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TDA7052BN

NXP Semiconductors

TDA7052BN by NXP Semiconductors

NXP Semiconductors' TDA7052BN is an 8-terminal audio control IC with a rectangular package style. It operates b/w -40°C to 85°C, suitable for industrial applications. With a supply voltage range of 4.5V to 18V, it is commonly used in volume control circuits for various electronic devices.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

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Digiode

USA . 4,820 parts In-Stock

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Anansix

USA . 857 parts In-Stock

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Vyrian

USA . 302 parts In-Stock

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302

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Nova Conductors

Japan . 50 parts In-Stock

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50

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Ampacity Inc.

Singapore . 1,570 parts In-Stock

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$11.800

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$11.800

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One Stop Electronics

USA . 617 parts In-Stock

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$12.800

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617

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AZTECH Wire

Italy . 730 parts In-Stock

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$17.341

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730

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UNI Independent Distributors

Spain . 6,518 parts In-Stock

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Continental Prestige Electronics

USA . 4,645 parts In-Stock

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Argo Parts USA

USA . 4,068 parts In-Stock

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Corphita

USA . 2,088 parts In-Stock

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Bastille Electronics

Australia . 100 parts In-Stock

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Overview

Enhance your audio experience with the TDA7052BN from NXP Semiconductors! This high-quality Audio Control IC is designed to provide superior sound control in a compact package. Whether you're looking to upgrade your home entertainment system or enhance your car audio, this product offers unmatched value and benefits. With its durable construction and innovative design, the TDA7052BN is sure to impress even the most discerning audio enthusiasts. Experience the difference today and take your audio to the next level!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the package lightweight and durable, perfect for audio control ICs that may be used in a variety of devices.

No. of Terminals: 8

Having 8 terminals allows for more connectivity options and flexibility in circuit design, making this product suitable for a range of audio control applications.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature of 85°C, this IC can withstand extended use in various environments without overheating.

Minimum Supply Voltage (Vsup): 4.5 V

The low minimum supply voltage requirement of 4.5 V ensures compatibility with a wide range of power sources, making this IC versatile for different applications.

Temperature Grade: INDUSTRIAL

Designed for industrial use, this audio control IC is built to withstand harsh conditions and provide reliable performance in demanding environments.

Technical Specifications

Audio Control ICs TDA7052BN attributes and parameters. Explore more Audio Control ICs devices from NXP Semiconductors

Specs

General IC Type:

JESD-30 Code:

R-PDIP-T8

Length:

9.5 mm

No. of Terminals:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Shape:

Package Style (Meter):

IN-LINE

Qualification:

Not Qualified

Maximum Seated Height:

4.2 mm

Maximum Supply Voltage (Vsup):

18 V

Minimum Supply Voltage (Vsup):

4.5 V

Surface Mount:

NO

Temperature Grade:

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Width:

7.62 mm

Trade Compliance

TDA7052BN General Purpose ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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