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LM4840MH

Texas Instruments

LM4840MH by Texas Instruments

LM4840MH by Texas Instruments is an Audio Control IC with 2 channels, offering 65 dB channel separation and 10% harmonic distortion. It operates b/w -40 to 85 °C, in industrial settings. The small outline package with gull wing terminals makes it suitable for volume control circuits in compact audio devices.

Median Price

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Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 2,270 parts In-Stock

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2,270

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Digiode

USA . 1,799 parts In-Stock

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1,799

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Anansix

USA . 1,473 parts In-Stock

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1,473

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Prism Electronics

USA . 38 parts In-Stock

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38

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ACDS - Activité Composants Distribution Service

France . 22 parts In-Stock

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22

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Distributors (Availability)

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Parana Technologies

USA . 363 parts In-Stock

1+ parts

$0.534

100+ parts

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$1.643

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363

$0.534

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$1.643

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DigiPath Technology Company

USA . 735 parts In-Stock

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$0.588

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$0.541

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735

$0.588

$0.541

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ChromeModa Solutions

Germany . 3,754 parts In-Stock

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$0.600

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$0.492

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3,754

$0.600

$0.492

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IDEA Electronic Components Group

UK . 1,908 parts In-Stock

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$0.600

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$0.540

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One Stop Electronics

USA . 1,305 parts In-Stock

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$2.800

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1,305

$2.800

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AZTECH Wire

Italy . 531 parts In-Stock

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$10.971

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531

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Corphita

USA . 681 parts In-Stock

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681

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Kepictronics

USA . 168 parts In-Stock

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Cyclops Electronics Ltd (Excess)

UK . 20 parts In-Stock

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Overview

Enhance your audio experience with the LM4840MH by Texas Instruments, a top-tier manufacturer known for delivering high-quality audio control ICs. Perfect for applications where superior sound quality is essential, this volume control circuit offers impeccable channel separation and minimal harmonic distortion, ensuring crystal-clear audio output. With a compact package design and industrial-grade temperature tolerance, the LM4840MH provides reliability and performance in a variety of settings. Elevate your audio projects with the unmatched value and benefits of this innovative product.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material is durable and cost-effective, making the product reliable for long-term use.

Surface Mount: YES

Surface mount capability allows for easy integration into PCBs, saving space and reducing assembly time.

Channel Separation: 65 dB

High channel separation of 65 dB ensures clear and distinct audio signals for each channel.

Harmonic Distortion: 10%

Low harmonic distortion of 10% ensures high-quality audio output with minimal distortion.

No. of Terminals: 28

The high number of terminals allows for versatile connections and configurations, making the product suitable for various audio control applications.

Maximum Operating Temperature: 85°C

With a maximum operating temperature of 85°C, the product can withstand high temperature environments, ensuring reliable performance.

Minimum Operating Temperature: -40°C

The product can operate in low temperature conditions down to -40°C, making it suitable for a wide range of temperature environments.

Width: 4.4 mm

Compact width of 4.4 mm allows for space-saving and efficient PCB design.

Minimum Supply Voltage (Vsup): 2.7 V

Low minimum supply voltage of 2.7 V ensures compatibility with a wide range of power sources.

Temperature Grade: INDUSTRIAL

Industrial temperature grade ensures reliability and performance in harsh industrial environments.

No. of Channels: 2

Dual-channel design provides stereo audio control, suitable for common audio applications.

Maximum Supply Voltage (Vsup): 5.5 V

High maximum supply voltage of 5.5 V allows for flexibility in power supply options and compatibility with different systems.

Technical Specifications

Audio Control ICs LM4840MH attributes and parameters. Explore more Audio Control ICs devices from Texas Instruments

Specs

Additional Features:

BRIDGED MODE OPERATION 70 DB CHANNEL SEPARATION ALSO AVAILABLE; SEATED HT_TYP

Channel Separation:

65 dB

General IC Type:

Harmonic Distortion:

10 %

JESD-30 Code:

R-PDSO-G28

Length:

9.7 mm

No. of Channels:

2

No. of Functions:

1

No. of Terminals:

28

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH

Maximum Seated Height:

1.1 mm

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

2.7 V

Surface Mount:

YES

Temperature Grade:

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Width:

4.4 mm

Trade Compliance

LM4840MH General Purpose ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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