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HPA00929RTJR

Texas Instruments

HPA00929RTJR by Texas Instruments

Texas Instruments HPA00929RTJR is a Volume Control Circuit IC with 20 terminals in a square chip carrier package. Operating temperature range from -40 to 85°C, suitable for industrial applications. Features include 2 channels, 0.138W output power, and surface mount compatibility.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,925 parts In-Stock

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3,925

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Digiode

USA . 1,537 parts In-Stock

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1,537

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Distributors (Availability)

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Parana Technologies

USA . 2,134 parts In-Stock

1+ parts

$0.946

100+ parts

-

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$1.851

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2,134

$0.946

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$1.851

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DigiPath Technology Company

USA . 921 parts In-Stock

1+ parts

$1.042

100+ parts

$0.958

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-

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921

$1.042

$0.958

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ChromeModa Solutions

Germany . 6,182 parts In-Stock

1+ parts

$1.063

100+ parts

$0.872

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6,182

$1.063

$0.872

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IDEA Electronic Components Group

UK . 939 parts In-Stock

1+ parts

$1.063

100+ parts

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$0.957

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939

$1.063

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$0.957

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AZTECH Wire

Italy . 781 parts In-Stock

1+ parts

$10.065

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781

$10.065

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One Stop Electronics

USA . 186 parts In-Stock

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$12.800

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186

$12.800

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A-Z Elektronik GmbH

Germany . 6,575 parts In-Stock

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6,575

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Alle Elektronik GmbH

Germany . 4,383 parts In-Stock

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Corphita

USA . 4,023 parts In-Stock

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4,023

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Microchip USA

USA . 1,044 parts In-Stock

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Kepictronics

USA . 39 parts In-Stock

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Overview

Unlock the power of superior audio control with the HPA00929RTJR by Texas Instruments. Designed with cutting-edge technology and precision engineering, this volume control circuit offers unrivaled quality and performance in a compact chip carrier package. Ideal for a wide range of applications, from consumer electronics to industrial equipment, this Audio Control IC provides crystal-clear sound and seamless volume adjustments. Trust in Texas Instruments' expertise and innovation to elevate your audio experience. Elevate your products with the HPA00929RTJR, where quality meets excellence.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic material makes the package lightweight and durable, ensuring long-term reliability.

Surface Mount: YES

Surface mount capability allows for easy and convenient installation on PCBs.

Package Shape: SQUARE

Square shape simplifies PCB layout and integration into compact designs.

General IC Type: VOLUME CONTROL CIRCUIT

Specifically designed for volume control applications, ensuring optimal performance in audio systems.

No. of Terminals: 20

Sufficient number of terminals for connecting various components and interfaces.

Package Style: CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Innovative package style design facilitates efficient heat dissipation and compact circuit designs.

Maximum Operating Temperature: 85 °C

High operating temperature range allows for reliable performance in varying environmental conditions.

Minimum Operating Temperature: -40 °C

Wide temperature range ensures functionality even in extreme cold conditions.

Terminal Finish: Nickel/Palladium/Gold (Ni/Pd/Au)

High-quality terminal finish for enhanced conductivity and corrosion resistance.

Terminal Position: QUAD

Quad terminal position enables easy connection and soldering on PCB.

Nominal Output Power: 0.138 W

Optimal output power for driving audio signals efficiently.

Maximum Seated Height: 0.8 mm

Low profile design for space-saving installation in compact devices.

Width: 4 mm

Compact width for easy integration into narrow PCB layouts.

Minimum Supply Voltage (Vsup): 2.5 V

Low minimum supply voltage requirement for energy-efficient operation.

Peak Reflow Temperature °C: 260

High peak reflow temperature tolerance for reliable soldering during manufacturing.

Length: 4 mm

Compact length for space-constrained applications.

Temperature Grade: INDUSTRIAL

Designed to withstand industrial temperature conditions for versatile use cases.

No. of Channels: 2

Dual channels for stereo audio output capability.

Terminal Form: NO LEAD

Lead-free terminal form for environmental compliance and safety.

Maximum Supply Current: 2.5 mA

Low supply current requirement for efficient power consumption.

Terminal Pitch: 0.5 mm

Fine terminal pitch for precise connections in compact circuit designs.

Moisture Sensitivity Level (MSL): 2

MSL 2 rating indicates moderate sensitivity to moisture, suitable for controlled environments.

Maximum Supply Voltage (Vsup): 5.5 V

Safe maximum supply voltage for stable and reliable operation.

Technical Specifications

Audio Control ICs HPA00929RTJR attributes and parameters. Explore more Audio Control ICs devices from Texas Instruments

Specs

General IC Type:

JESD-30 Code:

S-PQCC-N20

JESD-609 Code:

e4

Length:

4 mm

Moisture Sensitivity Level (MSL):

2

No. of Channels:

2

No. of Functions:

1

No. of Terminals:

20

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Nominal Output Power:

.138 W

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Maximum Seated Height:

.8 mm

Maximum Supply Current:

2.5 mA

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

2.5 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

4 mm

Trade Compliance

HPA00929RTJR General Purpose ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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