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TDA8552TS

NXP Semiconductors

TDA8552TS by NXP Semiconductors

VOLUME CONTROL CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 20; Package Code: SOP; Package Shape: RECTANGULAR;

Median Price

-

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,322 parts In-Stock

1+ parts

-

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3,322

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Digiode

USA . 2,347 parts In-Stock

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2,347

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Anansix

USA . 2,132 parts In-Stock

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2,132

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Pegasus Components GmbH

Germany . 58 parts In-Stock

1+ parts

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58

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

One Stop Electronics

USA . 884 parts In-Stock

1+ parts

$7.800

100+ parts

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884

$7.800

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Authorized Procurement Solutions

USA . 25,000 parts In-Stock

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25,000

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GreenTree Electronics

Israel . 15,000 parts In-Stock

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15,000

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Corphita

USA . 4,454 parts In-Stock

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4,454

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Kepictronics

USA . 1,980 parts In-Stock

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1,980

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UNI Independent Distributors

Spain . 1,700 parts In-Stock

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1,700

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ChipstoGo Electronic ltd

UK . 600 parts In-Stock

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600

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Perfect Parts

USA . 44 parts In-Stock

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44

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Technical Specifications

Audio Control ICs TDA8552TS attributes and parameters. Explore more Audio Control ICs devices from NXP Semiconductors

Specs

Channel Separation:

55 dB

General IC Type:

Harmonic Distortion:

.1 %

JESD-30 Code:

R-PDSO-G20

No. of Channels:

2

No. of Functions:

1

No. of Terminals:

20

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SSOP20,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Sub-Category:

Audio/Video Amplifiers

Maximum Supply Current:

20 mA

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

2.7 V

Surface Mount:

YES

Temperature Grade:

Terminal Form:

Terminal Pitch:

.635 mm

Terminal Position:

DUAL

Trade Compliance

TDA8552TS General Purpose ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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