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LC75412E

Onsemi

LC75412E by Onsemi

LC75412E by Onsemi is an Audio Control IC with 64 terminals, operating b/w -40 to 85 °C. It has a power supply of 9V and consumes a max current of 60mA. Ideal for industrial applications, this CMOS technology IC comes in a square-shaped plastic/epoxy package suitable for surface mounting.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

< 1k

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Digiode

USA . 608 parts In-Stock

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Vyrian

USA . 138 parts In-Stock

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SupplyDigital Components

Austria . 8,201 parts In-Stock

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TANS Electronics

Latvia . 6,578 parts In-Stock

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Problanco Electronics

Mexico . 6,379 parts In-Stock

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Kulean Microsystems

USA . 3,704 parts In-Stock

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Corphita

USA . 2,038 parts In-Stock

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UHIMA Technologies

Türkiye . 644 parts In-Stock

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Corohmni

South Africa . 109 parts In-Stock

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Overview

Unlock the power of audio control with the LC75412E by Onsemi. Crafted with precision and expertise, this innovative product offers unparalleled quality and reliability. Designed for a wide range of applications in the audio industry, this cutting-edge technology provides customers with exceptional value and benefits. Elevate your audio experience with the LC75412E and enjoy the advantages that only Onsemi can deliver.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material provides durability and protection to the internal components of the IC, ensuring longevity and reliability.

Surface Mount: YES

Surface mount technology allows for easy installation on PCBs, saving space and enabling efficient assembly processes.

Package Shape: SQUARE

Square package shape facilitates easier placement and alignment on the PCB, enhancing overall board layout and design.

Power Supplies (V): 9

Operating at 9V voltage supply allows for compatibility with a wide range of power sources, making it versatile for different applications.

No. of Terminals: 64

Having 64 terminals provides ample connectivity options for interfacing with external components, enabling versatile functionality.

Package Style (Meter): FLATPACK

Flatpack package style offers a low profile design, allowing for compact integration into electronic systems with limited space.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature of 85 °C, the IC can withstand heat without performance degradation, ensuring reliability in harsh environments.

Minimum Operating Temperature: -40 °C

With a low minimum operating temperature of -40 °C, the IC remains functional in cold conditions, making it suitable for a wide range of operating environments.

Terminal Position: QUAD

Quad terminal position provides multiple contact points for stable connections and improved signal transmission, enhancing overall performance.

Temperature Grade: INDUSTRIAL

Industrial temperature grade ensures the IC can operate reliably in harsh industrial settings with varying temperature conditions.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the IC energy-efficient and reliable for audio control applications.

Terminal Form: GULL WING

Gull wing terminal form enables easy soldering and secure attachment to the PCB, ensuring stable electrical connections for optimal performance.

Maximum Supply Current: 60 mA

Operating with a maximum supply current of 60 mA ensures efficient power usage, reducing energy consumption and heat generation for improved reliability.

Terminal Pitch: 0.8 mm

With a terminal pitch of 0.8 mm, the IC offers precise spacing for connections, enabling compact designs and efficient signal routing on the PCB.

Technical Specifications

Audio Control ICs LC75412E attributes and parameters. Explore more Audio Control ICs devices from Onsemi

Specs

JESD-30 Code:

S-PQFP-G64

No. of Terminals:

64

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

QFP

Package Equivalence Code:

QFP64,.66SQ,32

Package Shape:

Package Style (Meter):

FLATPACK

Power Supplies (V):

9

Qualification:

Not Qualified

Sub-Category:

Audio Control ICs

Maximum Supply Current:

60 mA

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

QUAD

Trade Compliance

LC75412E General Purpose ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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