Loading...

TDA746913TR

STMicroelectronics

TDA746913TR by STMicroelectronics

TDA746913TR by STMicroelectronics is a dual-channel tone control IC ideal for audio applications. It features 50 dB channel separation, 0.1% harmonic distortion, and operates b/w 1.8V to 5V. Its compact design ensures efficient integration in various devices.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,484 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

5,484

-

-

-

-

Digiode

USA . 2,525 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,525

-

-

-

-

Anansix

USA . 2,284 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,284

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 1,865 parts In-Stock

1+ parts

$0.454

100+ parts

-

1k+ parts

$0.409

10k+ parts

-

1,865

$0.454

-

$0.409

-

MKK Technologies

India . 326 parts In-Stock

1+ parts

$0.855

100+ parts

-

1k+ parts

-

10k+ parts

-

326

$0.855

-

-

-

DigiPath Technology Company

USA . 326 parts In-Stock

1+ parts

$0.855

100+ parts

-

1k+ parts

-

10k+ parts

-

326

$0.855

-

-

-

Microchip USA

USA . 393 parts In-Stock

1+ parts

$2.407

100+ parts

-

1k+ parts

-

10k+ parts

-

393

$2.407

-

-

-

AZTECH Wire

Italy . 90 parts In-Stock

1+ parts

$15.380

100+ parts

-

1k+ parts

-

10k+ parts

-

90

$15.380

-

-

-

Corphita

USA . 3,761 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,761

-

-

-

-

Parana Technologies

USA . 424 parts In-Stock

1+ parts

-

100+ parts

$0.543

1k+ parts

-

10k+ parts

-

424

-

$0.543

-

-

Overview

Elevate your audio experience with the TDA746913TR from STMicroelectronics, a leader in innovative technology. This high-quality audio control IC offers exceptional sound clarity and precision, making it perfect for home entertainment systems, automotive applications, and portable devices. Enjoy seamless integration with its compact design and reliable performance, ensuring superior audio quality that enhances every listening moment. Transform your sound today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy for the package body provides durability and resistance to environmental factors, making it suitable for various applications.

Surface Mount: YES

Surface mount technology allows for efficient space utilization on PCBs, enabling compact designs and easier manufacturing processes.

Package Shape: RECTANGULAR

A rectangular package shape is common and facilitates easier placement on circuit boards, enhancing compatibility with standard mounting practices.

General IC Type: TONE CONTROL CIRCUIT

This tone control feature allows for enhanced audio tuning capabilities, making it ideal for high-quality audio applications.

Channel Separation: 50 dB

High channel separation improves audio fidelity and reduces crosstalk between channels, resulting in clearer sound quality.

Harmonic Distortion: 0.1 %

Low harmonic distortion guarantees high signal integrity and ensures that the audio output remains true to the original source.

Power Supplies (V): 2.4

The moderate power supply requirement makes this IC versatile for various audio applications while ensuring efficient energy consumption.

No. of Terminals: 24

With 24 terminals, this IC provides ample connectivity for complex audio circuits, allowing for diverse implementation options.

Package Style (Meter): SMALL OUTLINE, SHRINK PITCH

The small outline and shrink pitch style enable compact designs, making it a suitable choice for space-constrained applications.

Maximum Operating Temperature: 70 °C

A maximum operating temperature of 70 °C allows the IC to function reliably in a range of environments, enhancing its usability in various installations.

No. of Bands: 2

With 2 bands, this IC offers customized audio control, allowing users to fine-tune treble and bass for tailored listening experiences.

Minimum Operating Temperature: 0 °C

With a minimum operating temperature of 0 °C, this IC is suitable for operation in cooler environments without performance degradation.

Terminal Finish: NICKEL PALLADIUM GOLD

The nickel palladium gold finish ensures excellent conductivity and corrosion resistance, enhancing the longevity and reliability of connections.

Terminal Position: DUAL

The dual terminal position allows for flexible circuit layout options, facilitating easier integration into designs.

Maximum Seated Height: 2 mm

A maximum seated height of 2 mm contributes to a low-profile design, making it ideal for slim audio devices.

Width: 5.3 mm

A compact width of 5.3 mm supports space-efficient layouts, crucial for modern electronic devices with limited space.

Minimum Supply Voltage (Vsup): 1.8 V

A minimum supply voltage of 1.8 V enhances versatility, allowing it to operate effectively across a wide range of power supply configurations.

Length: 8.2 mm

Its manageable length of 8.2 mm supports easy integration into various products, contributing to overall design flexibility.

Temperature Grade: COMMERCIAL

Commercial temperature grading indicates reliability for standard usage, making it suitable for everyday electronic applications.

No. of Channels: 2

With 2 channels available, this IC effectively supports stereo audio systems, providing a richer sound experience.

Technology: BICMOS

BICMOS technology combines the advantages of bipolar and CMOS, offering high-speed performance and low power consumption.

Terminal Form: GULL WING

Gull wing terminals facilitate easier soldering processes, enhancing manufacturing efficiency and reliability of the assembly.

Terminal Pitch: 0.65 mm

A terminal pitch of 0.65 mm allows for a dense layout while ensuring soldering precision, suitable for modern compact designs.

Maximum Supply Voltage (Vsup): 5 V

Supporting a maximum supply voltage of 5 V, this IC can operate in a variety of standard electronic environments, adding to its versatility.

Technical Specifications

Audio Control ICs TDA746913TR attributes and parameters. Explore more Audio Control ICs devices from STMicroelectronics

Specs

Channel Separation:

50 dB

General IC Type:

Harmonic Distortion:

.1 %

JESD-30 Code:

R-PDSO-G24

JESD-609 Code:

e4

Length:

8.2 mm

No. of Bands:

2

No. of Channels:

2

No. of Functions:

1

No. of Terminals:

24

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SSOP24,.3

Package Shape:

Package Style (Meter):

SMALL OUTLINE, SHRINK PITCH

Power Supplies (V):

2.4

Qualification:

Not Qualified

Maximum Seated Height:

2 mm

Sub-Category:

Audio Control ICs

Maximum Supply Voltage (Vsup):

5 V

Minimum Supply Voltage (Vsup):

1.8 V

Surface Mount:

YES

Technology:

BICMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Width:

5.3 mm

Trade Compliance

TDA746913TR General Purpose ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

Similar products 20