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LM4938MH

Texas Instruments

LM4938MH by Texas Instruments

LM4938MH by Texas Instruments is an Audio Control IC with 2 channels and 73 dB channel separation. It operates on power supplies of 3-5V, has a small outline package style, and is suitable for volume control circuits in applications requiring precise audio adjustments.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 4,205 parts In-Stock

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Anansix

USA . 2,072 parts In-Stock

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2,072

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Digiode

USA . 724 parts In-Stock

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724

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Parana Technologies

USA . 1,288 parts In-Stock

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$0.247

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$1.526

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$0.247

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DigiPath Technology Company

USA . 253 parts In-Stock

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$0.271

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$0.250

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253

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ChromeModa Solutions

Germany . 3,422 parts In-Stock

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$0.277

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$0.227

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$0.277

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IDEA Electronic Components Group

UK . 717 parts In-Stock

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$0.277

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$0.249

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717

$0.277

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One Stop Electronics

USA . 301 parts In-Stock

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$10.800

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301

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AZTECH Wire

Italy . 538 parts In-Stock

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$12.203

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Kepictronics

USA . 8,493 parts In-Stock

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Alle Elektronik GmbH

Germany . 3,984 parts In-Stock

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Lixinc

USA . 1,164 parts In-Stock

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Corphita

USA . 405 parts In-Stock

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Overview

Elevate your audio experience with the LM4938MH by Texas Instruments, a premium quality Audio Control IC designed to deliver impeccable sound control. Manufactured by industry leader Texas Instruments, this innovative product offers unmatched performance and reliability. Ideal for a wide range of applications, the LM4938MH provides exceptional value to customers seeking superior audio solutions. Experience crystal-clear sound and seamless volume control with this cutting-edge device.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy for the package body material makes the product lightweight and durable, which is ideal for portable audio devices.

Surface Mount: YES

Being surface mountable, this IC is easy to integrate into PCBs, saving space and facilitating automated assembly processes.

Channel Separation: 73 dB

With a high channel separation of 73 dB, this IC provides clear and distinct audio output, ensuring minimal interference between left and right channels.

Power Supplies (V): 3/5

The IC supports power supplies of 3V and 5V, making it versatile and compatible with a wide range of audio devices.

No. of Terminals: 28

With 28 terminals, this IC offers plenty of connections for various audio input and output signals, allowing for versatile audio control capabilities.

Minimum Operating Temperature: -20 °C

The IC can operate in temperatures as low as -20°C, making it suitable for use in environments with colder climates.

Maximum Operating Temperature: 85 °C

With a maximum operating temperature of 85°C, this IC can withstand high heat conditions, ensuring reliable performance in diverse applications.

Terminal Finish: TIN LEAD

The tin lead terminal finish provides good conductivity and solderability, making it easy to solder the IC onto PCBs for a secure connection.

Width: 4.4 mm

The compact width of 4.4 mm makes the IC suitable for space-constrained designs, such as slim audio devices or compact circuit layouts.

No. of Channels: 2

With support for 2 channels, this IC is ideal for stereo audio applications, providing independent control over left and right audio signals.

Technical Specifications

Audio Control ICs LM4938MH attributes and parameters. Explore more Audio Control ICs devices from Texas Instruments

Specs

Channel Separation:

73 dB

General IC Type:

JESD-30 Code:

R-PDSO-G28

JESD-609 Code:

e0

Length:

9.7 mm

Moisture Sensitivity Level (MSL):

1

No. of Channels:

2

No. of Functions:

1

No. of Terminals:

28

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-20 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP28,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

3/5

Qualification:

Not Qualified

Maximum Seated Height:

1.1 mm

Sub-Category:

Audio/Video Amplifiers

Maximum Supply Current:

30 mA

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

2.7 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Width:

4.4 mm

Trade Compliance

LM4938MH General Purpose ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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