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TDA7449

STMicroelectronics

TDA7449 by STMicroelectronics

TDA7449 by STMicroelectronics is a BICMOS audio control IC featuring 100 dB channel separation and only 0.01% harmonic distortion. It operates b/w 6-10.2 V, making it ideal for tone control in consumer audio applications. Its compact design fits easily into various devices.

Median Price

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Lifecycle Status

Suppliers In-Stock

11

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,984 parts In-Stock

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Quantum Digital Technology

USA . 4,932 parts In-Stock

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4,932

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Sensible Micro Corp

USA . 4,544 parts In-Stock

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Digiode

USA . 2,961 parts In-Stock

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2,961

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Anansix

USA . 2,224 parts In-Stock

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2,224

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Halfin

Belgium . 1,385 parts In-Stock

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1,385

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Sogenti Electronics

Canada . 370 parts In-Stock

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370

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ComSIT Distribution GmbH

Germany . 235 parts In-Stock

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235

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ComSIT USA

USA . 235 parts In-Stock

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235

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Huijzer Components

Netherlands . 19 parts In-Stock

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LWI Electronics Inc

India . 10 parts In-Stock

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Distributors (Availability)

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IDEA Electronic Components Group

UK . 2,015 parts In-Stock

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$1.389

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$1.250

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2,015

$1.389

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$1.250

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Microchip USA

USA . 435 parts In-Stock

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$2.231

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435

$2.231

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MKK Technologies

India . 2,035 parts In-Stock

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$2.612

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2,035

$2.612

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DigiPath Technology Company

USA . 2,035 parts In-Stock

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$2.612

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2,035

$2.612

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AZTECH Wire

Italy . 1,191 parts In-Stock

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$19.880

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$19.880

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Infinite Electronics LLP (Excess)

. 15,005 parts In-Stock

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Authorized Procurement Solutions

USA . 3,510 parts In-Stock

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S.R.D Solutions

India . 3,000 parts In-Stock

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GreenTree Electronics

Israel . 2,820 parts In-Stock

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2,820

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A-Z Elektronik GmbH

Germany . 2,736 parts In-Stock

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2,736

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Parana Technologies

USA . 1,618 parts In-Stock

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$1.661

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$1.661

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Corphita

USA . 1,451 parts In-Stock

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Kepictronics

USA . 880 parts In-Stock

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880

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Overview

Elevate your audio experience with the TDA7449 from STMicroelectronics, a leader in innovative technology. This high-performance audio control IC delivers exceptional sound quality and precise tone adjustments, making it perfect for home theater systems, automotive audio, and portable devices. With ST's commitment to excellence, enjoy unparalleled reliability and clarity, transforming every listening moment into an extraordinary auditory journey.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy ensures durability and resistance to environmental factors, making the product suitable for various applications.

Package Shape: RECTANGULAR

The rectangular shape facilitates efficient PCB layout and integration into existing designs, optimizing space usage.

General IC Type: TONE CONTROL CIRCUIT

As a tone control circuit, this IC allows for precise audio tuning, enhancing audio quality for professional and consumer applications.

Channel Separation: 100 dB

High channel separation minimizes crosstalk between audio channels, ensuring clearer and more distinct sound reproduction.

Harmonic Distortion: 0.01%

Low harmonic distortion guarantees that the audio output remains true to the original source, preserving sound fidelity.

Power Supplies (V): 9

The standard supply voltage of 9V makes it compatible with a wide range of audio systems and enhances its versatility.

No. of Terminals: 20

With 20 terminals, the IC offers flexible connectivity options for various applications, supporting complex setups.

Package Style (Meter): IN-LINE

An in-line package style simplifies integration and assembly in audio devices, making it user-friendly for developers.

Maximum Operating Temperature: 70 °C

A maximum operating temperature of 70 °C allows the IC to perform reliably in a range of environments without risk of overheating.

No. of Bands: 2

The two-band control system provides users with adequate adjustment for bass and treble, catering to varied listening preferences.

Minimum Operating Temperature: 0 °C

Operating down to 0 °C ensures functionality in colder climates, making this IC suitable for global applications.

Terminal Finish: MATTE TIN

The matte tin terminal finish provides good solderability and corrosion resistance, ensuring reliable connections over time.

Terminal Position: DUAL

Dual terminal positioning enhances the ease of routing and layout design, reducing complexity in PCB design.

Maximum Seated Height: 3.93 mm

The compact seated height makes this IC ideal for low-profile applications, enabling integration in slim audio devices.

Width: 7.62 mm

A width of 7.62 mm strikes a balance between compact design and functionality, fitting in tight spaces without compromising performance.

Minimum Supply Voltage (Vsup): 6 V

A minimum supply voltage of 6V increases operational flexibility, enabling use in various power conditions.

Length: 25.15 mm

The length of 25.15 mm is manageable for most PCB layouts, providing versatility in placement and design.

Temperature Grade: COMMERCIAL

Designed for commercial applications, this IC meets general performance and reliability standards suitable for most consumer products.

No. of Channels: 2

Having two channels allows stereo audio processing, enhancing the listening experience for users.

Technology: BICMOS

BICMOS technology combines the benefits of Bipolar and CMOS processes, resulting in high performance with low power consumption.

Terminal Form: THROUGH-HOLE

Through-hole terminal form allows for robust connections, ensuring reliability under various environmental conditions.

Terminal Pitch: 2.54 mm

A standard terminal pitch of 2.54 mm simplifies circuit board design and component sourcing, making it widely compatible.

Maximum Supply Voltage (Vsup): 10.2 V

The maximum supply voltage of 10.2V ensures ample headroom for various audio applications, enhancing performance without distortion.

Technical Specifications

Audio Control ICs TDA7449 attributes and parameters. Explore more Audio Control ICs devices from STMicroelectronics

Specs

Channel Separation:

100 dB

General IC Type:

Harmonic Distortion:

.01 %

JESD-30 Code:

R-PDIP-T20

JESD-609 Code:

e3

Length:

25.15 mm

No. of Bands:

2

No. of Channels:

2

No. of Functions:

1

No. of Terminals:

20

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP20,.3

Package Shape:

Package Style (Meter):

IN-LINE

Power Supplies (V):

9

Qualification:

Not Qualified

Maximum Seated Height:

3.93 mm

Sub-Category:

Audio Control ICs

Maximum Supply Voltage (Vsup):

10.2 V

Minimum Supply Voltage (Vsup):

6 V

Surface Mount:

NO

Technology:

BICMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Width:

7.62 mm

Trade Compliance

TDA7449 General Purpose ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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