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LM4936MHX

Texas Instruments

LM4936MHX by Texas Instruments

LM4936MHX by Texas Instruments is a volume control circuit with 2 channels and 63 dB channel separation. Operating b/w -40 to 85°C, it requires 2.7-5.5V supplies and has a max supply current of 25mA. Ideal for audio applications needing precise volume control in compact designs.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,854 parts In-Stock

1+ parts

-

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7,854

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Digiode

USA . 4,984 parts In-Stock

1+ parts

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4,984

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Anansix

USA . 2,261 parts In-Stock

1+ parts

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2,261

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 1,896 parts In-Stock

1+ parts

$3.403

100+ parts

-

1k+ parts

$3.928

10k+ parts

-

1,896

$3.403

-

$3.928

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DigiPath Technology Company

USA . 455 parts In-Stock

1+ parts

$3.748

100+ parts

$3.448

1k+ parts

-

10k+ parts

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455

$3.748

$3.448

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ChromeModa Solutions

Germany . 5,628 parts In-Stock

1+ parts

$3.824

100+ parts

$3.136

1k+ parts

-

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5,628

$3.824

$3.136

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IDEA Electronic Components Group

UK . 883 parts In-Stock

1+ parts

$3.824

100+ parts

-

1k+ parts

$3.442

10k+ parts

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883

$3.824

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$3.442

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One Stop Electronics

USA . 314 parts In-Stock

1+ parts

$4.800

100+ parts

-

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314

$4.800

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AZTECH Wire

Italy . 800 parts In-Stock

1+ parts

$16.890

100+ parts

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800

$16.890

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Alle Elektronik GmbH

Germany . 4,415 parts In-Stock

1+ parts

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4,415

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Corphita

USA . 2,539 parts In-Stock

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2,539

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Overview

Enhance your audio experience with the LM4936MHX by Texas Instruments, a cutting-edge Audio Control IC designed for superior performance in various applications. With Texas Instruments' renowned reputation for quality and innovation, this product offers unmatched value and benefits to customers. Whether you're looking to enhance sound quality in consumer electronics or communication devices, this volume control circuit delivers exceptional channel separation and efficient power supplies. Trust Texas Instruments to provide top-of-the-line technology that caters to all your audio needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is durable and lightweight, making the product ideal for portable or compact applications.

Surface Mount: YES

Allows for easy and convenient installation on a PCB, saving space and simplifying assembly.

General IC Type: VOLUME CONTROL CIRCUIT

Specifically designed for volume control, ensuring accurate and reliable audio adjustments.

Channel Separation: 63 dB

High channel separation ensures clear and distinct audio signals for each channel, resulting in superior sound quality.

Power Supplies (V): 3/5

Compatible with a range of power supplies, providing flexibility in system design and integration.

No. of Terminals: 28

Sufficient number of terminals for connectivity and functionality, allowing for versatile circuit configurations.

Maximum Operating Temperature: 85 °C

Withstands high temperatures, making it suitable for industrial and automotive applications where heat may be a factor.

Minimum Operating Temperature: -40 °C

Capable of operating in extreme cold conditions, ensuring reliable performance in a variety of environments.

Terminal Finish: TIN LEAD

Provides a reliable and durable finish for the terminals, enhancing the product's overall lifespan and performance.

No. of Channels: 2

Supports stereo audio, enabling dual-channel audio processing for enhanced sound experience.

Technical Specifications

Audio Control ICs LM4936MHX attributes and parameters. Explore more Audio Control ICs devices from Texas Instruments

Specs

Channel Separation:

63 dB

General IC Type:

JESD-30 Code:

R-PDSO-G28

JESD-609 Code:

e0

Length:

9.7 mm

Moisture Sensitivity Level (MSL):

1

No. of Channels:

2

No. of Functions:

1

No. of Terminals:

28

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP28,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

3/5

Qualification:

Not Qualified

Maximum Seated Height:

1.1 mm

Sub-Category:

Audio/Video Amplifiers

Maximum Supply Current:

25 mA

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

2.7 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Width:

4.4 mm

Trade Compliance

LM4936MHX General Purpose ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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