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TDA7449D13TR

STMicroelectronics

TDA7449D13TR by STMicroelectronics

TDA7449D13TR by STMicroelectronics is a dual-channel tone control IC designed for high-quality audio applications. It features 100 dB channel separation, 0.01% harmonic distortion, and operates b/w 6V to 10.2V. Ideal for enhancing sound in consumer electronics, it comes in a compact SO package.

Median Price

$8.960

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Bristol Electronics

USA . 517 parts In-Stock

1+ parts

$8.960

100+ parts

$3.882

1k+ parts

$3.674

10k+ parts

-

517

$8.960

$3.882

$3.674

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Vyrian

USA . 7,346 parts In-Stock

1+ parts

-

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-

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7,346

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Anansix

USA . 2,187 parts In-Stock

1+ parts

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2,187

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Cyclops Electronics Ltd

UK . 2,000 parts In-Stock

1+ parts

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2,000

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Digiode

USA . 1,639 parts In-Stock

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1,639

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ACDS - Activité Composants Distribution Service

France . 517 parts In-Stock

1+ parts

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517

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Dan-Mar Components

USA . 517 parts In-Stock

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517

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 1,293 parts In-Stock

1+ parts

$0.282

100+ parts

-

1k+ parts

$0.253

10k+ parts

-

1,293

$0.282

-

$0.253

-

MKK Technologies

India . 947 parts In-Stock

1+ parts

$0.529

100+ parts

-

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947

$0.529

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-

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DigiPath Technology Company

USA . 947 parts In-Stock

1+ parts

$0.529

100+ parts

-

1k+ parts

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947

$0.529

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Microchip USA

USA . 1,741 parts In-Stock

1+ parts

$2.231

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1,741

$2.231

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AZTECH Wire

Italy . 947 parts In-Stock

1+ parts

$17.210

100+ parts

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947

$17.210

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Corphita

USA . 4,998 parts In-Stock

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4,998

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Kepictronics

USA . 4,500 parts In-Stock

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4,500

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Authorized Procurement Solutions

USA . 4,000 parts In-Stock

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4,000

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Perfect Parts

USA . 2,240 parts In-Stock

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2,240

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Epart123

USA . 2,000 parts In-Stock

1+ parts

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2,000

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GreenTree Electronics

Israel . 2,000 parts In-Stock

1+ parts

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2,000

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Parana Technologies

USA . 1,008 parts In-Stock

1+ parts

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100+ parts

$0.337

1k+ parts

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10k+ parts

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1,008

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$0.337

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Overview

Elevate your audio experience with the TDA7449D13TR from STMicroelectronics, a leader in high-quality semiconductor solutions. This advanced tone control IC offers exceptional sound clarity and precise control, making it ideal for home audio systems, automotive applications, and professional sound equipment. With superior channel separation and minimal distortion, enjoy rich, immersive audio that meets the highest standards—bringing unparalleled value and performance to your projects.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The durable plastic/epoxy material provides excellent protection and enhances longevity in various environments.

Surface Mount: YES

Surface mount capability allows for smaller footprints on PCBs, making design more compact and efficient.

Package Shape: RECTANGULAR

The rectangular shape optimizes space on the PCB and allows for easier alignment and placement during assembly.

General IC Type: TONE CONTROL CIRCUIT

As a tone control circuit, this IC offers enhanced sound quality and customization for audio applications, making it ideal for audio devices.

Channel Separation: 100 dB

High channel separation reduces crosstalk, ensuring clearer stereo sound and improved audio fidelity.

Harmonic Distortion: 0.01 %

Low harmonic distortion ensures that the audio signal remains clean and true to the original source, enhancing listening experience.

No. of Terminals: 20

A higher number of terminals facilitates more connections and functionality, allowing for versatile integration in complex systems.

Package Style (Meter): SMALL OUTLINE

The small outline package style promotes space-saving designs, ideal for compact electronic devices.

Maximum Operating Temperature: 70 °C

Operating up to 70 °C ensures reliable functioning in various temperature conditions, suitable for a wide range of applications.

No. of Bands: 2

Two-band control provides sufficient flexibility for tuning audio signals, enabling better customization of sound.

Minimum Operating Temperature: 0 °C

With a minimum operating temperature of 0 °C, this product can reliably function in cold environments, maintaining performance integrity.

Terminal Position: DUAL

Dual terminal positions improve layout options on the PCB, allowing for optimized signal routing and better space management.

Maximum Seated Height: 2.65 mm

Low seated height is advantageous for low-profile designs, ideal for modern slim electronic devices.

Width: 7.5 mm

The compact width of 7.5 mm facilitates integration into tight spaces, ideal for miniaturized audio products.

Minimum Supply Voltage (Vsup): 6 V

A minimum supply voltage of 6V ensures compatibility with a variety of power sources, enhancing versatility in applications.

Length: 12.8 mm

The length of 12.8 mm contributes to the small footprint characteristic of modern IC designs, suitable for space-constrained projects.

No. of Channels: 2

With two channels, this IC allows for stereo audio processing, essential for high-quality sound reproduction in audio systems.

Technology: BICMOS

BICMOS technology combines the advantages of both bipolar and CMOS processes, offering high-speed performance with low power consumption.

Terminal Form: GULL WING

Gull wing terminals ensure reliable soldering and make the component easier to handle during assembly.

Terminal Pitch: 1.27 mm

A terminal pitch of 1.27 mm makes it compatible with a wide range of PCB layouts and components, enhancing design flexibility.

Maximum Supply Voltage (Vsup): 10.2 V

The maximum supply voltage of 10.2V allows for robust performance under various electrical conditions, ensuring reliability in diverse applications.

Technical Specifications

Audio Control ICs TDA7449D13TR attributes and parameters. Explore more Audio Control ICs devices from STMicroelectronics

Specs

Channel Separation:

100 dB

General IC Type:

Harmonic Distortion:

.01 %

JESD-30 Code:

R-PDSO-G20

Length:

12.8 mm

No. of Bands:

2

No. of Channels:

2

No. of Functions:

1

No. of Terminals:

20

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP20,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Maximum Seated Height:

2.65 mm

Maximum Supply Voltage (Vsup):

10.2 V

Minimum Supply Voltage (Vsup):

6 V

Surface Mount:

YES

Technology:

BICMOS

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width:

7.5 mm

Trade Compliance

TDA7449D13TR General Purpose ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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