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PGA4311U2

Texas Instruments

PGA4311U2 by Texas Instruments

PGA4311U2 by Texas Instruments is a 4-channel volume control circuit IC with +-5V power supplies. It comes in a small outline package, suitable for industrial applications with temperature range of -40 to 85 °C. The IC features CMOS technology and GULL WING terminals, making it ideal for audio control systems.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,594 parts In-Stock

1+ parts

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3,594

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Digiode

USA . 1,435 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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1,435

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 25 parts In-Stock

1+ parts

$1.864

100+ parts

-

1k+ parts

$2.410

10k+ parts

-

25

$1.864

-

$2.410

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DigiPath Technology Company

USA . 2,014 parts In-Stock

1+ parts

$2.052

100+ parts

-

1k+ parts

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2,014

$2.052

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ChromeModa Solutions

Germany . 1,453 parts In-Stock

1+ parts

$2.094

100+ parts

$1.717

1k+ parts

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10k+ parts

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1,453

$2.094

$1.717

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IDEA Electronic Components Group

UK . 475 parts In-Stock

1+ parts

$2.094

100+ parts

-

1k+ parts

$1.885

10k+ parts

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475

$2.094

-

$1.885

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AZTECH Wire

Italy . 601 parts In-Stock

1+ parts

$12.841

100+ parts

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601

$12.841

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One Stop Electronics

USA . 423 parts In-Stock

1+ parts

$13.800

100+ parts

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423

$13.800

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Corphita

USA . 995 parts In-Stock

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995

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Overview

Elevate your audio experience with the PGA4311U2 by Texas Instruments. Crafted with precision and expertise, this Audio Control IC offers unparalleled quality and performance in a compact package. Perfect for volume control circuits, this versatile device boasts 4 channels for maximum flexibility. Whether you're a seasoned professional or an avid music lover, the PGA4311U2 delivers exceptional value and benefits, making it the perfect choice for all your audio needs. Upgrade your sound system today and experience the difference with Texas Instruments.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides a lightweight and durable housing for the IC, making it suitable for various applications.

Surface Mount: YES

Allows for easy mounting on PCBs, saving space and simplifying the assembly process.

Package Shape: RECTANGULAR

Facilitates easy integration into circuit designs and PCB layouts.

General IC Type: VOLUME CONTROL CIRCUIT

Specifically designed for volume control applications, ensuring optimal performance and functionality.

Power Supplies (V): +-5

Supports a wide range of voltage inputs, enhancing compatibility with different systems.

No. of Terminals: 28

Offers multiple connection points for enhanced functionality and flexibility in circuit design.

Package Style (Meter): SMALL OUTLINE

Compact form factor saves space on the PCB and allows for efficient placement.

Maximum Operating Temperature: 85 °C

Can withstand high temperatures, making it suitable for industrial applications.

Minimum Operating Temperature: -40 °C

Capable of operating in extreme cold environments without affecting performance.

Terminal Position: DUAL

Provides multiple terminal positions for versatile connectivity options.

Maximum Seated Height: 2.65 mm

Low profile design allows for compact integration into electronic devices.

Width: 7.5 mm

Narrow width enables efficient use of space on the PCB.

Minimum Supply Voltage (Vsup): 4.75 V

Can operate at low supply voltages, conserving power and reducing energy consumption.

Length: 17.905 mm

Optimal length for fitting into standard PCB layouts and enclosures.

Temperature Grade: INDUSTRIAL

Designed for industrial applications, ensuring reliability and durability in harsh environments.

No. of Channels: 4

Supports multi-channel audio control, offering more features and capabilities in audio systems.

Technology: CMOS

Utilizes CMOS technology for low power consumption and efficient operation.

Terminal Form: GULL WING

Gull wing terminals provide secure and reliable connections to the PCB.

Terminal Pitch: 1.27 mm

Standard terminal pitch for easy soldering and assembly.

Maximum Supply Voltage (Vsup): 5.25 V

Can handle higher supply voltages for increased performance capabilities.

Technical Specifications

Audio Control ICs PGA4311U2 attributes and parameters. Explore more Audio Control ICs devices from Texas Instruments

Specs

General IC Type:

JESD-30 Code:

R-PDSO-G28

Length:

17.905 mm

No. of Channels:

4

No. of Functions:

1

No. of Terminals:

28

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP28,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Power Supplies (V):

+-5

Qualification:

Not Qualified

Maximum Seated Height:

2.65 mm

Sub-Category:

Audio Control ICs

Maximum Supply Voltage (Vsup):

5.25 V

Minimum Supply Voltage (Vsup):

4.75 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width:

7.5 mm

Trade Compliance

PGA4311U2 General Purpose ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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