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LM4841MH

Texas Instruments

LM4841MH by Texas Instruments

LM4841MH by Texas Instruments is a Volume Control Circuit with 65 dB Channel Separation, suitable for industrial applications. It operates at temperatures ranging from -40 to 85°C and requires a supply voltage of 2.7-5.5V, drawing a max current of 30mA. This Audio Control IC comes in a small outline package with dual terminals and gull wing form factor, making it ideal for compact audio systems.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,429 parts In-Stock

1+ parts

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5,429

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Anansix

USA . 1,900 parts In-Stock

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1,900

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Digiode

USA . 356 parts In-Stock

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356

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 2,186 parts In-Stock

1+ parts

$0.203

100+ parts

-

1k+ parts

$1.519

10k+ parts

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2,186

$0.203

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$1.519

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IDEA Electronic Components Group

UK . 553 parts In-Stock

1+ parts

$0.228

100+ parts

-

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$0.205

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553

$0.228

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$0.205

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ChromeModa Solutions

Germany . 531 parts In-Stock

1+ parts

$0.228

100+ parts

$0.187

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531

$0.228

$0.187

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One Stop Electronics

USA . 490 parts In-Stock

1+ parts

$7.800

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490

$7.800

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AZTECH Wire

Italy . 894 parts In-Stock

1+ parts

$8.624

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894

$8.624

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Assy Fe

Spain . 29,222 parts In-Stock

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29,222

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Corphita

USA . 4,093 parts In-Stock

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4,093

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Alle Elektronik GmbH

Germany . 3,910 parts In-Stock

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3,910

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DigiPath Technology Company

USA . 1,555 parts In-Stock

1+ parts

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100+ parts

$0.206

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1,555

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$0.206

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Overview

Elevate your audio experience with the LM4841MH by Texas Instruments, a top-notch Audio Control IC that promises unmatched quality and performance. Designed with precision and expertise, this product boasts superior channel separation and a wide temperature range for industrial applications. With a small outline package and dual terminal position, it offers convenience and versatility in installation. Whether you're looking to enhance your sound system at home or in a professional setting, the LM4841MH delivers exceptional value and benefits that will elevate your listening experience. Choose Texas Instruments for reliability and innovation in audio control technology.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection to the internal components, making the product reliable for long-term use.

Surface Mount: YES

This feature allows for easy installation on circuit boards, saving time and effort during assembly.

Channel Separation: 65 dB

High channel separation ensures clear and distinct audio signals, enhancing the overall sound quality.

No. of Terminals: 28

Having a sufficient number of terminals allows for connectivity to various other components, enabling versatility in system design.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, the product can withstand demanding environmental conditions without performance degradation.

Minimum Operating Temperature: -40 °C

The wide temperature range ensures the product remains functional even in extreme cold environments.

Width: 4.4 mm

The compact width of the package allows for space-efficient integration in compact electronic devices.

No. of Channels: 2

Dual channels provide stereo audio output, offering a more immersive listening experience.

Technical Specifications

Audio Control ICs LM4841MH attributes and parameters. Explore more Audio Control ICs devices from Texas Instruments

Specs

Channel Separation:

65 dB

General IC Type:

JESD-30 Code:

R-PDSO-G28

JESD-609 Code:

e0

Length:

9.7 mm

Moisture Sensitivity Level (MSL):

1

No. of Channels:

2

No. of Functions:

1

No. of Terminals:

28

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP28,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

3/5

Qualification:

Not Qualified

Maximum Seated Height:

1.1 mm

Sub-Category:

Audio/Video Amplifiers

Maximum Supply Current:

30 mA

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

2.7 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

Tin/Lead (Sn85Pb15)

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

40

Width:

4.4 mm

Trade Compliance

LM4841MH General Purpose ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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