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TDA7469D

STMicroelectronics

TDA7469D by STMicroelectronics

TDA7469D by STMicroelectronics is a dual-channel tone control IC designed for audio applications. It features 50 dB channel separation, 0.1% harmonic distortion, and operates within a supply voltage range of 1.8V to 5V. Ideal for enhancing sound quality in consumer electronics.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,207 parts In-Stock

1+ parts

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2,207

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Anansix

USA . 751 parts In-Stock

1+ parts

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751

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Vyrian

USA . 702 parts In-Stock

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702

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 2,267 parts In-Stock

1+ parts

$0.762

100+ parts

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1k+ parts

$0.686

10k+ parts

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2,267

$0.762

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$0.686

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MKK Technologies

India . 555 parts In-Stock

1+ parts

$1.432

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555

$1.432

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DigiPath Technology Company

USA . 555 parts In-Stock

1+ parts

$1.432

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555

$1.432

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Corphita

USA . 2,496 parts In-Stock

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2,496

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Parana Technologies

USA . 1,853 parts In-Stock

1+ parts

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$0.911

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1,853

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$0.911

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Overview

Elevate your audio experience with the TDA7469D from STMicroelectronics, a leader in innovative technology. This high-quality audio control IC delivers exceptional tone control, ensuring crystal-clear sound and minimal distortion for any application. With its compact design and robust performance, it’s ideal for consumer electronics, automotive infotainment, and professional audio systems. Trust in STMicroelectronics’ commitment to quality and reliability, and unlock superior audio potential today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy provides durability and helps protect the IC from environmental factors, making it suitable for various applications.

Surface Mount: YES

Surface mount capability allows for efficient assembly and helps reduce the overall footprint, making it ideal for compact devices.

Package Shape: RECTANGULAR

The rectangular shape optimizes space usage on PCBs and facilitates better layout options in designs.

General IC Type: TONE CONTROL CIRCUIT

As a tone control circuit, this IC enhances audio quality by allowing users to adjust bass, treble, and mid-range sounds.

Channel Separation: 50 dB

A channel separation of 50 dB ensures minimal crosstalk, providing a clearer and more defined audio output.

Harmonic Distortion: 0.1%

With a low harmonic distortion rate of 0.1%, this IC maintains audio integrity, ensuring high-fidelity sound reproduction.

Power Supplies (V): 2.4

The IC operates at a nominal power supply of 2.4V, making it energy-efficient and suitable for battery-operated devices.

No. of Terminals: 16

The 16 terminals provide sufficient connectivity options for versatile circuit integration.

Package Style (Meter): SMALL OUTLINE

The small outline package style contributes to space savings on the PCB, enhancing design flexibility.

Maximum Operating Temperature: 85 °C

With a maximum operating temperature of 85 °C, this IC can perform reliably in a wide range of environments.

No. of Bands: 2

The inclusion of 2 bands allows for more precise audio adjustments, improving the overall listening experience.

Minimum Operating Temperature: -10 °C

The IC's operation at low temperatures (-10 °C) ensures functionality even in challenging conditions.

Terminal Finish: Nickel/Palladium/Gold (Ni/Pd/Au)

The premium terminal finish enhances solderability and reduces oxidation, ensuring reliable connections over time.

Terminal Position: DUAL

Dual terminal positioning enhances board layout options and component integration in diverse applications.

Maximum Seated Height: 2.65 mm

A low seated height of 2.65 mm allows for compact designs, making it suitable for space-constrained applications.

Width: 7.5 mm

The width of 7.5 mm contributes to the compact design, which is beneficial for miniaturized electronic devices.

Minimum Supply Voltage (Vsup): 1.8 V

The IC can operate down to 1.8V, allowing for flexibility in power supply choices and enhancing energy efficiency.

Length: 10.3 mm

The overall length of 10.3 mm allows for easy integration into a variety of applications without taking up excessive space.

No. of Channels: 2

With 2 channels, the IC is capable of stereo sound processing, catering to modern audio requirements.

Technology: BICMOS

The BICMOS technology ensures low power consumption with high performance, ideal for audio applications.

Terminal Form: GULL WING

Gull-wing terminal form aids in effective soldering and ensures stability in high-density circuit designs.

Terminal Pitch: 1.27 mm

A terminal pitch of 1.27 mm provides sufficient spacing for soldering while ensuring compact layout capability.

Maximum Supply Voltage (Vsup): 5 V

Supporting a maximum supply voltage of 5 V ensures compatibility with standard power supplies in various electronic designs.

Technical Specifications

Audio Control ICs TDA7469D attributes and parameters. Explore more Audio Control ICs devices from STMicroelectronics

Specs

Channel Separation:

50 dB

General IC Type:

Harmonic Distortion:

.1 %

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e4

Length:

10.3 mm

No. of Bands:

2

No. of Channels:

2

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-10 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP16,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Power Supplies (V):

2.4

Qualification:

Not Qualified

Maximum Seated Height:

2.65 mm

Sub-Category:

Audio Control ICs

Maximum Supply Voltage (Vsup):

5 V

Minimum Supply Voltage (Vsup):

1.8 V

Surface Mount:

YES

Technology:

BICMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width:

7.5 mm

Trade Compliance

TDA7469D General Purpose ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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