distortion: 0.01 %

Low distortion ensures accurate and faithful audio reproduction, delivering high-quality sound output.

Power Supplies (V): 9

Operates efficiently at 9 volts, making it compatible with a wide range of power sources.

No. of Terminals: 44

Offers multiple connection points for flexibility in circuit design and integration.

Technology: BICMOS

Utilizes BiCMOS technology for improved performance and efficiency in signal processing.

Technical Specifications

Audio Control ICs TDA7430 attributes and parameters. Explore more Audio Control ICs devices from STMicroelectronics

Specs

Channel Separation:

90 dB

General IC Type:

Harmonic Distortion:

.01 %

JESD-30 Code:

S-PQFP-G44

JESD-609 Code:

e4

Length:

10 mm

Moisture Sensitivity Level (MSL):

3

No. of Bands:

3

No. of Channels:

2

No. of Functions:

1

No. of Terminals:

44

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP44,.5SQ,32

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE

Power Supplies (V):

9

Qualification:

Not Qualified

Maximum Seated Height:

1.6 mm

Sub-Category:

Audio Control ICs

Maximum Supply Current:

26 mA

Maximum Supply Voltage (Vsup):

10.2 V

Minimum Supply Voltage (Vsup):

7 V

Surface Mount:

YES

Technology:

BICMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

QUAD

Width:

10 mm

Trade Compliance

TDA7430 General Purpose ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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