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TPA0312PWPG4

Texas Instruments

TPA0312PWPG4 by Texas Instruments

TPA0312PWPG4 by Texas Instruments is an Audio Control IC with 1% Harmonic Distortion, 5V Power Supplies, and 24 Terminals. It is used for Volume Control Circuits in industrial applications due to its CMOS technology and dual terminal position. The IC operates b/w -40°C to 85°C temperature range.

Median Price

-

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,952 parts In-Stock

1+ parts

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5,952

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Digiode

USA . 1,643 parts In-Stock

1+ parts

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1,643

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Sea View Technologies

USA . 200 parts In-Stock

1+ parts

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200

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Bristol Electronics

USA . 200 parts In-Stock

1+ parts

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200

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 1,521 parts In-Stock

1+ parts

$0.183

100+ parts

-

1k+ parts

$1.515

10k+ parts

-

1,521

$0.183

-

$1.515

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ChromeModa Solutions

Germany . 611 parts In-Stock

1+ parts

$0.206

100+ parts

$0.169

1k+ parts

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10k+ parts

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611

$0.206

$0.169

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IDEA Electronic Components Group

UK . 203 parts In-Stock

1+ parts

$0.206

100+ parts

-

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$0.185

10k+ parts

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203

$0.206

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$0.185

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AZTECH Wire

Italy . 320 parts In-Stock

1+ parts

$11.809

100+ parts

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320

$11.809

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One Stop Electronics

USA . 525 parts In-Stock

1+ parts

$18.800

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525

$18.800

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A-Z Elektronik GmbH

Germany . 6,785 parts In-Stock

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6,785

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Corphita

USA . 2,543 parts In-Stock

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2,543

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DigiPath Technology Company

USA . 609 parts In-Stock

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100+ parts

$0.186

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609

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$0.186

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Overview

Enhance your audio experience with the TPA0312PWPG4 from Texas Instruments, a leading manufacturer known for its top-quality Audio Control ICs. This versatile volume control circuit is designed to deliver crystal-clear sound with minimal distortion, making it perfect for a wide range of applications. With a compact design and high-performance technology, this product offers unbeatable value and benefits to customers seeking superior audio control solutions. Upgrade your audio systems with the TPA0312PWPG4 and enjoy the unparalleled quality and performance that Texas Instruments is renowned for.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material offers good durability and protection for the internal components of the IC, ensuring long-term reliability.

Surface Mount: YES

Surface mount design allows for easy installation on PCBs, saving space and making the assembly process more efficient.

General IC Type: VOLUME CONTROL CIRCUIT

Specifically designed for volume control circuits, ensuring optimal performance in audio applications.

No. of Terminals: 24

Having a higher number of terminals enables more connectivity options and flexibility in circuit design.

Maximum Operating Temperature: 85 °C

Ability to operate at high temperatures makes this IC suitable for industrial applications where heat dissipation is a concern.

Minimum Operating Temperature: -40 °C

Wide temperature range allows for operation in extreme environmental conditions, increasing the versatility of the IC.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the IC energy-efficient and reliable in audio control applications.

Technical Specifications

Audio Control ICs TPA0312PWPG4 attributes and parameters. Explore more Audio Control ICs devices from Texas Instruments

Specs

General IC Type:

Harmonic Distortion:

1 %

JESD-30 Code:

R-PDSO-G24

JESD-609 Code:

e4

Length:

7.8 mm

Moisture Sensitivity Level (MSL):

2

No. of Bands:

1

No. of Channels:

2

No. of Functions:

1

No. of Terminals:

24

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP24,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Sub-Category:

Audio/Video Amplifiers

Maximum Supply Current:

10 mA

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

4.4 mm

Trade Compliance

TPA0312PWPG4 General Purpose ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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