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PGA4311UAG4

Texas Instruments

PGA4311UAG4 by Texas Instruments

PGA4311UAG4 by Texas Instruments is a Volume Control Circuit with 130 dB Channel Separation, 4 Channels, and +-5V Power Supplies. It is used in audio applications requiring precise volume control in industrial settings. The IC features a small outline package style, dual terminal position, and operates b/w -40 to 85°C temperature range.

Median Price

$24.010

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 55 parts In-Stock

1+ parts

$24.010

100+ parts

$13.360

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55

$24.010

$13.360

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Distributors (In-Stock)

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Nova Conductors

Japan . 100 parts In-Stock

1+ parts

$14.950

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100

$14.950

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Digiode

USA . 1,388 parts In-Stock

1+ parts

$17.423

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1,388

$17.423

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Vyrian

USA . 3,054 parts In-Stock

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3,054

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Euro-Tech

UK . 39 parts In-Stock

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Component Sense

UK . 13 parts In-Stock

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Distributors (Availability)

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Corohmni

South Africa . 98 parts In-Stock

1+ parts

$0.222

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98

$0.222

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Parana Technologies

USA . 505 parts In-Stock

1+ parts

$2.081

100+ parts

-

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$2.600

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505

$2.081

-

$2.600

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DigiPath Technology Company

USA . 563 parts In-Stock

1+ parts

$2.291

100+ parts

$2.108

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563

$2.291

$2.108

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IDEA Electronic Components Group

UK . 2,032 parts In-Stock

1+ parts

$2.338

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$2.104

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2,032

$2.338

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ChromeModa Solutions

Germany . 12 parts In-Stock

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$2.338

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$1.917

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12

$2.338

$1.917

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Advanced Electronics

New Zealand . 50 parts In-Stock

1+ parts

$3.601

100+ parts

$3.421

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$3.421

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50

$3.601

$3.421

$3.421

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Continental Prestige Electronics

USA . 3,771 parts In-Stock

1+ parts

$14.950

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$14.651

3,771

$14.950

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$14.651

Semicontronic

India . 57 parts In-Stock

1+ parts

$15.590

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$15.200

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$15.122

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57

$15.590

$15.200

$15.122

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Corphita

USA . 407 parts In-Stock

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$16.506

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407

$16.506

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AZTECH Wire

Italy . 451 parts In-Stock

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$19.824

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451

$19.824

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Ampacity Inc.

Singapore . 57 parts In-Stock

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$33.930

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57

$33.930

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Microchip USA

USA . 2,242 parts In-Stock

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Argo Parts USA

USA . 2,050 parts In-Stock

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Overview

Upgrade your audio experience with the Texas Instruments PGA4311UAG4, a top-quality Audio Control IC designed to deliver unparalleled sound performance. With a reputation for excellence in the industry, Texas Instruments ensures that this product meets the highest standards of quality and reliability. Ideal for a wide range of applications, this Volume Control Circuit offers customers the value of precise volume adjustments, exceptional channel separation, and seamless integration. Elevate your audio system with the PGA4311UAG4 and enjoy the benefits of superior audio control like never before.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides good protection for the IC and ensures durability.

Surface Mount: YES

Allows for easy and secure mounting on PCBs.

Channel Separation: 130 dB

Ensures clear separation of audio channels, resulting in high quality sound output.

Power Supplies (V): +-5

Compatible with a wide range of power supplies, providing flexibility in design.

Maximum Operating Temperature: 85 °C

Can operate in high temperature environments, making it suitable for various applications.

No. of Channels: 4

Provides support for multi-channel audio control, ideal for stereo or surround sound systems.

Technology: CMOS

Low power consumption due to CMOS technology, enhancing efficiency.

Technical Specifications

Audio Control ICs PGA4311UAG4 attributes and parameters. Explore more Audio Control ICs devices from Texas Instruments

Specs

Channel Separation:

130 dB

General IC Type:

JESD-30 Code:

R-PDSO-G28

JESD-609 Code:

e4

Length:

17.905 mm

Moisture Sensitivity Level (MSL):

2

No. of Channels:

4

No. of Functions:

1

No. of Terminals:

28

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP28,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Power Supplies (V):

+-5

Qualification:

Not Qualified

Maximum Seated Height:

2.65 mm

Sub-Category:

Audio Control ICs

Maximum Supply Current:

24 mA

Maximum Supply Voltage (Vsup):

5.25 V

Minimum Supply Voltage (Vsup):

4.75 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

7.5 mm

Trade Compliance

PGA4311UAG4 General Purpose ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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