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TDA8551T/N1,112

NXP Semiconductors

TDA8551T/N1,112 by NXP Semiconductors

NXP Semiconductors' TDA8551T/N1,112 is a volume control circuit with 0.15% harmonic distortion and operates on 5V power supply. This small outline IC has 8 terminals, dual terminal position, and is ideal for industrial audio applications requiring precise volume control in a compact package.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

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Vyrian

USA . 8,490 parts In-Stock

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Anansix

USA . 1,878 parts In-Stock

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Digiode

USA . 1,284 parts In-Stock

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Nova Conductors

Japan . 51 parts In-Stock

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Advanced Electronics

New Zealand . 3,000 parts In-Stock

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$1.005

100+ parts

$0.915

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$0.824

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3,000

$1.005

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$0.824

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AZTECH Wire

Italy . 626 parts In-Stock

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$8.412

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626

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One Stop Electronics

USA . 1,619 parts In-Stock

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$10.800

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$10.800

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Ampacity Inc.

Singapore . 289 parts In-Stock

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$10.800

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Microchip USA

USA . 6,925 parts In-Stock

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UNI Independent Distributors

Spain . 5,344 parts In-Stock

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Perfect Parts

USA . 1,792 parts In-Stock

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Corphita

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Aranea Global

USA . 1,000 parts In-Stock

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Overview

NXP Semiconductors presents the TDA8551T/N1,112, a high-quality audio control IC that promises superior performance and reliability. Ideal for various applications in the audio industry, this volume control circuit offers exceptional value to customers seeking top-notch sound control solutions. With a compact package style and industrial-grade temperature tolerance, the TDA8551T/N1,112 delivers unparalleled benefits and advantages, making it the perfect choice for your next audio project. Trust NXP Semiconductors for innovative technology that exceeds expectations.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic material is durable and cost-effective, making the product reliable for long-term use.

Surface Mount: YES

Allows for easy and efficient installation on circuit boards, saving time and effort during assembly.

Package Shape: RECTANGULAR

Rectangular shape saves space and allows for efficient placement on PCBs.

General IC Type: VOLUME CONTROL CIRCUIT

Specifically designed for volume control applications, ensuring optimal performance in audio systems.

Harmonic Distortion: 0.15 %

Low harmonic distortion ensures high-quality sound output, making it suitable for audio applications.

Power Supplies (V): 5

Operates at a standard voltage, compatible with most audio systems.

No. of Terminals: 8

Sufficient number of terminals for connections, providing flexibility in circuit design.

Package Style (Meter): SMALL OUTLINE

Small outline package saves space on the PCB and allows for compact designs.

Maximum Operating Temperature: 85 °C

High maximum operating temperature ensures reliable performance in various environmental conditions.

Minimum Operating Temperature: -40 °C

Wide operating temperature range allows for use in both extreme cold and hot climates.

Terminal Position: DUAL

Dual terminal position allows for versatile installation options on the PCB.

Maximum Seated Height: 1.75 mm

Low seated height for minimal profile on the PCB, ideal for slim electronic devices.

Width: 3.9 mm

Compact width for efficient use of space on the circuit board.

Minimum Supply Voltage (Vsup): 2.7 V

Low minimum supply voltage requirement for energy-efficient operation.

Peak Reflow Temperature °C: 260

High peak reflow temperature for soldering process, ensuring secure connections during assembly.

Length: 4.9 mm

Optimal length for placement on the PCB without sacrificing space.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature rating suitable for demanding applications and environments.

Terminal Form: GULL WING

Gull wing terminal form for easy soldering and reliable electrical connections.

Maximum Supply Current: 10 mA

Low maximum supply current requirement for energy-efficient operation.

Terminal Pitch: 1.27 mm

Standard terminal pitch for compatibility with common PCB designs.

Maximum Supply Voltage (Vsup): 5.5 V

Safe maximum supply voltage limit to prevent damage to the IC.

Technical Specifications

Audio Control ICs TDA8551T/N1,112 attributes and parameters. Explore more Audio Control ICs devices from NXP Semiconductors

Specs

General IC Type:

Harmonic Distortion:

.15 %

JESD-30 Code:

R-PDSO-G8

Length:

4.9 mm

Moisture Sensitivity Level (MSL):

1

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP8,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Sub-Category:

Audio/Video Amplifiers

Maximum Supply Current:

10 mA

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

2.7 V

Surface Mount:

YES

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width:

3.9 mm

Trade Compliance

TDA8551T/N1,112 General Purpose ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.33.00.01

SB

8542.33.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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