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PGA4311U

Texas Instruments

PGA4311U by Texas Instruments

PGA4311U by Texas Instruments is a 4-channel volume control circuit IC with 130 dB channel separation. It operates in industrial temperature range (-40 to 85°C) and requires +-5V power supplies. This small outline package IC, with gull wing terminals, is ideal for audio control applications.

Median Price

$14.366

Lifecycle Status

Suppliers In-Stock

10

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 10 parts In-Stock

1+ parts

$12.020

100+ parts

$11.300

1k+ parts

$10.220

10k+ parts

-

10

$12.020

$11.300

$10.220

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Texas Instruments

USA . 10,996 parts In-Stock

1+ parts

$14.366

100+ parts

$12.548

1k+ parts

$8.654

10k+ parts

-

10,996

$14.366

$12.548

$8.654

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DigiKey

USA . 322 parts In-Stock

1+ parts

$18.470

100+ parts

$12.729

1k+ parts

$11.939

10k+ parts

-

322

$18.470

$12.729

$11.939

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 741 parts In-Stock

1+ parts

$11.419

100+ parts

-

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741

$11.419

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-

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Nova Conductors

Japan . 550 parts In-Stock

1+ parts

$13.301

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550

$13.301

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Vyrian

USA . 2,584 parts In-Stock

1+ parts

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2,584

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ACDS - Activité Composants Distribution Service

France . 66 parts In-Stock

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66

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EMSNET

USA . 30 parts In-Stock

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30

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Sunrise Surplus Inc.

USA . 11 parts In-Stock

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11

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Electronics Depot

USA . 9 parts In-Stock

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9

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corohmni

South Africa . 120 parts In-Stock

1+ parts

$0.484

100+ parts

-

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120

$0.484

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Parana Technologies

USA . 174 parts In-Stock

1+ parts

$2.360

100+ parts

-

1k+ parts

$2.859

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174

$2.360

-

$2.859

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DigiPath Technology Company

USA . 670 parts In-Stock

1+ parts

$2.599

100+ parts

-

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670

$2.599

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ChromeModa Solutions

Germany . 6,993 parts In-Stock

1+ parts

$2.652

100+ parts

$2.175

1k+ parts

-

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6,993

$2.652

$2.175

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IDEA Electronic Components Group

UK . 262 parts In-Stock

1+ parts

$2.652

100+ parts

-

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$2.387

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262

$2.652

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$2.387

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Ampacity Inc.

Singapore . 2,767 parts In-Stock

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$10.220

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2,767

$10.220

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Semicontronic

India . 2,742 parts In-Stock

1+ parts

$10.220

100+ parts

$9.964

1k+ parts

$9.913

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2,742

$10.220

$9.964

$9.913

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Corphita

USA . 2,363 parts In-Stock

1+ parts

$10.818

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2,363

$10.818

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Continental Prestige Electronics

USA . 1,633 parts In-Stock

1+ parts

$13.301

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$13.035

1,633

$13.301

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-

$13.035

Netroflash

USA . 1,000 parts In-Stock

1+ parts

$13.301

100+ parts

-

1k+ parts

$12.636

10k+ parts

$12.370

1,000

$13.301

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$12.636

$12.370

Advanced Electronics

New Zealand . 70 parts In-Stock

1+ parts

$13.567

100+ parts

$13.567

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$13.567

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70

$13.567

$13.567

$13.567

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iodParts Technologies Inc.

India . 30,000 parts In-Stock

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Lixinc

USA . 5,548 parts In-Stock

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5,548

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Authorized Procurement Solutions

USA . 5,000 parts In-Stock

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A-Z Elektronik GmbH

Germany . 4,763 parts In-Stock

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4,763

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Futuretech Components

Singapore . 3,000 parts In-Stock

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Argo Parts USA

USA . 2,601 parts In-Stock

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2,601

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Kepictronics

USA . 241 parts In-Stock

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241

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Overview

Enhance your audio control experience with the PGA4311U by Texas Instruments. Crafted with precision and expertise, this volume control circuit offers unparalleled channel separation of 130 dB, ensuring crystal clear sound quality. Perfect for a wide range of applications, this small outline package IC provides 4 channels of seamless audio control. With Texas Instruments' reputation for top-notch quality and reliability, you can trust that the PGA4311U will deliver exceptional performance every time. Upgrade your audio system today with the PGA4311U and elevate your listening experience to new heights.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components of the IC.

Surface Mount: YES

Allows for easy and convenient installation on printed circuit boards.

Channel Separation: 130 dB

Ensures clear and distinct audio output for each channel.

Power Supplies (V): +-5

Offers a stable power supply range for optimum performance.

No. of Terminals: 28

Provides flexibility in connectivity and functionality.

Maximum Operating Temperature: 85 °C

Ensures reliable operation under varying environmental conditions.

Minimum Operating Temperature: -40 °C

Allows for use in extreme cold conditions without performance issues.

Technology: CMOS

Utilizes advanced CMOS technology for efficient operation and low power consumption.

Maximum Supply Current: 47 mA

Requires low power input while delivering high-quality audio control.

Technical Specifications

Audio Control ICs PGA4311U attributes and parameters. Explore more Audio Control ICs devices from Texas Instruments

Specs

Channel Separation:

130 dB

General IC Type:

JESD-30 Code:

R-PDSO-G28

JESD-609 Code:

e4

Length:

17.905 mm

Moisture Sensitivity Level (MSL):

2

No. of Channels:

4

No. of Functions:

1

No. of Terminals:

28

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP28,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Power Supplies (V):

+-5

Qualification:

Not Qualified

Maximum Seated Height:

2.65 mm

Sub-Category:

Audio Control ICs

Maximum Supply Current:

47 mA

Maximum Supply Voltage (Vsup):

5.25 V

Minimum Supply Voltage (Vsup):

4.75 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

7.5 mm

Trade Compliance

PGA4311U General Purpose ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.33.00.01

SB

8542.33.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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