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LM4840MT

Texas Instruments

LM4840MT by Texas Instruments

LM4840MT by Texas Instruments is a Volume Control Circuit IC with 2 channels, offering 65 dB channel separation and 10% harmonic distortion. This audio control IC is ideal for industrial applications requiring precise volume adjustments in compact spaces due to its small outline package style.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,382 parts In-Stock

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3,382

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Digiode

USA . 902 parts In-Stock

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902

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Anansix

USA . 613 parts In-Stock

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613

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Euro-Tech

UK . 31 parts In-Stock

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31

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 1,269 parts In-Stock

1+ parts

$2.670

100+ parts

-

1k+ parts

$3.155

10k+ parts

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1,269

$2.670

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$3.155

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DigiPath Technology Company

USA . 1,876 parts In-Stock

1+ parts

$2.940

100+ parts

$2.705

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1,876

$2.940

$2.705

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IDEA Electronic Components Group

UK . 1,687 parts In-Stock

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$3.000

100+ parts

-

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$2.700

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1,687

$3.000

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$2.700

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ChromeModa Solutions

Germany . 154 parts In-Stock

1+ parts

$3.000

100+ parts

$2.460

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154

$3.000

$2.460

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AZTECH Wire

Italy . 726 parts In-Stock

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$8.881

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726

$8.881

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One Stop Electronics

USA . 468 parts In-Stock

1+ parts

$18.800

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468

$18.800

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Alle Elektronik GmbH

Germany . 3,817 parts In-Stock

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3,817

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Corphita

USA . 2,433 parts In-Stock

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Overview

Enhance your audio experience with the LM4840MT by Texas Instruments, a high-quality volume control circuit designed to deliver exceptional sound performance. As a leading manufacturer in the industry, Texas Instruments ensures reliability and innovation in every product. Ideal for a wide range of applications, this audio control IC offers customers value, benefits, and advantages that will elevate their audio systems to new heights. Upgrade your audio setup today with the LM4840MT and immerse yourself in superior sound quality like never before.

Feature Benefit Bullets

Package Body Material - PLASTIC/EPOXY

Plastic and epoxy materials are durable and lightweight, making the product reliable and easy to handle.

Surface Mount - YES

Surface mount technology allows for easy installation and soldering onto a circuit board, saving time and effort in assembly.

Channel Separation - 65 dB

High channel separation ensures clear and distinct audio signals from both channels, offering a high-quality listening experience.

Harmonic Distortion - 10%

Low harmonic distortion means that the audio output will be clean and free from unwanted noise or interference, providing better sound quality.

No. of Terminals - 28

Having a high number of terminals allows for versatile connectivity options and flexibility in circuit design.

Maximum Operating Temperature - 85 °C

With a high maximum operating temperature, the product can withstand heat stress and operate reliably in various environments.

Minimum Operating Temperature -40 °C

The wide temperature range ensures the product can function in both hot and cold conditions, making it suitable for diverse applications.

Minimum Supply Voltage (Vsup) - 2.7 V

Low minimum supply voltage requirement allows for operation in low-power applications and extends battery life.

No. of Channels - 2

Dual channels provide stereo audio output, enhancing the audio experience and allowing for more immersive sound.

Maximum Supply Voltage (Vsup) - 5.5 V

High maximum supply voltage ensures compatibility with a wide range of power sources and voltage levels, making the product versatile.

Technical Specifications

Audio Control ICs LM4840MT attributes and parameters. Explore more Audio Control ICs devices from Texas Instruments

Specs

Additional Features:

BRIDGED MODE OPERATION 70 DB CHANNEL SEPARATION ALSO AVAILABLE; SEATED HT_TYP

Channel Separation:

65 dB

General IC Type:

Harmonic Distortion:

10 %

JESD-30 Code:

R-PDSO-G28

Length:

9.7 mm

No. of Channels:

2

No. of Functions:

1

No. of Terminals:

28

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Maximum Seated Height:

1.1 mm

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

2.7 V

Surface Mount:

YES

Temperature Grade:

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Width:

4.4 mm

Trade Compliance

LM4840MT General Purpose ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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