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HPA02284RTJR

Texas Instruments

HPA02284RTJR by Texas Instruments

Texas Instruments' HPA02284RTJR is a volume control circuit in a square chip carrier package. With 20 terminals, it operates at -40 to 85°C and supports power supplies of 3/5V. Ideal for industrial applications requiring audio control ICs with surface mount capabilities.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,296 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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4,296

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Vyrian

USA . 2,793 parts In-Stock

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2,793

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 1,374 parts In-Stock

1+ parts

$0.531

100+ parts

$49.342

1k+ parts

$0.478

10k+ parts

-

1,374

$0.531

$49.342

$0.478

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DigiPath Technology Company

USA . 1,931 parts In-Stock

1+ parts

$0.585

100+ parts

$0.538

1k+ parts

-

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1,931

$0.585

$0.538

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ChromeModa Solutions

Germany . 2,238 parts In-Stock

1+ parts

$0.597

100+ parts

$0.490

1k+ parts

-

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2,238

$0.597

$0.490

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IDEA Electronic Components Group

UK . 1,911 parts In-Stock

1+ parts

$0.597

100+ parts

-

1k+ parts

$0.537

10k+ parts

-

1,911

$0.597

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$0.537

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AZTECH Wire

Italy . 891 parts In-Stock

1+ parts

$4.943

100+ parts

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891

$4.943

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One Stop Electronics

USA . 384 parts In-Stock

1+ parts

$6.800

100+ parts

-

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384

$6.800

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A-Z Elektronik GmbH

Germany . 6,752 parts In-Stock

1+ parts

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6,752

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Corphita

USA . 4,951 parts In-Stock

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4,951

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Alle Elektronik GmbH

Germany . 4,501 parts In-Stock

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4,501

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Overview

Elevate your audio experience with the HPA02284RTJR by Texas Instruments, a top-of-the-line volume control circuit designed to deliver unparalleled sound quality and precision. Manufactured by industry leader Texas Instruments, this audio control IC boasts a durable plastic/epoxy body and a convenient square package shape for easy installation. Perfect for a wide range of applications, this chip carrier-style IC offers optimal performance in industrial settings, with a temperature range of -40°C to 85°C. Upgrade your audio system today with the HPA02284RTJR and enjoy premium sound control like never before.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic material makes the product lightweight and durable, ideal for portable electronic devices.

Surface Mount: YES

Surface mount capability allows for easy and efficient installation on circuit boards.

General IC Type: VOLUME CONTROL CIRCUIT

Designed specifically for volume control applications, ensuring precise and reliable audio adjustments.

Power Supplies (V): 3/5

Compatible with both 3V and 5V power supplies, providing flexibility in design and compatibility with various systems.

No. of Terminals: 20

Sufficient number of terminals for connectivity and functionality in audio control circuitry.

Maximum Operating Temperature: 85 °C

High maximum operating temperature allows for reliable performance even in demanding industrial environments.

Minimum Operating Temperature: -40 °C

Wide range of operating temperatures ensures the IC can function in extreme cold conditions without malfunctioning.

Terminal Finish: NICKEL PALLADIUM GOLD

Durable terminal finish for long-lasting connections and resistance to corrosion.

Terminal Pitch: 0.5 mm

Fine terminal pitch allows for precise soldering and compact layout on the circuit board.

Moisture Sensitivity Level (MSL): 2

Low moisture sensitivity level ensures reliability and performance even in humid conditions.

Technical Specifications

Audio Control ICs HPA02284RTJR attributes and parameters. Explore more Audio Control ICs devices from Texas Instruments

Specs

General IC Type:

JESD-30 Code:

S-PQCC-N20

JESD-609 Code:

e4

Moisture Sensitivity Level (MSL):

2

No. of Functions:

1

No. of Terminals:

20

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC20,.16SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER

Peak Reflow Temperature (C):

260

Power Supplies (V):

3/5

Qualification:

Not Qualified

Sub-Category:

Audio/Video Amplifiers

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Trade Compliance

HPA02284RTJR General Purpose ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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