Loading...

LV3311PNM

Onsemi

LV3311PNM by Onsemi

LV3311PNM by Onsemi is a BICMOS audio control IC with 2 channels and 3 bands. It offers 80 dB channel separation, 0.01% harmonic distortion, and operates b/w -40 to 85 °C. Ideal for tone control circuits in industrial applications requiring precise audio adjustments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 1,702 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,702

-

-

-

-

Digiode

USA . 676 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

676

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

SupplyDigital Components

Austria . 8,335 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

8,335

-

-

-

-

Kulean Microsystems

USA . 6,856 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

6,856

-

-

-

-

Problanco Electronics

Mexico . 3,983 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,983

-

-

-

-

TANS Electronics

Latvia . 1,609 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,609

-

-

-

-

Corphita

USA . 737 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

737

-

-

-

-

UHIMA Technologies

Türkiye . 454 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

454

-

-

-

-

Corohmni

South Africa . 156 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

156

-

-

-

-

Overview

Enhance your audio experience with the LV3311PNM by Onsemi. Crafted with precision and expertise, this Audio Control IC delivers superior quality and performance. Perfect for a wide range of applications, this innovative product offers unparalleled value to customers seeking crystal clear sound and seamless tone control. Elevate your audio projects with the LV3311PNM and discover a world of possibilities in sound engineering. Trust Onsemi for cutting-edge solutions that exceed expectations.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is durable and cost-effective, making the product reliable for long-term use.

Surface Mount: YES

Surface mount technology allows for easy installation on circuit boards, saving space and making assembly more efficient.

Channel Separation: 80 dB

High channel separation ensures clear and distinct audio signals for each channel, enhancing overall sound quality.

Harmonic Distortion: 0.01 %

Low harmonic distortion means minimal signal interference, resulting in cleaner and more accurate audio output.

Power Supplies (V): 8

Operating at a power supply of 8V ensures stable performance and reliable power delivery.

No. of Terminals: 44

Having a high number of terminals allows for more connectivity options and flexibility in circuit design.

Temperature Grade: INDUSTRIAL

Rated for industrial temperatures, this product can withstand harsh environmental conditions, making it suitable for a wide range of applications.

No. of Channels: 2

With 2 channels, this product can process stereo audio signals, providing a more immersive audio experience.

Technology: BICMOS

Utilizing BICMOS technology combines the advantages of both bipolar and CMOS technologies, offering high-speed performance and low power consumption.

Technical Specifications

Audio Control ICs LV3311PNM attributes and parameters. Explore more Audio Control ICs devices from Onsemi

Specs

Channel Separation:

80 dB

General IC Type:

Harmonic Distortion:

.01 %

JESD-30 Code:

S-PQFP-G44

Length:

10 mm

No. of Bands:

3

No. of Channels:

2

No. of Functions:

1

No. of Terminals:

44

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

QFP

Package Equivalence Code:

QFP44,.52SQ,32

Package Shape:

Package Style (Meter):

FLATPACK

Power Supplies (V):

8

Qualification:

Not Qualified

Maximum Seated Height:

2.8 mm

Sub-Category:

Audio Control ICs

Maximum Supply Voltage (Vsup):

9 V

Minimum Supply Voltage (Vsup):

7 V

Surface Mount:

YES

Technology:

BICMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

QUAD

Width:

10 mm

Trade Compliance

LV3311PNM General Purpose ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

previous next
The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

Similar products 20