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TDA7309D

STMicroelectronics

TDA7309D by STMicroelectronics

STMicroelectronics TDA7309D is a BICMOS VOLUME CONTROL IC with 2 channels, offering 100 dB channel separation and 0.01% harmonic distortion. It operates b/w -40 to 85 °C, with power supply of 6-10V. Ideal for audio applications requiring precise volume control in compact designs.

Median Price

$10.920

Lifecycle Status

Suppliers In-Stock

10

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Bristol Electronics

USA . 120 parts In-Stock

1+ parts

$10.920

100+ parts

$4.732

1k+ parts

$4.477

10k+ parts

-

120

$10.920

$4.732

$4.477

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Vyrian

USA . 8,654 parts In-Stock

1+ parts

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8,654

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Anansix

USA . 2,112 parts In-Stock

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2,112

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Q Components

USA . 995 parts In-Stock

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995

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Digiode

USA . 352 parts In-Stock

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352

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Classic Components Corporation

USA . 201 parts In-Stock

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201

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Lakeland Logistics Inc

USA . 120 parts In-Stock

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120

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Amalfi Trading

USA . 120 parts In-Stock

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120

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M&R Communications

USA . 120 parts In-Stock

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120

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J2 Sourcing AB

Sweden . 59 parts In-Stock

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59

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 2,182 parts In-Stock

1+ parts

$0.346

100+ parts

-

1k+ parts

$0.311

10k+ parts

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2,182

$0.346

-

$0.311

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MKK Technologies

India . 1,104 parts In-Stock

1+ parts

$0.650

100+ parts

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1,104

$0.650

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DigiPath Technology Company

USA . 1,104 parts In-Stock

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$0.650

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1,104

$0.650

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Microchip USA

USA . 144 parts In-Stock

1+ parts

$5.799

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144

$5.799

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AZTECH Wire

Italy . 598 parts In-Stock

1+ parts

$10.860

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598

$10.860

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RC Electronics

USA . 7,200 parts In-Stock

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A-Z Elektronik GmbH

Germany . 6,314 parts In-Stock

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Corphita

USA . 4,086 parts In-Stock

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4,086

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Authorized Procurement Solutions

USA . 4,000 parts In-Stock

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Assy Fe

Spain . 1,096 parts In-Stock

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1,096

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Kepictronics

USA . 210 parts In-Stock

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210

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Parana Technologies

USA . 40 parts In-Stock

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$0.414

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40

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$0.414

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Overview

Experience crystal-clear audio control like never before with the TDA7309D by STMicroelectronics. Crafted with precision and reliability, this volume control circuit offers impeccable channel separation and minimal harmonic distortion for superior sound quality. Ideal for a wide range of applications in the audio industry, this small outline package delivers exceptional performance in a compact design. Elevate your audio experience with the TDA7309D and enjoy the value, benefits, and advantages it brings to your projects.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of PLASTIC/EPOXY material results in a lightweight and durable package for the IC.

Surface Mount: YES

Surface mount technology allows for easy and efficient PCB assembly.

General IC Type: VOLUME CONTROL CIRCUIT

This IC is specifically designed for volume control applications, ensuring precise and reliable performance.

Channel Separation: 100 dB

High channel separation ensures clear and distinct audio output for each channel.

Harmonic Distortion: 0.01%

Low harmonic distortion results in high fidelity audio output with minimal interference or distortion.

Power Supplies (V): 9

Operates on a standard power supply voltage of 9V, making it compatible with a wide range of applications.

No. of Terminals: 20

Sufficient number of terminals for connectivity and interfacing with other components.

Maximum Operating Temperature: 85 °C

Can operate at high temperatures without compromising performance or reliability.

Technology: BICMOS

Utilizes BiCMOS technology for efficient power consumption and high-speed operation.

Maximum Supply Voltage (Vsup): 10 V

With a maximum supply voltage of 10V, it can withstand higher voltage inputs for versatile applications.

Technical Specifications

Audio Control ICs TDA7309D attributes and parameters. Explore more Audio Control ICs devices from STMicroelectronics

Specs

Channel Separation:

100 dB

General IC Type:

Harmonic Distortion:

.01 %

JESD-30 Code:

R-PDSO-G20

JESD-609 Code:

e4

Length:

12.8 mm

No. of Channels:

2

No. of Functions:

1

No. of Terminals:

20

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP20,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Power Supplies (V):

9

Qualification:

Not Qualified

Maximum Seated Height:

2.65 mm

Sub-Category:

Audio Control ICs

Maximum Supply Current:

10 mA

Maximum Supply Voltage (Vsup):

10 V

Minimum Supply Voltage (Vsup):

6 V

Surface Mount:

YES

Technology:

BICMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width:

7.5 mm

Trade Compliance

TDA7309D General Purpose ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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