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TDA7348D

STMicroelectronics

TDA7348D by STMicroelectronics

STMicroelectronics TDA7348D is a BICMOS audio control IC with 2 channels, offering 100 dB channel separation and 0.01% harmonic distortion. Ideal for tone control circuits in industrial applications, it operates b/w -40 to 85 °C with power supplies ranging from 6-10.2V.

Median Price

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Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 3,604 parts In-Stock

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3,604

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Digiode

USA . 3,298 parts In-Stock

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Anansix

USA . 1,160 parts In-Stock

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ACDS - Activité Composants Distribution Service

France . 448 parts In-Stock

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448

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Freddi Giovanni

Italy . 280 parts In-Stock

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280

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Sogenti Electronics

Canada . 1 parts In-Stock

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IDEA Electronic Components Group

UK . 1,523 parts In-Stock

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$3.426

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-

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$3.083

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1,523

$3.426

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$3.083

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MKK Technologies

India . 116 parts In-Stock

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$6.443

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$6.443

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DigiPath Technology Company

USA . 116 parts In-Stock

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$6.443

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$6.443

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AZTECH Wire

Italy . 865 parts In-Stock

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$16.230

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$16.230

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QUARKTWIN TECHNOLOGY LTD

USA . 25,370 parts In-Stock

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Assy Fe

Spain . 16,000 parts In-Stock

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Microchip USA

USA . 5,561 parts In-Stock

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Parana Technologies

USA . 2,329 parts In-Stock

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$4.096

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Metaverse IC Inc.

Canada . 2,000 parts In-Stock

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Perfect Parts

USA . 1,004 parts In-Stock

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Corphita

USA . 667 parts In-Stock

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Cyclops Electronics Ltd (Excess)

UK . 448 parts In-Stock

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Glotronic Ltd.

UK . 358 parts In-Stock

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Kepictronics

USA . 322 parts In-Stock

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A-Z Elektronik GmbH

Germany . 183 parts In-Stock

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Overview

Elevate your audio experience with the TDA7348D from STMicroelectronics, a leading manufacturer known for delivering top-quality components. This audio control IC offers unparalleled channel separation of 100 dB and ultra-low harmonic distortion of just 0.01%. Perfect for tone control circuits, this small outline package comes with dual terminals for easy installation. Ideal for industrial applications, this BICMOS technology product operates in temperatures ranging from -40 to 85 °C. Upgrade your audio devices with the TDA7348D and enjoy crystal-clear sound like never before.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy is a common and durable material for IC packages, providing good protection for the internal components of the device.

Surface Mount: YES

Surface mount technology allows for easy and efficient installation of the IC onto circuit boards, saving time and effort during manufacturing.

General IC Type: TONE CONTROL CIRCUIT

This IC is specifically designed for tone control circuits, ensuring high-quality audio output and precise sound adjustments.

Channel Separation: 100 dB

High channel separation helps reduce crosstalk and interference between audio channels, resulting in clearer and more distinct audio signals.

Harmonic Distortion: 0.01%

With very low harmonic distortion, this IC can accurately reproduce audio signals without introducing unwanted noise or artifacts.

Power Supplies (V): 9

Operating at 9V allows for compatibility with a wide range of audio equipment and power sources.

No. of Terminals: 28

Having a high number of terminals provides flexibility for connecting to various components and peripherals in the circuit.

Package Style (Meter): SMALL OUTLINE

The small outline package design saves space on the circuit board, making it suitable for compact audio devices.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, this IC can withstand elevated temperatures without compromising performance or reliability.

No. of Bands: 2

Having two bands allows for versatile tone control options, enabling users to adjust both low and high frequencies for optimal audio quality.

Minimum Operating Temperature: -40 °C

The wide temperature range of -40 to 85 °C ensures reliable operation in various environmental conditions.

Terminal Finish: NICKEL PALLADIUM GOLD

Nickel Palladium Gold terminal finish provides excellent conductivity and corrosion resistance, ensuring long-term reliability and performance.

No. of Channels: 2

Operating with two channels allows for stereo audio output, providing a more immersive listening experience for users.

Technical Specifications

Audio Control ICs TDA7348D attributes and parameters. Explore more Audio Control ICs devices from STMicroelectronics

Specs

Channel Separation:

100 dB

General IC Type:

Harmonic Distortion:

.01 %

JESD-30 Code:

R-PDSO-G28

JESD-609 Code:

e4

Length:

17.9 mm

No. of Bands:

2

No. of Channels:

2

No. of Functions:

1

No. of Terminals:

28

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP28,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Power Supplies (V):

9

Qualification:

Not Qualified

Maximum Seated Height:

2.65 mm

Sub-Category:

Audio Control ICs

Maximum Supply Current:

15 mA

Maximum Supply Voltage (Vsup):

10.2 V

Minimum Supply Voltage (Vsup):

6 V

Surface Mount:

YES

Technology:

BICMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width:

7.5 mm

Trade Compliance

TDA7348D General Purpose ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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