Loading...

TDA7309D013TR

STMicroelectronics

TDA7309D013TR by STMicroelectronics

TDA7309D013TR by STMicroelectronics is a dual-channel audio control IC designed for volume management. It features 100 dB channel separation, 0.01% harmonic distortion, and operates within a supply voltage of 6-10 V. Ideal for industrial audio applications, it ensures high performance in compact designs.

Median Price

$2.038

Lifecycle Status

Suppliers In-Stock

9

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Chip Stock

USA . 9,500 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

9,500

-

-

-

-

Vyrian

USA . 8,212 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

8,212

-

-

-

-

Digiode

USA . 3,083 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,083

-

-

-

-

ComSIT Distribution GmbH

Germany . 3,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,000

-

-

-

-

ComSIT USA

USA . 3,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,000

-

-

-

-

Anansix

USA . 2,415 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,415

-

-

-

-

Lakeland Logistics Inc

USA . 962 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

962

-

-

-

-

Bristol Electronics

USA . 876 parts In-Stock

1+ parts

-

100+ parts

$2.038

1k+ parts

$1.791

10k+ parts

-

876

-

$2.038

$1.791

-

Q Components

USA . 440 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

440

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 365 parts In-Stock

1+ parts

$2.360

100+ parts

-

1k+ parts

$2.124

10k+ parts

-

365

$2.360

-

$2.124

-

Microchip USA

USA . 373 parts In-Stock

1+ parts

$3.624

100+ parts

-

1k+ parts

-

10k+ parts

-

373

$3.624

-

-

-

MKK Technologies

India . 96 parts In-Stock

1+ parts

$4.437

100+ parts

-

1k+ parts

-

10k+ parts

-

96

$4.437

-

-

-

DigiPath Technology Company

USA . 96 parts In-Stock

1+ parts

$4.437

100+ parts

-

1k+ parts

-

10k+ parts

-

96

$4.437

-

-

-

AZTECH Wire

Italy . 392 parts In-Stock

1+ parts

$10.460

100+ parts

-

1k+ parts

-

10k+ parts

-

392

$10.460

-

-

-

Perfect Parts

USA . 9,060 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

9,060

-

-

-

-

A-Z Elektronik GmbH

Germany . 6,024 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

6,024

-

-

-

-

Authorized Procurement Solutions

USA . 4,500 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,500

-

-

-

-

Kepictronics

USA . 4,500 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,500

-

-

-

-

Corphita

USA . 2,765 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,765

-

-

-

-

Cyclops Electronics Ltd (Excess)

UK . 1,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,000

-

-

-

-

Parana Technologies

USA . 537 parts In-Stock

1+ parts

-

100+ parts

$2.822

1k+ parts

-

10k+ parts

-

537

-

$2.822

-

-

Overview

Elevate your audio experience with the TDA7309D013TR from STMicroelectronics, a leader in innovative semiconductor solutions. This premium audio control IC ensures crystal-clear sound and exceptional channel separation, enhancing any audio application from home theaters to professional audio systems. Built for reliability and efficiency, its robust design guarantees performance even in demanding environments, making it the ideal choice for quality-conscious customers seeking durability and excellence.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of durable plastic/epoxy enhances product longevity and reliability in various environments.

Surface Mount: YES

Surface mount technology allows for compact design and efficient use of PCB space, making it ideal for space-constrained applications.

Package Shape: RECTANGULAR

A rectangular shape optimizes layout flexibility and can fit into various design configurations.

General IC Type: VOLUME CONTROL CIRCUIT

Specified as a volume control circuit, it directly addresses audio management needs, making it suitable for audio applications.

Channel Separation: 100 dB

High channel separation ensures minimal crosstalk, providing high-quality audio performance.

Harmonic Distortion: 0.01 %

Low harmonic distortion guarantees clearer audio reproduction, enhancing the overall listening experience.

Power Supplies (V): 9

Operating at a standard voltage of 9V makes it easy to integrate into various systems with minimal adjustments.

No. of Terminals: 20

With 20 terminals, it offers ample connectivity options for versatile circuit integration.

Package Style (Meter): SMALL OUTLINE

The small outline package style supports high-density mounting, ideal for modern electronic designs.

Maximum Operating Temperature: 85 °C

A high maximum operating temperature ensures reliability in warm environments, suitable for industrial applications.

Minimum Operating Temperature: -40 °C

Can operate in extreme cold conditions, making it suitable for outdoor and harsh environments.

Terminal Finish: MATTE TIN

Matte tin terminal finish offers excellent solderability and corrosion resistance, enhancing connection reliability.

Terminal Position: DUAL

Dual terminal positioning facilitates easier routing in circuit designs, optimizing layout.

Maximum Seated Height: 2.65 mm

Short height profile allows for low-profile designs, contributing to thinner product designs.

Width: 7.5 mm

Compact width allows for space-efficient designs while maintaining performance integrity.

Minimum Supply Voltage (Vsup): 6 V

A low minimum supply voltage allows for flexibility in powering the device across a range of applications.

Length: 12.8 mm

Short length enhances options for miniaturized circuit designs.

Temperature Grade: INDUSTRIAL

Industrial temperature grade assures durability across a wide temperature range, ideal for rigorous applications.

No. of Channels: 2

Having two channels is perfect for stereo applications, fulfilling essential audio requirements.

Technology: BICMOS

BICMOS technology combines features of bipolar and CMOS, resulting in high performance and low power consumption.

Terminal Form: GULL WING

Gull wing terminals enhance soldering and reliability during assembly, ensuring strong electrical connections.

Maximum Supply Current: 10 mA

Low supply current makes it energy efficient, helping to extend the battery life in portable applications.

Terminal Pitch: 1.27 mm

A 1.27 mm terminal pitch is standard for many boards, easing integration into existing designs.

Maximum Supply Voltage (Vsup): 10 V

Maximum supply voltage of 10V provides a robust operating range for varied audio applications.

Technical Specifications

Audio Control ICs TDA7309D013TR attributes and parameters. Explore more Audio Control ICs devices from STMicroelectronics

Specs

Channel Separation:

100 dB

General IC Type:

Harmonic Distortion:

.01 %

JESD-30 Code:

R-PDSO-G20

JESD-609 Code:

e3

Length:

12.8 mm

No. of Channels:

2

No. of Functions:

1

No. of Terminals:

20

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP20,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Power Supplies (V):

9

Qualification:

Not Qualified

Maximum Seated Height:

2.65 mm

Sub-Category:

Audio Control ICs

Maximum Supply Current:

10 mA

Maximum Supply Voltage (Vsup):

10 V

Minimum Supply Voltage (Vsup):

6 V

Surface Mount:

YES

Technology:

BICMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width:

7.5 mm

Trade Compliance

TDA7309D013TR General Purpose ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

Similar products 20