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HPA00929YZHR

Texas Instruments

HPA00929YZHR by Texas Instruments

Texas Instruments' HPA00929YZHR is a Volume Control Circuit IC with 2 channels, operating b/w -40 to 85°C. It features a grid array package style, surface mount compatibility, and low supply current of 2.5mA. Ideal for audio control applications requiring precise volume adjustments in compact setups.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,752 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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6,752

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Digiode

USA . 2,850 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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2,850

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 1,323 parts In-Stock

1+ parts

$1.347

100+ parts

-

1k+ parts

$2.076

10k+ parts

-

1,323

$1.347

-

$2.076

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DigiPath Technology Company

USA . 526 parts In-Stock

1+ parts

$1.483

100+ parts

$1.364

1k+ parts

-

10k+ parts

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526

$1.483

$1.364

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ChromeModa Solutions

Germany . 4,975 parts In-Stock

1+ parts

$1.513

100+ parts

$1.241

1k+ parts

-

10k+ parts

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4,975

$1.513

$1.241

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IDEA Electronic Components Group

UK . 1,045 parts In-Stock

1+ parts

$1.513

100+ parts

-

1k+ parts

$1.362

10k+ parts

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1,045

$1.513

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$1.362

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One Stop Electronics

USA . 1,609 parts In-Stock

1+ parts

$15.800

100+ parts

-

1k+ parts

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10k+ parts

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1,609

$15.800

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AZTECH Wire

Italy . 633 parts In-Stock

1+ parts

$17.708

100+ parts

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1k+ parts

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633

$17.708

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Corphita

USA . 306 parts In-Stock

1+ parts

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306

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Overview

Elevate your audio experience with the HPA00929YZHR by Texas Instruments, a cutting-edge Audio Control IC that delivers superior quality and performance. Crafted by a renowned manufacturer, this volume control circuit offers unmatched precision and reliability for a wide range of applications. With its sleek square package body and advanced features, this product provides customers with exceptional value, seamless integration, and unparalleled sound control. Upgrade your audio systems today with the HPA00929YZHR and elevate your listening experience to new heights.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material combination provides durability and protection for the IC, making it suitable for a variety of applications.

Surface Mount: YES

Surface mount technology allows for easy installation and space-saving on PCBs.

Package Shape: SQUARE

Square package shape ensures easy handling and placement during assembly.

General IC Type: VOLUME CONTROL CIRCUIT

The volume control circuit offers precise and efficient control over audio levels.

No. of Terminals: 16

Having 16 terminals allows for versatile connectivity options and functionality.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, this IC can withstand and perform well in varying environmental conditions.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature ensures reliable performance even in cold environments.

Terminal Finish: TIN SILVER COPPER

The terminal finish of tin, silver, and copper offers excellent conductivity and corrosion resistance.

Maximum Seated Height: 0.625 mm

The low seated height allows for compact and space-efficient PCB designs.

Width: 1.938 mm

The narrow width enables efficient placement and routing of traces on the PCB.

Minimum Supply Voltage (Vsup): 2.5 V

Low minimum supply voltage ensures power efficiency and compatibility with a wide range of systems.

Maximum Time At Peak Reflow Temperature (s): 30

The maximum time at peak reflow temperature ensures proper soldering and reliability during manufacturing.

Peak Reflow Temperature °C: 260

The peak reflow temperature of 260°C ensures proper soldering and durability of the IC.

Length: 1.938 mm

The short length of the IC contributes to a compact overall design of the product.

No. of Channels: 2

Having two channels allows for stereo audio control, enhancing the listening experience.

Terminal Form: BALL

The ball terminal form provides secure connections, ensuring reliable signal transmission.

Maximum Supply Current: 2.5 mA

Low maximum supply current ensures power efficiency and minimal power consumption.

Terminal Pitch: 0.5 mm

Fine terminal pitch enables high-density mounting and efficient use of PCB space.

Maximum Supply Voltage (Vsup): 5.5 V

High maximum supply voltage allows for compatibility with a wide range of power sources and systems.

Technical Specifications

Audio Control ICs HPA00929YZHR attributes and parameters. Explore more Audio Control ICs devices from Texas Instruments

Specs

General IC Type:

JESD-30 Code:

S-PBGA-B16

JESD-609 Code:

e1

Length:

1.938 mm

Moisture Sensitivity Level (MSL):

1

No. of Channels:

2

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA16,4X4,20

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Maximum Seated Height:

.625 mm

Maximum Supply Current:

2.5 mA

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

2.5 V

Surface Mount:

YES

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

1.938 mm

Trade Compliance

HPA00929YZHR General Purpose ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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