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LMC1982CIV

Texas Instruments

LMC1982CIV by Texas Instruments

LMC1982CIV by Texas Instruments is a CMOS audio control IC with 2 channels, offering 80 dB channel separation and 0.5% harmonic distortion. Ideal for tone control circuits in industrial applications, it operates b/w -40 to 85°C with power supplies ranging from 6-12V.

Median Price

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Lifecycle Status

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6

In-Stock Inventory

1k+

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Digiode

USA . 2,594 parts In-Stock

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Anansix

USA . 2,565 parts In-Stock

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Vyrian

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Prism Electronics

USA . 54 parts In-Stock

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PC Components Company LLC

USA . 9 parts In-Stock

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Bristol Electronics

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Parana Technologies

USA . 462 parts In-Stock

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$2.684

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$3.168

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ChromeModa Solutions

Germany . 6,741 parts In-Stock

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$3.016

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$2.473

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IDEA Electronic Components Group

UK . 2,249 parts In-Stock

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$2.714

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One Stop Electronics

USA . 660 parts In-Stock

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$7.800

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AZTECH Wire

Italy . 757 parts In-Stock

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Authorized Procurement Solutions

USA . 12,000 parts In-Stock

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Corphita

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Alle Elektronik GmbH

Germany . 4,105 parts In-Stock

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DigiPath Technology Company

USA . 2,180 parts In-Stock

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Assy Fe

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Overview

Enhance your audio experience with the LMC1982CIV by Texas Instruments, a top-quality Audio Control IC that offers unparalleled performance and precision. Crafted by the renowned manufacturer, Texas Instruments, this innovative product is ideal for a wide range of applications in the audio industry. With its cutting-edge technology and advanced features, the LMC1982CIV delivers exceptional value, benefits, and advantages to customers seeking superior audio control solutions. Elevate your sound system with the LMC1982CIV and experience a new level of audio quality like never before.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components of the IC, ensuring a longer lifespan.

Surface Mount: YES

Easy and convenient installation on PCBs, saving time and effort during assembly.

Channel Separation: 80 dB

High channel separation results in clear and distinct audio output, enhancing the overall listening experience.

Harmonic Distortion: 0.5%

Low distortion ensures accurate and faithful reproduction of audio signals, maintaining audio quality.

Power Supplies (V): 9

Optimal power supply voltage for efficient operation and performance of the IC.

No. of Terminals: 28

Sufficient number of terminals for connectivity options and flexibility in circuit design.

Maximum Operating Temperature: 85 °C

Wide operating temperature range allows for reliable performance in various environmental conditions.

Minimum Operating Temperature: -40 °C

Ability to function in low-temperature environments without compromising performance.

Terminal Finish: TIN LEAD

Tin lead finish ensures good solderability and reliable connections during assembly.

No. of Bands: 2

Two bands provide sufficient control over the tone adjustment for customized audio output.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, enhancing efficiency and reliability.

Technical Specifications

Audio Control ICs LMC1982CIV attributes and parameters. Explore more Audio Control ICs devices from Texas Instruments

Specs

Channel Separation:

80 dB

General IC Type:

Harmonic Distortion:

.5 %

JESD-30 Code:

S-PQCC-J28

JESD-609 Code:

e0

Length:

11.43 mm

No. of Bands:

2

No. of Channels:

2

No. of Functions:

1

No. of Terminals:

28

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LDCC28,.5SQ

Package Shape:

Package Style (Meter):

CHIP CARRIER

Power Supplies (V):

9

Qualification:

Not Qualified

Maximum Seated Height:

4.57 mm

Sub-Category:

Audio Control ICs

Maximum Supply Current:

25 mA

Maximum Supply Voltage (Vsup):

12 V

Minimum Supply Voltage (Vsup):

6 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Width:

11.43 mm

Trade Compliance

LMC1982CIV General Purpose ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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