Loading...

LV3328PM-TLM-E

Onsemi

LV3328PM-TLM-E by Onsemi

LV3328PM-TLM-E by Onsemi is an Audio Control IC with 44 terminals, operating at -40 to 85 °C. It has a power supply of 9V and uses BICMOS technology. Ideal for industrial applications requiring precise audio control in a compact square package.

Median Price

$2.686

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 975 parts In-Stock

1+ parts

-

100+ parts

$2.460

1k+ parts

$2.200

10k+ parts

$2.070

975

-

$2.460

$2.200

$2.070

Verical

USA . 975 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$2.913

10k+ parts

-

975

-

-

$2.913

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,270 parts In-Stock

1+ parts

$2.594

100+ parts

-

1k+ parts

-

10k+ parts

-

1,270

$2.594

-

-

-

Vyrian

USA . 6,322 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

6,322

-

-

-

-

DigiKey Marketplace

USA . 975 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

975

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 633 parts In-Stock

1+ parts

$2.457

100+ parts

-

1k+ parts

-

10k+ parts

-

633

$2.457

-

-

-

Corohmni

South Africa . 171 parts In-Stock

1+ parts

$2.730

100+ parts

-

1k+ parts

-

10k+ parts

-

171

$2.730

-

-

-

AZTECH Wire

Italy . 499 parts In-Stock

1+ parts

$12.150

100+ parts

-

1k+ parts

-

10k+ parts

-

499

$12.150

-

-

-

SupplyDigital Components

Austria . 7,525 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

7,525

-

-

-

-

Kulean Microsystems

USA . 5,440 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

5,440

-

-

-

-

TANS Electronics

Latvia . 1,713 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,713

-

-

-

-

UHIMA Technologies

Türkiye . 703 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

703

-

-

-

-

Problanco Electronics

Mexico . 294 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

294

-

-

-

-

Microchip USA

USA . 117 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

117

-

-

-

-

Overview

Unleash the power of audio control with the LV3328PM-TLM-E by Onsemi. Crafted with precision and expertise, this innovative product is designed to elevate your audio experience to new heights. Whether you're a tech enthusiast, a music lover, or a professional in the industry, this gem from Onsemi promises seamless integration, reliability, and top-notch performance. Say goodbye to subpar sound quality and hello to crystal-clear audio with the LV3328PM-TLM-E. Elevate your audio projects and take them to the next level with this cutting-edge product.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package body material ensures that the product is durable and resistant to external impacts.

Surface Mount: YES

Being surface mountable makes installation easier and allows for space-saving on the PCB.

Package Shape: SQUARE

The square package shape provides a good balance between space efficiency and ease of handling during assembly.

Power Supplies (V): 9

Operates on a standard voltage of 9V, making it compatible with various power sources.

No. of Terminals: 44

Having 44 terminals allows for a more complex circuit design and connectivity options.

Package Style (Meter): FLATPACK

The flatpack style offers improved thermal characteristics and better heat dissipation for the IC.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature of 85 °C, the IC can withstand harsh environmental conditions.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature of -40 °C ensures reliable performance even in cold environments.

Terminal Finish: Tin/Bismuth (Sn/Bi)

The tin/bismuth terminal finish provides excellent solderability and corrosion resistance.

Terminal Position: QUAD

The quad terminal position allows for efficient routing and connection of signals within the circuit.

Temperature Grade: INDUSTRIAL

Designed for industrial applications, this IC can reliably operate in demanding environments.

Technology: BICMOS

Utilizing BiCMOS technology offers a good balance between high performance and low power consumption.

Terminal Form: GULL WING

The gull wing terminal form provides mechanical strength and ease of soldering during assembly.

Terminal Pitch: 0.8 mm

With a terminal pitch of 0.8mm, the IC allows for compact and high-density PCB designs.

Moisture Sensitivity Level (MSL): 4

Having a moisture sensitivity level of 4 indicates that the IC can withstand exposure to moderate levels of moisture during storage or operation.

Technical Specifications

Audio Control ICs LV3328PM-TLM-E attributes and parameters. Explore more Audio Control ICs devices from Onsemi

Specs

JESD-30 Code:

S-PQFP-G44

JESD-609 Code:

e6

Moisture Sensitivity Level (MSL):

4

No. of Terminals:

44

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

QFP

Package Equivalence Code:

QFP44,.52SQ,32

Package Shape:

Package Style (Meter):

FLATPACK

Power Supplies (V):

9

Qualification:

Not Qualified

Sub-Category:

Audio Control ICs

Surface Mount:

YES

Technology:

BICMOS

Temperature Grade:

Terminal Finish:

Tin/Bismuth (Sn/Bi)

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

QUAD

Trade Compliance

LV3328PM-TLM-E General Purpose ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

previous next
The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

Similar products 14