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LV3319PM

Onsemi

LV3319PM by Onsemi

LV3319PM by Onsemi is an Audio Control IC with 80 dB Channel Separation and 0.01% Harmonic Distortion. It operates on a power supply of 7-9.5V, suitable for industrial applications requiring precise tone control circuits in a compact square package. With BICMOS technology, this IC offers high performance in a small footprint for audio systems.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Digiode

USA . 1,873 parts In-Stock

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Vyrian

USA . 1,335 parts In-Stock

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1,335

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Problanco Electronics

Mexico . 4,214 parts In-Stock

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4,214

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TANS Electronics

Latvia . 3,254 parts In-Stock

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3,254

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Kulean Microsystems

USA . 3,046 parts In-Stock

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SupplyDigital Components

Austria . 2,123 parts In-Stock

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Kepictronics

USA . 500 parts In-Stock

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500

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UHIMA Technologies

Türkiye . 308 parts In-Stock

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308

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Corphita

USA . 237 parts In-Stock

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Corohmni

South Africa . 62 parts In-Stock

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Overview

Enhance your audio experience with the LV3319PM by Onsemi, a top-quality Audio Control IC that promises unparalleled performance and reliability. Crafted by the trusted manufacturer Onsemi, this innovative product is perfect for a wide range of applications in the audio industry. With its advanced technology and sleek design, the LV3319PM offers customers exceptional value, benefits, and advantages that will elevate their sound systems to new heights. Upgrade your audio control with the LV3319PM and feel the difference in every note.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the IC, ensuring reliable performance even in harsh environments.

Surface Mount: YES

Ease of installation and space-saving design make this IC suitable for compact electronic devices.

Channel Separation: 80 dB

High channel separation ensures clear and distinct audio signals for an improved listening experience.

Harmonic Distortion: 0.01%

Low harmonic distortion results in cleaner audio output with minimal interference or noise.

Power Supplies (V): 9

Operating at 9V allows for suitable power input and performance levels for various audio applications.

No. of Terminals: 44

With a higher number of terminals, this IC offers more connectivity options for versatile circuit designs.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, this IC can withstand elevated temperatures without compromising performance.

No. of Bands: 3

Having three bands allows for more precise tone control adjustments, catering to different audio preferences.

Technology: BICMOS

The BICMOS technology combines the benefits of both bipolar and CMOS technologies, providing high performance and low power consumption.

Technical Specifications

Audio Control ICs LV3319PM attributes and parameters. Explore more Audio Control ICs devices from Onsemi

Specs

Channel Separation:

80 dB

General IC Type:

Harmonic Distortion:

.01 %

JESD-30 Code:

S-PQFP-G44

Length:

10 mm

No. of Bands:

3

No. of Channels:

2

No. of Functions:

1

No. of Terminals:

44

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

QFP

Package Equivalence Code:

QFP44,.52SQ,32

Package Shape:

Package Style (Meter):

FLATPACK

Power Supplies (V):

9

Qualification:

Not Qualified

Maximum Seated Height:

2.8 mm

Sub-Category:

Audio Control ICs

Maximum Supply Voltage (Vsup):

9.5 V

Minimum Supply Voltage (Vsup):

7 V

Surface Mount:

YES

Technology:

BICMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

QUAD

Width:

10 mm

Trade Compliance

LV3319PM General Purpose ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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