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LM48557URX/NOPB

Texas Instruments

LM48557URX/NOPB by Texas Instruments

LM48557URX/NOPB by Texas Instruments is a Volume Control Circuit IC with 16 terminals. It operates b/w -40 to 85°C, with supply voltage range of 2.7-4.5V and max current draw of 8mA. Ideal for audio applications requiring precise volume control in compact designs.

Median Price

$1.846

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 17,950 parts In-Stock

1+ parts

$1.846

100+ parts

$1.524

1k+ parts

$0.824

10k+ parts

-

17,950

$1.846

$1.524

$0.824

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 491 parts In-Stock

1+ parts

$1.754

100+ parts

-

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-

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491

$1.754

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Vyrian

USA . 3,211 parts In-Stock

1+ parts

$1.846

100+ parts

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3,211

$1.846

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Anansix

USA . 329 parts In-Stock

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329

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SPM Sales

USA . 180 parts In-Stock

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180

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 1,189 parts In-Stock

1+ parts

$0.330

100+ parts

$30.663

1k+ parts

$0.297

10k+ parts

-

1,189

$0.330

$30.663

$0.297

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DigiPath Technology Company

USA . 81 parts In-Stock

1+ parts

$0.364

100+ parts

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81

$0.364

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ChromeModa Solutions

Germany . 1,777 parts In-Stock

1+ parts

$0.371

100+ parts

$0.304

1k+ parts

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1,777

$0.371

$0.304

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IDEA Electronic Components Group

UK . 236 parts In-Stock

1+ parts

$0.371

100+ parts

-

1k+ parts

$0.334

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236

$0.371

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$0.334

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Corphita

USA . 4,824 parts In-Stock

1+ parts

$1.661

100+ parts

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4,824

$1.661

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Microchip USA

USA . 1,168 parts In-Stock

1+ parts

$7.303

100+ parts

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1,168

$7.303

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Overview

Unlock the power of superior audio control with the LM48557URX/NOPB by Texas Instruments. As a leading manufacturer in the industry, this volume control circuit offers unmatched quality and reliability. Ideal for a wide range of applications, this audio control IC provides customers with precise control over their audio experience. With a compact package design and industrial-grade temperature tolerance, this product delivers exceptional value and performance. Upgrade your audio systems with the LM48557URX/NOPB and experience the difference today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material makes the package lightweight and durable, ideal for portable or handheld devices.

Surface Mount: YES

Surface mount design allows for easy and efficient assembly, saving time and cost in manufacturing processes.

Package Shape: SQUARE

Square package shape allows for efficient use of board space, perfect for compact electronic devices.

General IC Type: VOLUME CONTROL CIRCUIT

Volume control circuit provides precise and reliable audio adjustment, ensuring high-quality sound output.

Power Supplies (V): 1.7/4.5,4.2

Wide range of power supply options allows for versatile compatibility with different devices and systems.

No. of Terminals: 16

Having 16 terminals provides flexibility in connecting to other components and peripherals, enhancing functionality.

Package Style (Meter): GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Grid array style with a thin profile and fine pitch offers high density and miniaturization, suitable for compact designs.

Maximum Operating Temperature: 85 °C

High operating temperature range ensures reliable performance in various environmental conditions.

Minimum Operating Temperature: -40 °C

Low minimum operating temperature allows for usage in cold environments without compromising functionality.

Terminal Finish: TIN SILVER COPPER

Terminal finish with tin, silver, and copper provides excellent conductivity and corrosion resistance for long-term reliability.

Terminal Position: BOTTOM

Bottom terminal position facilitates easy and secure soldering during assembly.

Maximum Seated Height: 0.395 mm

Low seated height allows for a slim and compact overall design, suitable for space-constrained applications.

Width: 1.96 mm

Narrow width enables the integration of the IC into small form factor devices without compromising performance.

Minimum Supply Voltage (Vsup): 2.7 V

Low minimum supply voltage ensures power efficiency and compatibility with a wide range of power sources.

Maximum Time At Peak Reflow Temperature (s): 30

Extended time at peak reflow temperature allows for reliable and secure solder connections during manufacturing processes.

Peak Reflow Temperature °C: 260

High peak reflow temperature capability ensures the IC can withstand the rigors of soldering without damage.

Length: 1.96 mm

Compact length contributes to the overall small footprint of the IC, making it suitable for space-constrained designs.

Temperature Grade: INDUSTRIAL

Industrial temperature grade ensures the IC can operate reliably in harsh industrial environments without performance degradation.

Terminal Form: BALL

Ball terminal form enables secure connections with other components, ensuring stability and longevity of the circuit.

Maximum Supply Current: 8 mA

Low maximum supply current consumption enables energy-efficient operation, ideal for battery-powered devices.

Terminal Pitch: 0.5 mm

Fine terminal pitch allows for high-density mounting, optimizing board space utilization and enabling compact designs.

Maximum Supply Voltage (Vsup): 4.5 V

High maximum supply voltage capability provides flexibility in power source options, accommodating a wide range of voltage levels.

Technical Specifications

Audio Control ICs LM48557URX/NOPB attributes and parameters. Explore more Audio Control ICs devices from Texas Instruments

Specs

General IC Type:

JESD-30 Code:

S-PBGA-B16

JESD-609 Code:

e1

Length:

1.96 mm

Moisture Sensitivity Level (MSL):

1

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA16,4X4,20

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.7/4.5,4.2

Qualification:

Not Qualified

Maximum Seated Height:

.395 mm

Sub-Category:

Audio/Video Amplifiers

Maximum Supply Current:

8 mA

Maximum Supply Voltage (Vsup):

4.5 V

Minimum Supply Voltage (Vsup):

2.7 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

1.96 mm

Trade Compliance

LM48557URX/NOPB General Purpose ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.33.00.01

SB

8542.33.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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