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LM4838ITL

Texas Instruments

LM4838ITL by Texas Instruments

LM4838ITL by Texas Instruments is a 2-channel audio control IC with 65 dB channel separation and 10% harmonic distortion. It features a grid array package style, suitable for industrial temperature applications. Ideal for volume control circuits in compact electronic devices.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 8,676 parts In-Stock

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Digiode

USA . 2,559 parts In-Stock

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Anansix

USA . 2,394 parts In-Stock

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ACDS - Activité Composants Distribution Service

France . 250 parts In-Stock

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250

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Distributors (Availability)

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Parana Technologies

USA . 472 parts In-Stock

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$2.748

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$3.231

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472

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$3.231

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DigiPath Technology Company

USA . 1,098 parts In-Stock

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$3.026

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$2.784

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1,098

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$2.784

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ChromeModa Solutions

Germany . 5,346 parts In-Stock

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$3.088

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$2.532

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5,346

$3.088

$2.532

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IDEA Electronic Components Group

UK . 792 parts In-Stock

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$3.088

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$2.779

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792

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AZTECH Wire

Italy . 474 parts In-Stock

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$7.398

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One Stop Electronics

USA . 669 parts In-Stock

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$16.800

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669

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Corphita

USA . 3,727 parts In-Stock

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Perfect Parts

USA . 560 parts In-Stock

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560

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Cyclops Electronics Ltd (Excess)

UK . 250 parts In-Stock

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Glotronic Ltd.

UK . 200 parts In-Stock

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Overview

Enhance your audio experience with the LM4838ITL by Texas Instruments. Known for their superior quality, Texas Instruments delivers cutting-edge Audio Control ICs that excel in a wide range of applications. This volume control circuit offers remarkable value, providing customers with clear channel separation and low harmonic distortion. With its compact square package and surface mount design, this product is perfect for industrial-grade systems where high-performance audio is essential. Elevate your sound system with the LM4838ITL and enjoy immersive audio like never before.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material provides good durability and reliability, making the product suitable for long-term use.

Surface Mount: YES

Surface mount capability allows for easy installation and space-saving on circuit boards.

Package Shape: SQUARE

Square package shape helps in easy handling and efficient placement on the PCB.

Channel Separation: 65 dB

High channel separation ensures clear and distinct audio signals on each channel, reducing interference and crosstalk.

Harmonic Distortion: 10 %

Low harmonic distortion results in high-quality audio output with minimal distortion or noise.

No. of Terminals: 36

Having 36 terminals allows for greater connectivity and functionality within the circuit design.

Maximum Operating Temperature: 85 °C

High maximum operating temperature provides reliability in various environments and ensures stable performance.

Minimum Operating Temperature: -40 °C

Low minimum operating temperature allows for usage in extreme conditions without compromising performance.

Terminal Position: BOTTOM

Bottom terminal position facilitates easy soldering and ensures secure connections on the PCB.

Maximum Seated Height: 0.675 mm

Low maximum seated height helps in compact design and saves space in electronic devices.

Width: 3 mm

Compact width of 3mm enables easy integration into smaller circuit layouts and compact devices.

Minimum Supply Voltage (Vsup): 2.7 V

Low minimum supply voltage requirement makes the product energy-efficient and suitable for battery-operated applications.

Length: 3 mm

Compact length of 3mm aids in space-saving and efficient placement on the PCB.

Temperature Grade: INDUSTRIAL

Industrial temperature grade ensures reliability and performance in harsh industrial environments.

No. of Channels: 2

Dual-channel audio control circuit provides stereo sound output, ensuring a richer audio experience.

Terminal Form: BALL

Ball terminal form ensures reliable electrical connections and ease of soldering during assembly.

Terminal Pitch: 0.5 mm

Fine terminal pitch of 0.5mm allows for high-density mounting and precise connections on the PCB.

Maximum Supply Voltage (Vsup): 5.5 V

High maximum supply voltage tolerance ensures compatibility with a wide range of power sources and applications.

Technical Specifications

Audio Control ICs LM4838ITL attributes and parameters. Explore more Audio Control ICs devices from Texas Instruments

Specs

Additional Features:

BRIDGED MODE OPERATION 70 DB CHANNEL SEPARATION ALSO AVAILABLE

Channel Separation:

65 dB

General IC Type:

Harmonic Distortion:

10 %

JESD-30 Code:

S-PBGA-B36

Length:

3 mm

No. of Channels:

2

No. of Functions:

1

No. of Terminals:

36

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Maximum Seated Height:

.675 mm

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

2.7 V

Surface Mount:

YES

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

BOTTOM

Width:

3 mm

Trade Compliance

LM4838ITL General Purpose ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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