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PGA2320IDWG4

Texas Instruments

PGA2320IDWG4 by Texas Instruments

PGA2320IDWG4 by Texas Instruments is a volume control circuit with 126 dB channel separation. It operates at a temperature range of -40 to 85 °C and requires power supplies of 5V and +-15V. This audio control IC is commonly used in industrial applications.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 3,731 parts In-Stock

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Digiode

USA . 2,649 parts In-Stock

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Nova Conductors

Japan . 42 parts In-Stock

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Parana Technologies

USA . 183 parts In-Stock

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$2.496

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$2.987

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$2.987

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DigiPath Technology Company

USA . 485 parts In-Stock

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$2.749

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$2.529

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$2.749

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ChromeModa Solutions

Germany . 3,686 parts In-Stock

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$2.805

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$2.300

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IDEA Electronic Components Group

UK . 1,549 parts In-Stock

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$2.805

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$2.524

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$2.805

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Ampacity Inc.

Singapore . 322 parts In-Stock

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$4.800

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One Stop Electronics

USA . 585 parts In-Stock

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$16.800

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AZTECH Wire

Italy . 325 parts In-Stock

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$18.644

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Semicontronic

India . 1,577 parts In-Stock

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$18.800

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$18.330

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$18.236

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Continental Prestige Electronics

USA . 3,387 parts In-Stock

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Perfect Parts

USA . 2,688 parts In-Stock

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Microchip USA

USA . 939 parts In-Stock

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Bastille Electronics

Australia . 800 parts In-Stock

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Argo Parts USA

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Corphita

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Overview

Experience superior audio control with the PGA2320IDWG4 by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments ensures top-notch quality and reliability in their products. The PGA2320IDWG4 falls under the category of Audio Control ICs, offering exceptional performance and versatility. With its compact and durable design, it is perfect for a wide range of applications. Whether you're looking to enhance the sound quality in your home theater system or optimize audio output in professional recording studios, this volume control circuit delivers outstanding results. Its advanced technology and channel separation of 126 dB guarantee an immersive audio experience like no other. Plus, with its easy installation and user-friendly interface, the PGA2320IDWG4 provides convenience and flexibility. Upgrade your audio control today and enjoy the value, benefits, and advantages this exceptional product brings to your audio setup.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This product's plastic/epoxy package body material ensures durability and protection for the internal components, making it a reliable choice for audio control.

Surface Mount: YES

With surface mount capability, this product can be easily integrated into various electronic circuits, allowing for efficient and space-saving designs.

No. of Functions: 1

Offering a single volume control circuit function, this product simplifies audio control applications by providing a straightforward solution.

Package Shape: RECTANGULAR

The rectangular package shape of this product allows for easy assembly and integration into electronic devices, simplifying the manufacturing process.

General IC Type: VOLUME CONTROL CIRCUIT

Designed specifically as a volume control circuit, this IC ensures precise and accurate audio level adjustments, enhancing user experience.

Channel Separation: 126 dB

Boasting an impressive channel separation of 126 dB, this product guarantees clear and distinct audio reproduction, making it an ideal choice for high-fidelity applications.

Power Supplies (V): 5,+-15

With a power supply range from 5V to ±15V, this product offers flexibility in various audio control system designs, accommodating a wide range of power sources.

No. of Terminals: 16

Equipped with 16 terminals, this product provides ample connectivity options, enabling easy integration with other components and circuitry.

Package Style (Meter): SMALL OUTLINE

The small outline package style of this product saves valuable space on circuit boards, allowing for compact device designs and efficient use of board real estate.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature of 85°C, this IC can reliably operate in demanding environments, ensuring consistent performance and longevity.

Minimum Operating Temperature: -40 °C

Able to withstand extremely low temperatures as low as -40°C, this product is suitable for use in various climatic conditions, making it a versatile solution.

Terminal Finish: NICKEL PALLADIUM GOLD

The nickel palladium gold terminal finish enhances the product's conductivity, corrosion resistance, and solderability, ensuring reliable and long-lasting connections.

Terminal Position: DUAL

Featuring dual terminal positions, this product provides flexibility and compatibility with a wide range of PCB layouts, accommodating different design requirements.

Maximum Seated Height: 2.65 mm

With a compact maximum seated height of 2.65 mm, this product allows for low-profile designs, enabling slim and sleek audio devices.

Width: 7.5 mm

The narrow width of this IC enables efficient space utilization on PCBs, contributing to compact and streamlined electronic designs.

Minimum Supply Voltage (Vsup): 4.5 V

With a low minimum supply voltage requirement of 4.5V, this product is suitable for low-power applications, optimizing energy efficiency.

Maximum Time At Peak Reflow Temperature (s): 30

Able to endure a maximum time of 30 seconds at peak reflow temperature, this product ensures reliable soldering during assembly, simplifying the manufacturing process.

Peak Reflow Temperature °C: 260

Having a peak reflow temperature of 260°C, this IC can withstand high-temperature reflow soldering processes common in electronics manufacturing.

Length: 10.3 mm

The compact length of this product facilitates space-saving designs, making it suitable for applications with limited board space.

Temperature Grade: INDUSTRIAL

Designed for industrial-grade applications, this product meets the stringent temperature and reliability requirements of industrial environments, ensuring robust performance.

No. of Channels: 2

Offering two channels, this IC enables stereo audio control, providing a rich and immersive sound experience.

Technology: BICMOS

Employing Bipolar Complementary Metal-Oxide-Semiconductor (BiCMOS) technology, this product combines the advantages of both bipolar and CMOS technologies, delivering high-performance audio control capabilities.

Terminal Form: GULL WING

The gull-wing terminal form simplifies the soldering process during assembly, ensuring secure and reliable connections between the IC and the PCB.

Maximum Supply Current: 16 mA

With a maximum supply current of 16 mA, this product operates within a low power consumption range, making it suitable for energy-efficient designs.

Terminal Pitch: 1.27 mm

Featuring a compact terminal pitch of 1.27 mm, this IC enables precise PCB layout designs, contributing to efficient and optimized circuit configurations.

Moisture Sensitivity Level (MSL): 2

Classified with a moisture sensitivity level of 2, this product exhibits moderate sensitivity to moisture, requiring standard moisture handling precautions during storage and assembly.

Maximum Supply Voltage (Vsup): 15.5 V

Able to handle high supply voltages up to 15.5V, this product offers versatility in audio control applications, accommodating a wide range of input voltage levels.

Technical Specifications

Audio Control ICs PGA2320IDWG4 attributes and parameters. Explore more Audio Control ICs devices from Texas Instruments

Specs

Additional Features:

IT ALSO REQUIRES 4.5V TO 5.5V SUPPLY

Channel Separation:

126 dB

General IC Type:

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e4

Length:

10.3 mm

Moisture Sensitivity Level (MSL):

2

No. of Channels:

2

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP16,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Power Supplies (V):

5,+-15

Qualification:

Not Qualified

Maximum Seated Height:

2.65 mm

Sub-Category:

Audio Control ICs

Maximum Supply Current:

16 mA

Maximum Supply Voltage (Vsup):

15.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Surface Mount:

YES

Technology:

BICMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

7.5 mm

Trade Compliance

PGA2320IDWG4 General Purpose ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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