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TLC320AD81CDBTR

Texas Instruments

TLC320AD81CDBTR by Texas Instruments

TLC320AD81CDBTR by Texas Instruments is an audio control IC with 2 channels, offering 90 dB channel separation and 0.005% harmonic distortion. It features a small outline package with 38 terminals, suitable for equalizer circuits in commercial-grade applications.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,210 parts In-Stock

1+ parts

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7,210

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Digiode

USA . 4,153 parts In-Stock

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4,153

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 2,306 parts In-Stock

1+ parts

$2.608

100+ parts

-

1k+ parts

$3.097

10k+ parts

-

2,306

$2.608

-

$3.097

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DigiPath Technology Company

USA . 1,681 parts In-Stock

1+ parts

$2.871

100+ parts

$2.642

1k+ parts

-

10k+ parts

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1,681

$2.871

$2.642

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ChromeModa Solutions

Germany . 6,233 parts In-Stock

1+ parts

$2.930

100+ parts

$2.403

1k+ parts

-

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6,233

$2.930

$2.403

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IDEA Electronic Components Group

UK . 1,357 parts In-Stock

1+ parts

$2.930

100+ parts

-

1k+ parts

$2.637

10k+ parts

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1,357

$2.930

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$2.637

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AZTECH Wire

Italy . 770 parts In-Stock

1+ parts

$15.532

100+ parts

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770

$15.532

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One Stop Electronics

USA . 137 parts In-Stock

1+ parts

$15.800

100+ parts

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137

$15.800

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Corphita

USA . 79 parts In-Stock

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79

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Overview

Enhance your audio experience with the TLC320AD81CDBTR by Texas Instruments. Known for their superior quality and innovation, Texas Instruments delivers cutting-edge Audio Control ICs like no other. Ideal for a wide range of applications, this Equalizer Circuit provides exceptional channel separation of 90 dB and minimal harmonic distortion of 0.005%. With a compact design and reliable performance, this product offers customers unmatched value and benefits, making it a must-have for any audio enthusiast. Elevate your sound system today with Texas Instruments TLC320AD81CDBTR.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package body material makes the product lightweight and durable, which is ideal for portable audio devices.

Surface Mount: YES

Being surface mountable allows for easy and efficient assembly on circuit boards, saving space and reducing manufacturing costs.

Channel Separation: 90 dB

High channel separation ensures clear and distinct audio output from each channel, providing a superior listening experience.

Harmonic Distortion: 0.005%

With low harmonic distortion, the audio signal remains clean and faithful to the original sound, ensuring high-quality audio output.

No. of Terminals: 38

Having a large number of terminals allows for versatile connectivity options and integration with various audio systems.

Maximum Operating Temperature: 70 °C

The product can operate efficiently at high temperatures without compromising performance, ensuring reliability in various environmental conditions.

No. of Bands: 2

Having two bands allows for adjustable frequency responses, enabling users to customize the audio output based on their preferences.

Terminal Pitch: 0.5 mm

The small terminal pitch makes it easier to achieve high density mounting on circuit boards, enhancing the overall design flexibility of the product.

Minimum Supply Voltage (Vsup): 3 V

The low minimum supply voltage requirement ensures compatibility with a wide range of power sources, making the product versatile in different applications.

Maximum Supply Voltage (Vsup): 3.6 V

The maximum supply voltage allows for stable operation without the risk of overloading, ensuring the safety and longevity of the product.

Technical Specifications

Audio Control ICs TLC320AD81CDBTR attributes and parameters. Explore more Audio Control ICs devices from Texas Instruments

Specs

Additional Features:

ALSO REQUIRES 4.5V TO 5.5V POWER SUPPLY; MULTI BAND DIGITAL EQUALIZER

Channel Separation:

90 dB

General IC Type:

Harmonic Distortion:

.005 %

JESD-30 Code:

R-PDSO-G38

Length:

9.7 mm

No. of Bands:

2

No. of Channels:

2

No. of Functions:

1

No. of Terminals:

38

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

3 V

Surface Mount:

YES

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Width:

4.4 mm

Trade Compliance

TLC320AD81CDBTR General Purpose ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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