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TAS5754MDCA

Texas Instruments

TAS5754MDCA by Texas Instruments

TAS5754MDCA by Texas Instruments is an Audio Control IC with 2 channels, offering 40W nominal output power. It features 102dB channel separation and operates b/w -25 to 85°C. Ideal for applications requiring precise tone control circuits in compact designs.

Median Price

$5.730

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 26,080 parts In-Stock

1+ parts

$4.000

100+ parts

$3.505

1k+ parts

$1.980

10k+ parts

-

26,080

$4.000

$3.505

$1.980

-

Mouser Electronics

USA . 939 parts In-Stock

1+ parts

$7.460

100+ parts

$5.110

1k+ parts

$3.220

10k+ parts

$3.080

939

$7.460

$5.110

$3.220

$3.080

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,883 parts In-Stock

1+ parts

$3.800

100+ parts

-

1k+ parts

-

10k+ parts

-

1,883

$3.800

-

-

-

Vyrian

USA . 2,908 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,908

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 2,294 parts In-Stock

1+ parts

$2.214

100+ parts

-

1k+ parts

$2.720

10k+ parts

-

2,294

$2.214

-

$2.720

-

DigiPath Technology Company

USA . 1,283 parts In-Stock

1+ parts

$2.438

100+ parts

$2.243

1k+ parts

-

10k+ parts

-

1,283

$2.438

$2.243

-

-

ChromeModa Solutions

Germany . 3,053 parts In-Stock

1+ parts

$2.488

100+ parts

$2.040

1k+ parts

-

10k+ parts

-

3,053

$2.488

$2.040

-

-

IDEA Electronic Components Group

UK . 635 parts In-Stock

1+ parts

$2.488

100+ parts

-

1k+ parts

$2.239

10k+ parts

-

635

$2.488

-

$2.239

-

Ampacity Inc.

Singapore . 13,237 parts In-Stock

1+ parts

$3.400

100+ parts

-

1k+ parts

-

10k+ parts

-

13,237

$3.400

-

-

-

Corphita

USA . 2,905 parts In-Stock

1+ parts

$3.600

100+ parts

-

1k+ parts

-

10k+ parts

-

2,905

$3.600

-

-

-

Lixinc

USA . 15,941 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

15,941

-

-

-

-

Overview

Elevate your audio experience with the TAS5754MDCA by Texas Instruments. Crafted with precision and expertise, this Audio Control IC offers unparalleled quality in tone control circuitry. Perfect for applications that demand top-notch audio performance, this IC boasts 102 dB channel separation and a nominal output power of 40 W. With its small outline package and dual terminal position, this product is designed for ease of use and seamless integration. Upgrade your sound system today and enjoy the benefits of superior audio quality with the TAS5754MDCA.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material makes the product lightweight and durable, making it suitable for portable audio devices.

General IC Type: TONE CONTROL CIRCUIT

The tone control circuit allows users to adjust the bass, treble, and other audio settings, providing customizable sound output.

Channel Separation: 102 dB

High channel separation helps in reducing crosstalk between audio channels, resulting in clear and distortion-free sound.

Nominal Output Power: 40 W

With a high output power, this product can drive speakers effectively, delivering loud and immersive audio experiences.

Minimum Supply Voltage (Vsup): 2.9 V

Low minimum supply voltage allows for efficient power consumption, making it suitable for battery-operated devices.

Technical Specifications

Audio Control ICs TAS5754MDCA attributes and parameters. Explore more Audio Control ICs devices from Texas Instruments

Specs

Additional Features:

IT ALSO OPERATES AT 4.5 TO 26.4 V SUPPLY VOLTAGE

Channel Separation:

102 dB

General IC Type:

JESD-30 Code:

R-PDSO-G48

JESD-609 Code:

e4

Length:

12.5 mm

Moisture Sensitivity Level (MSL):

3

Nominal Noise Figure:

103 dB

No. of Channels:

2

No. of Functions:

1

No. of Terminals:

48

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-25 Cel

Nominal Output Power:

40 W

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1.2 mm

Maximum Supply Voltage (Vsup):

3.63 V

Minimum Supply Voltage (Vsup):

2.9 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

6.1 mm

Trade Compliance

TAS5754MDCA General Purpose ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.33.00.01

SB

8542.33.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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