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TAS5760LDAP

Texas Instruments

TAS5760LDAP by Texas Instruments

TAS5760LDAP by Texas Instruments is an Audio Control IC with 21W output power, -25 to 85°C operating temperature range, and 100dB noise figure. It is used in tone control circuits for audio applications requiring small outline packages with dual terminals.

Median Price

$4.176

Lifecycle Status

Suppliers In-Stock

11

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 2,703 parts In-Stock

1+ parts

$4.495

100+ parts

$3.665

1k+ parts

$2.443

10k+ parts

-

2,703

$4.495

$3.665

$2.443

-

Mouser Electronics

USA . 85 parts In-Stock

1+ parts

$8.730

100+ parts

$4.120

1k+ parts

-

10k+ parts

$3.900

85

$8.730

$4.120

-

$3.900

Chip1Stop

Japan . 552 parts In-Stock

1+ parts

-

100+ parts

$2.920

1k+ parts

-

10k+ parts

-

552

-

$2.920

-

-

Arrow

USA . 230 parts In-Stock

1+ parts

-

100+ parts

$3.554

1k+ parts

$3.270

10k+ parts

$2.986

230

-

$3.554

$3.270

$2.986

Avnet

USA . 132 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$3.952

10k+ parts

$3.851

132

-

-

$3.952

$3.851

Rochester

USA . 113 parts In-Stock

1+ parts

-

100+ parts

$3.520

1k+ parts

$3.150

10k+ parts

$2.960

113

-

$3.520

$3.150

$2.960

DigiKey

USA . 113 parts In-Stock

1+ parts

-

100+ parts

$4.630

1k+ parts

-

10k+ parts

-

113

-

$4.630

-

-

Verical

USA . 113 parts In-Stock

1+ parts

-

100+ parts

$4.400

1k+ parts

$3.938

10k+ parts

$3.700

113

-

$4.400

$3.938

$3.700

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,993 parts In-Stock

1+ parts

$3.220

100+ parts

-

1k+ parts

-

10k+ parts

-

3,993

$3.220

-

-

-

Vyrian

USA . 3,229 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,229

-

-

-

-

DigiKey Marketplace

USA . 113 parts In-Stock

1+ parts

-

100+ parts

$3.530

1k+ parts

-

10k+ parts

-

113

-

$3.530

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 2,252 parts In-Stock

1+ parts

$2.075

100+ parts

$192.740

1k+ parts

$1.868

10k+ parts

-

2,252

$2.075

$192.740

$1.868

-

DigiPath Technology Company

USA . 1,854 parts In-Stock

1+ parts

$2.285

100+ parts

-

1k+ parts

-

10k+ parts

-

1,854

$2.285

-

-

-

IDEA Electronic Components Group

UK . 1,840 parts In-Stock

1+ parts

$2.332

100+ parts

-

1k+ parts

$2.099

10k+ parts

-

1,840

$2.332

-

$2.099

-

ChromeModa Solutions

Germany . 549 parts In-Stock

1+ parts

$2.332

100+ parts

$1.912

1k+ parts

-

10k+ parts

-

549

$2.332

$1.912

-

-

Ampacity Inc.

Singapore . 171 parts In-Stock

1+ parts

$2.480

100+ parts

-

1k+ parts

-

10k+ parts

-

171

$2.480

-

-

-

Corphita

USA . 2,575 parts In-Stock

1+ parts

$3.051

100+ parts

-

1k+ parts

-

10k+ parts

-

2,575

$3.051

-

-

-

Authorized Procurement Solutions

USA . 10,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

10,000

-

-

-

-

Overview

Enhance your audio experience with the TAS5760LDAP by Texas Instruments. Known for their superior quality and expertise in manufacturing, Texas Instruments delivers a top-of-the-line Audio Control IC that offers unmatched performance and reliability. Perfect for a wide range of applications, this small outline, heat sink IC provides 21W of power with minimal noise interference. Elevate your sound system with the TAS5760LDAP and enjoy crystal-clear audio like never before.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Helps in reducing the overall weight of the IC, making it suitable for portable audio devices.

Surface Mount: YES

Enables easy and efficient mounting on circuit boards, saving space and improving manufacturability.

General IC Type: TONE CONTROL CIRCUIT

Provides precise control over the tone of audio output, allowing customization according to user preferences.

Maximum Operating Temperature: 85 °C

Ensures stable performance even in elevated temperature environments, making it reliable for various applications.

Minimum Operating Temperature: -25 °C

Operates effectively in low temperature conditions, expanding its usability in different scenarios.

Nominal Output Power: 21 W

Delivers sufficient power output for high-quality audio playback, suitable for speakers and amplifiers.

Width: 6.2 mm

Compact size allows for easy integration into small electronic devices without taking up much space.

Minimum Supply Voltage (Vsup): 4.5 V

Operates efficiently at low supply voltage levels, conserving energy and extending battery life in portable devices.

Nominal Noise Figure: 100 dB

Provides high signal-to-noise ratio, ensuring clear audio output without interference or distortion.

No. of Channels: 2

Supports stereo audio output, enabling a rich audio experience with balanced sound distribution.

Maximum Supply Voltage (Vsup): 16.5 V

Can handle higher supply voltage levels, offering flexibility in power input options for various audio setups.

Technical Specifications

Audio Control ICs TAS5760LDAP attributes and parameters. Explore more Audio Control ICs devices from Texas Instruments

Specs

General IC Type:

JESD-30 Code:

R-PDSO-G32

JESD-609 Code:

e4

Length:

11 mm

Moisture Sensitivity Level (MSL):

3

Nominal Noise Figure:

100 dB

No. of Channels:

2

No. of Functions:

1

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-25 Cel

Nominal Output Power:

21 W

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1.2 mm

Maximum Supply Voltage (Vsup):

16.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

6.2 mm

Trade Compliance

TAS5760LDAP General Purpose ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.33.00.01

SB

8542.33.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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