Loading...

TDA7463AD

STMicroelectronics

TDA7463AD by STMicroelectronics

TDA7463AD by STMicroelectronics is a BICMOS audio control IC designed for tone control applications. It features 80 dB channel separation, operates b/w 1.8V and 3V, and supports dual channels in a compact SO-20 package. Ideal for enhancing audio quality in consumer electronics.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,116 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

7,116

-

-

-

-

Digiode

USA . 4,835 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,835

-

-

-

-

Anansix

USA . 1,134 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,134

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 261 parts In-Stock

1+ parts

$0.577

100+ parts

-

1k+ parts

$0.519

10k+ parts

-

261

$0.577

-

$0.519

-

MKK Technologies

India . 995 parts In-Stock

1+ parts

$1.085

100+ parts

-

1k+ parts

-

10k+ parts

-

995

$1.085

-

-

-

DigiPath Technology Company

USA . 995 parts In-Stock

1+ parts

$1.085

100+ parts

-

1k+ parts

-

10k+ parts

-

995

$1.085

-

-

-

Microchip USA

USA . 276 parts In-Stock

1+ parts

$7.158

100+ parts

-

1k+ parts

-

10k+ parts

-

276

$7.158

-

-

-

AZTECH Wire

Italy . 315 parts In-Stock

1+ parts

$17.200

100+ parts

-

1k+ parts

-

10k+ parts

-

315

$17.200

-

-

-

A-Z Elektronik GmbH

Germany . 5,931 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

5,931

-

-

-

-

Corphita

USA . 4,036 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,036

-

-

-

-

Parana Technologies

USA . 1,874 parts In-Stock

1+ parts

-

100+ parts

$0.690

1k+ parts

-

10k+ parts

-

1,874

-

$0.690

-

-

RC Electronics

USA . 605 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

605

-

-

-

-

Overview

Unleash superior sound quality with the TDA7463AD from STMicroelectronics, a leader in innovative audio solutions. This compact, dual-channel tone control circuit offers exceptional channel separation and an impressive operating range, making it ideal for advanced audio applications. With its robust design and reliable performance, the TDA7463AD empowers engineers to create immersive listening experiences, ensuring your products stand out in a competitive market. Elevate your audio designs today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy minimizes weight while providing adequate protection against environmental factors, making this IC suitable for diverse applications.

Surface Mount: YES

Surface mount technology allows for more compact designs, enabling easier integration into various circuit boards and reducing assembly costs.

Package Shape: RECTANGULAR

The rectangular package shape is optimal for efficient space utilization on printed circuit boards, facilitating high-density designs.

General IC Type: TONE CONTROL CIRCUIT

As a tone control circuit, this IC enhances audio quality by allowing precise adjustments to sound frequency levels, making it ideal for audio applications.

Channel Separation: 80 dB

An 80 dB channel separation indicates high clarity in audio output, effectively reducing crosstalk and improving overall sound fidelity.

Power Supplies (V): 2.4

A standard operating voltage of 2.4 V ensures compatibility with common power supplies, simplifying integration into existing systems.

No. of Terminals: 20

With 20 terminals, this IC offers flexibility in routing connections and signals, making it versatile for different application needs.

Package Style (Meter): SMALL OUTLINE, SHRINK PITCH

This package style offers a smaller footprint which is beneficial for space-limited applications, improving design efficiency.

Maximum Operating Temperature: 85 °C

A maximum operating temperature of 85 °C ensures reliability in varying environmental conditions, making it suitable for automotive and industrial applications.

No. of Bands: 2

Having 2 bands allows for detailed control over audio frequencies, enhancing the user experience with customized sound profiles.

Minimum Operating Temperature: -10 °C

An operational range starting at -10 °C allows this IC to function effectively in cooler environments, broadening its application scope.

Terminal Finish: NICKEL PALLADIUM GOLD

The nickel palladium gold terminal finish ensures excellent conductivity and resistance to corrosion, enhancing the longevity and reliability of connections.

Terminal Position: DUAL

Dual terminal positioning allows for more flexible circuit layout options, facilitating easier integration in complex designs.

Maximum Seated Height: 2 mm

At just 2 mm in height, this low profile design is ideal for compact applications where space is at a premium.

Width: 5.3 mm

A compact width of 5.3 mm aids in designing smaller devices without compromising on functionality.

Minimum Supply Voltage (Vsup): 1.8 V

With a minimum supply voltage of 1.8 V, this IC is energy-efficient, making it suitable for battery-operated devices.

Length: 7.2 mm

A length of 7.2 mm provides a good balance between ease of handling and fitting into tight spaces.

No. of Channels: 2

The presence of 2 channels offers enhanced stereo sound reproduction, allowing for a richer audio experience.

Technology: BICMOS

BICMOS technology combines the benefits of bipolar and CMOS, leading to high performance with low power consumption.

Terminal Form: GULL WING

Gull wing terminals enhance solder joint reliability and make handling easier during assembly.

Terminal Pitch: 0.65 mm

A terminal pitch of 0.65 mm allows for higher density packaging, beneficial in modern, space-constrained electronic devices.

Maximum Supply Voltage (Vsup): 3 V

Supporting a maximum supply voltage of 3 V makes this IC versatile, allowing it to be used in various power supply environments.

Technical Specifications

Audio Control ICs TDA7463AD attributes and parameters. Explore more Audio Control ICs devices from STMicroelectronics

Specs

Channel Separation:

80 dB

General IC Type:

JESD-30 Code:

R-PDSO-G20

JESD-609 Code:

e4

Length:

7.2 mm

No. of Bands:

2

No. of Channels:

2

No. of Functions:

1

No. of Terminals:

20

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-10 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SSOP20,.3

Package Shape:

Package Style (Meter):

SMALL OUTLINE, SHRINK PITCH

Power Supplies (V):

2.4

Qualification:

Not Qualified

Maximum Seated Height:

2 mm

Sub-Category:

Audio Control ICs

Maximum Supply Voltage (Vsup):

3 V

Minimum Supply Voltage (Vsup):

1.8 V

Surface Mount:

YES

Technology:

BICMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Width:

5.3 mm

Trade Compliance

TDA7463AD General Purpose ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

Similar products 20